XC6120 Series ETR0209-009 Highly Accurate, Ultra Small, Low Power Consumption Voltage Detector ■GENERAL DESCRIPTION The XC6120 series are highly precise, low power consumption voltage detectors, manufactured using CMOS and laser trimming technologies. With low power consumption and high accuracy, the series is suitable for precision mobile equipment. The XC6120 in ultra small packages are ideally suited for high-density mounting. The XC6120 is available in both CMOS and N-channel open drain output configurations. ■APPLICATIONS ■FEATURES ●Microprocessor reset circuitry ●Memory battery back-up circuits ●Power-on reset circuits ●Power failure detection ●System battery life and charge voltage monitors : ± 2% (VDF≧1.5V) : ± 30mV (VDF<1.5V) Low Power Consumption : 0.6μA [VDF=2.7V, VIN=2.97V] Detect Voltage Range : 1.0V ~ 5.0V (0.1V increments) Operating Voltage Range : 0.7V ~ 6.0V Detect Voltage Temperature Characteristics : ±100ppm/℃ (TYP.) Output Configuration : CMOS (XC6120C) : N-channel open drain (XC6120N) Operating Temperature Range : -40℃~85℃ Packages : USP-3, SSOT-24 Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT Highly Accurate ■ TYPICAL PERFORMANCE CHARACTERISTICS ●Supply Current vs. Input Voltage XC6120x272xx (Unused for the CMOS output products) SupplyCurrent: Current: ISS (μA) Supply ISS (μA) 3.5 Ta= 85℃ 25℃ -40℃ 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 Input Voltage: VIN (V) 1/13 XC6120 Series ■PIN CONFIGURATION VIN VOUT NC VSS VSS VOUT VIN SSOT-24 (TOP VIEW) USP-3 (BOTTOM VIEW) ■PIN ASSIGNMENT PIN NUMBER USP-3 SSOT-24 PIN NAME FUNCTION 4 2 VIN VSS Power Input Ground 2 3 VOUT Output (Detect ”Low” ) - 1 NC No Connection 1 3 ■PRODUCT CLASSIFICATION ●Ordering Information XC6120①②③④⑤⑥-⑦(*1) DESIGNATOR ITEM ① Output Configuration ②③ ④ Detect Voltage (VDF) Detect Accuracy ⑤⑥-⑦(*1) Packages (Order Unit) (*1) SYMBOL C N 10~50 2 HR HR-G NR NR-G DESCRIPTION CMOS output N-ch open drain output For example 1.0V → ②1, ③0 ±2% USP-3 (3,000/Reel) USP-3 (3,000/Reel) SSOT-24 (3,000/Reel) SSOT-24 (3,000/Reel) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. ■BLOCK DIAGRAMS (1) XC6120C 2/13 (2) XC6120N XC6120 Series ■ABSOLUTE MAXIMUM RATINGS Ta=25℃ Output Voltage PARAMETER SYMBOL RATING UNITS Input Voltage VIN IOUT VSS-0.3~7.0 V mA Output Current CMOS Output 10 VSS-0.3~VIN+0.3 VOUT Operating Temperature Range Topr VSS-0.3~7.0 120 150 -40~+85 Storage Temperature Range Tstg -55~+125 N-ch Open Drain Output USP-3 SSOT-24 Power Dissipation Pd V mW ℃ ℃ ■ELECTRICAL CHARACTERISTICS XC6120 Series Ta=25℃ PARAMETER SYMBOL CONDITION MIN. TYP. MAX. UNITS CIRCUIT Operating Voltage VIN VDF(T)=1.0～5.0V (*1) 0.7 - 6.0 V - Detect Voltage VDF VDF(T)=1.0V～5.0V V ① Hysteresis Width VHYS VDF(T)=1.0V～5.0V V ① Supply Current 1 ISS1 VIN=VDF(T)×1.1 E-2 μA ② Supply Current 2 ISS2 VIN= VDF(T)×0.9V E-3 μA ② mA ③ mA ③ μA ③ VOUT=0.5V VOUT=0.3V VOUT=0.1V VOUT=0.1V, VDF(T)＞1.0V VOUT=0.1V, VDF(T)＞2.0V VOUT=0.1V, VDF(T)＞3.0V VOUT=0.1V, VDF(T)＞4.0V VOUT=5.5V IOUTN IOUTP (*2) CMOS Leakage Output(Pch) Current N-ch Open Drain Detect Delay Time (*3) Release Delay Time VDF × 0.05 VDF ×0.07 0.57 0.56 0.30 0.71 1.41 1.77 1.96 -0.95 -0.60 VIN=VDF×0.9V, VOUT=0V - -0.001 - VIN=6.0V, VOUT=6.0V - 0.001 0.10 o o -40 C≦Topr≦85 C - ±100 - ppm/oC ① - 30 100 μs ④ - 20 100 μs ④ VIN=1.0V VIN=2.0V VIN=3.0V VIN=4.0V VIN=6.0V ILEAK ΔVDF/ (ΔTopr・ VDF) Temperature Characteristics VDF × 0.03 0.09 0.08 0.05 0.46 1.15 1.44 1.61 - VIN=0.7V Output Current E-1 (*5) tDF tDR VIN=6.0V→0.7V VIN=VDF to VOUT=0.5V VIN=0.7V→6.0V VIN=VDR to VOUT=VDR (*4) *1: VDF (T): Nominal detect voltage *2: For XC6120C only. *3: A time taking from the time at VIN = VDF to the time at VOUT=0.5V when VIN falls from 6.0V to 0.7V. *4: VDR: Release voltage (VDR = VDF + VHYS) *5: A time taking from the time at VIN = VDR to the time at VOUT = VDR when VIN rise from 0.7V to 6.0V. ●XC6120N recommended pull-up resistance Input Voltage Range Pull-up Resistance 0.7V~6.0V 0.8V~6.0V 1.0V~6.0V ≧ 220kΩ ≧ 100kΩ ≧ 33kΩ 3/13 XC6120 Series ■ELECTRICAL CHARACTERISTICS (Continued) ● DETECT VOLTAGE ACCURACY AND SUPPLY CURRENT SPECIFICATIONS SYMBOL E-1 PARAMETER DETECT VOLTAGE E-2 E-3 VDF (V) SUPPLY CURRENT 1 SUPPLY CURRENT 2 XC6120xxx2 Series ISS1 (μA) NOMINAL DETECT ISS2 (μA) VOLTAGE (※6 ) VDF(T) MIN. MAX. 1.0 0.970 1.030 1.1 1.070 1.130 1.2 1.170 1.230 1.3 1.270 1.330 1.4 1.370 1.430 1.5 1.470 1.530 1.6 1.568 1.632 1.7 1.666 1.734 1.8 1.764 1.836 1.9 1.862 1.938 2.0 1.960 2.040 2.1 2.058 2.142 2.2 2.156 2.244 2.3 2.254 2.346 2.4 2.352 2.448 2.5 2.450 2.550 2.6 2.548 2.652 2.7 2.646 2.754 2.8 2.744 2.856 2.9 2.842 2.958 3.0 2.940 3.060 3.1 3.038 3.162 3.2 3.136 3.264 3.3 3.234 3.366 3.4 3.332 3.468 3.5 3.430 3.570 3.6 3.528 3.672 3.7 3.626 3.774 3.8 3.724 3.876 3.9 3.822 3.978 4.0 3.920 4.080 4.1 4.018 4.182 4.2 4.116 4.284 4.3 4.214 4.386 4.4 4.312 4.488 4.5 4.410 4.590 4.6 4.508 4.692 4.7 4.606 4.794 4.8 4.704 4.896 4.9 4.802 4.998 5.0 4.900 5.100 TYP. MAX. TYP. MAX. 0.5 1.4 0.4 1.35 0.6 1.7 0.5 1.60 0.7 1.9 0.6 1.80 When detect voltage is 1.0V≦VDF(T)＜1.5V, detect accuracy is ±30mV. When detect voltage is 1.5V≦VDF(T)≦5.0V, detect accuracy is ±2%. 4/13 XC6120 Series ■TEST CIRCUITS Circuit 1 RPULL=100kΩ (Unused for the CMOS output products) Circuit 2 Circuit 3 Circuit 4 RPULL=100kΩ (Unused for the CMOS output products) Measurement of waveform 5/13 XC6120 Series ■OPERATIONAL EXPLANATION ●Typical Application Circuit RPULL (Unused for the CMOS output products) VIN VIN VOUT VOUT VSS ●Timing Charge ⑥ Input Voltage (VIN) Release Voltage (VDR) Detect Voltage (VDF) Minimum Operating Voltage (VMIN) Ground Voltage (VSS) ① ② ③ ④ ⑤ Output Voltage (VOUT) Ground Voltage (VSS) Note: For explaining in a simplified case, an operation time of the circuit is not counted. The following explains the operation of the typical application circuit along number symbols shown in the timing chart. ① When input voltage (VIN) is higher than detect voltage (VDF), output voltage (VOUT) will be equal to input voltage (VIN). (A condition of high impedance exists with N-ch open drain output configurations.) ② When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the ground voltage (VSS) level. ③ When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become unstable. If In this condition, VIN will equal the pulled-up output (should output be pulled-up.) (Input voltage, VIN, in the typical application circuit.) ④ When input voltage (VIN) rises above the minimum operating voltage (VMIN) level until it achieves a release voltage (VDR), output keeps the ground voltage level (VSS). ⑤ When the input voltage (VIN) rises above the release voltage (VDR), output voltage (VOUT will be equal to input voltage (VIN). (A condition of high impedance exists with N-ch open drain output configurations.) ⑥ The difference between VDR and VDF represents the hysteresis width. 6/13 XC6120 Series ■NOTE ON USE 1. 2. 3. 4. 5. 6. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than several μs / V. With a resistor connected between the VIN pin and the power supply VDD some errors may be observed from the input voltage at the detect and release voltage. Those errors are not constant because of the fluctuation of the supply current. When a resistor is connected between the VIN pin and the power supply VDD, oscillation may occur as a result of through current and voltage drop at the RIN at the time of voltage release. (refer to the Oscillation Description (1) below ) Especially in the CMOS output configurations, oscillation may occur regardless of detect/release operation if load current (IOUT) exists. (refer to the Oscillation Description (2) below) Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and the power supply VDD power source. In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1μF. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. VPULL RPULL XC6120N [Figure 1: Circuit connected with the input resistor] ● Oscillation Description (1) Oscillation as a result of through current Since the XC6120 series are CMOS ICs, transient through current will flow when the IC's internal circuit switching operates regardless of output configuration. Consequently, oscillation is liable to occur as a result of the similar operations as in (1) above. This oscillation does not occur during the detect operation. (2) Output current oscillation with the CMOS output configuration As shown in figure 2, when the voltage applied at the power supply (VDD) rises from below detect voltage to above release voltage, the IC commence release operations and the internal P-ch driver transistor will be on. The output current (IOUT) flows the input resistor (RIN) via the P-ch driver transistor. Because of the input resistor (RIN) and the output current (IOUT), an input pin voltage drops RIN x IOUT. If the voltage drop level is larger than the IC’s hysteresis width (VHYS), the input pin voltage will falls below the VDF and detect operations will commerce so that the internal P-ch driver transistor will be off. The voltage drop will stop because the output current (IOUT) which was flowing the P-ch driver transistor will run down. The input pin voltage will become the same voltage level as the input voltage (VIN). For this, the input pin voltage will rise above the release voltage (VDR), therefore, the release operations will begin over again. Oscillation may occur with this repetition. Further, this condition will also appear via means of a similar mechanism during detect operations. XC6120C [Figure 2: Oscillation caused by the input resistor of the CMOS output product and the output current] 7/13 XC6120 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Supply Current vs. Input Voltage XC6120x102xx XC6120x502xx 3.5 Ta= 85℃ 25℃ -40℃ 3.0 2.5 Supply Current: ISS (μA) Supply Current: ISS (μA) 3.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4 5 Ta= 85℃ 25℃ -40℃ 3.0 2.5 2.0 1.5 1.0 0.5 0.0 6 0 1 Input Voltage: VIN (V) 2 3 4 5 6 Input Voltage: VIN (V) (2) Output Voltage vs. Input Voltage XC6120C202xx XC6120N202xx Ta= 25℃ Vpull-up=6V Rpull-up=100kΩ 6 7 5 6 Output Voltage: VOUT (V) Output Voltage: VOUT (V) Ta= 85℃ 4 3 2 1 0 25℃ 5 -50℃ 4 3 2 1 0 0 1 2 3 4 5 6 0.0 0.5 Input Voltage: VIN (V) 1.0 1.5 2.0 2.5 3.0 Input Voltage: VIN (V) (3) Detect Voltage, Release Voltage vs. Ambient Temperature 2.4 2.4 1.15 1.15 2.3 2.3 1.10 1.10 VDR 1.05 1.05 1.00 1.00 VDF 0.95 0.95 0.90 -50 -25 0 25 50 75 Ambient Temperature: Ta (℃) 8/13 0.90 100 Detect Voltage: VDF (V) 1.20 Release Voltage: VDR (V) Detect Voltage: VDF (V) 1.20 2.2 2.2 VDR 2.1 2.1 2.0 2.0 VDF 1.9 1.9 1.8 -50 -25 0 25 50 75 Ambient Temperature: Ta (℃) 1.8 100 Release Voltage: VDR (V) XC6120x202xx XC6120x102xx XC6120 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Output Current (Nch Driver) vs. Input Voltage XC6120x502xx XC6120x502xx VOUT=0.5V Output Current(Nch): IOUTN (mA) Output Current(Nch): IOUTN (mA) Ta= -40℃ 8 25℃ 85℃ 6 VOUT=0.3V 10 10 4 2 0 Ta= -40℃ 8 25℃ 85℃ 6 4 2 0 0 1 2 3 4 5 6 0 1 2 Input Voltage: VIN [V] 3 4 5 6 Input Voltage: VIN (V) (5) Output Current (Pch Driver) vs. Input Voltage XC6120x502xx XC6120C102xx VOUT=0.1V VOUT=VIN-0.5V 0.00 Output Current(Pch): IOUTP (mA) Output Current(Nch): IOUTN (mA) 6 5 Ta= -40℃ 4 25℃ 3 85℃ 2 1 Ta= 85℃ 25℃ -40℃ -0.25 -0.50 -0.75 -1.00 -1.25 -1.50 0 0 1 2 3 4 5 1 6 2 5 6 VOUT=VIN-0.1V VOUT=VIN-0.3V 0.00 Output Current(Pch): IOUTP (mA) 0.00 Output Current(Pch): IOUTP (mA) 4 XC6120C102xx XC6120C102xx Ta= 85℃ 25℃ -40℃ -0.20 3 Input Voltage: VIN (V) Input Voltage: VIN (V) -0.40 -0.60 -0.80 Ta= 85℃ 25℃ -40℃ -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -1.00 1 2 3 4 Input Voltage: VIN (V) 5 6 1 2 3 4 5 6 Input Voltage: VIN (V) 9/13 XC6120 Series ■PACKAGING INFORMATION ●SSOT-24 ●USP-3 (unit : mm) ●USP-3 Reference Metal Mask Design 10/13 0.3 0.5 0.25 1.2 0.7 0.25 1.35 0.4 ●USP-3 Reference Pattern Layout XC6120 Series ■ MARKING RULE ●SSOT-24 ① represents output configuration and detect voltage Range MARK K L M N OUTPUT CONFIGURATION OUTPUT VOLTAGE CMOS Nch open drain PRODUCT SERIES 1.0V～2.9V 3.0V～5.0V 1.0V～2.9V 3.0V～5.0V XC6120C XC6120N SSOT-24 (TOP VIEW) ② represents detect voltage MARK 0 1 2 3 4 5 6 7 8 9 A B C D E DETECT VOLTAGE (V) 1.0 1.1 1.2 1.3 1.4 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 MARK F H K L M N P R S T U V X Y Z DETECT VOLTAGE (V) 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 4.5 4.6 4.7 4.8 4.9 5.0 - ③,④ represents production lot number 01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated. (G, I, J, O, Q, W excluded. Reversed character is not used.) 11/13 XC6120 Series ■ MARKING RULE (Continued) ●USP-3 3 ④ ⑤ 2 ① ② ③ 1 3 USP-3 (TOP VIEW) ① represents product series MARK PRODUCT SERIES 0 XC6120****** ② standard：represents output configuration and integer number of detect voltage ●CMOS Output (XC6120C Series) MARK A B C D E DETECT VOLTAGE (V) 1.X 2.X 3.X 4.X 5.X ●Nch open drain (XC6120N Series) MARK F H K L M DETECT VOLTAGE (V) 1.X 2.X 3.X 4.X 5.X ③ standard：represents decimal point of detect voltage MARK 3 0 DETECT VOLTAGE (V) X.3 X.0 PRODUCT SERIES XC6120**3*** XC6120**0*** ④,⑤ represents production lot number 01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated. (G, I, J, O, Q, W excluded.) 12/13 XC6120 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 13/13