TOREX XC6120

XC6120
Series
ETR0209-005
Highly Accurate, Ultra Small, Low Power Consumption Voltage Detector
■GENERAL DESCRIPTION
The XC6120 series are highly precise, low power consumption voltage detectors, manufactured using CMOS and laser
trimming technologies. With low power consumption and high accuracy, the series is suitable for precision mobile equipment.
The XC6120 in ultra small packages are ideally suited for high-density mounting. The XC6120 is available in both CMOS and
N-channel open drain output configurations.
■APPLICATIONS
■FEATURES
●Microprocessor reset circuitry
●Memory battery back-up circuits
●Power-on reset circuits
●Power failure detection
●System battery life and charge voltage monitors
■TYPICAL APPLICATION CIRCUIT
: ± 2% (VDF(T)≧1.5V)
: ± 30mV (VDF(T)<1.5V)
Low Power Consumption : 0.6μA (TYP.) [VDF(T)=2.7V, VIN2.97V]
Detect Voltage Range
: 1.0V ~ 5.0V (0.1V increments)
Operating Voltage Range : 0.7V ~ 6.0V
Detect Voltage Temperature Characteristics
: ±100ppm/℃ (TYP.)
Output Configuration
: CMOS (XC6120C)
: N-channel open drain (XC6120N)
Operating
Temperature Range
: -40℃~85℃
Ultra Small Packages
: USP-3, SSOT-24
Highly Accurate
■ TYPICAL PERFORMANCE
CHARACTERISTICS
●Supply Current vs. Input Voltage
XC6120x272xx
(Unused for the CMOS
output products)
SupplyCurrent:
Current: ISS
(μA)
Supply
ISS (μA)
3.5
Ta= 85℃
25℃
-40℃
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
1
2
3
4
5
6
Input Voltage: VIN (V)
1/13
XC6120 Series
■PIN CONFIGURATION
VIN
VOUT
NC
VSS
VSS
VOUT
VIN
SSOT-24
(TOP VIEW)
USP-3
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
USP-3
SSOT-24
1
3
2
-
PIN NAME
FUNCTION
VIN
VSS
VOUT
NC
Power Input
Ground
Output
No Connection
4
2
3
1
■PRODUCT CLASSIFICATION
●Ordering Information
XC6120①②③④⑤⑥-⑦(*1)
DESIGNATOR
DESCRIPTION
①
Output Configuration
②③
④
Detect Voltage (VDF)
Detect Accuracy
⑤⑥-⑦
Packages
Taping Type (*2)
(*1)
(*2)
SYMBOL
C
N
10~50
2
HR
NR
NR-G
DESCRIPTION
CMOS output
N-ch open drain output
For example 1.0V → ②1, ③0
±2%
USP-3
SSOT-24 (SC-82)
SSOT-24 (SC-82) (Halogen & Antimony free)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or
representative. (Standard orientation: ⑤R-⑦, Reverse orientation: ⑤L-⑦)
■BLOCK DIAGRAMS
(1) XC6120C
2/13
(2) XC6120N
XC6120
Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
Output Voltage
PARAMETER
SYMBOL
RATING
UNITS
Input Voltage
VIN
IOUT
VSS-0.3~7.0
V
mA
Output Current
CMOS Output
10
VSS-0.3~VIN+0.3
VOUT
N-ch Open Drain Output
USP-3
Power Dissipation
SSOT-24
Operating Temperature Range
mW
Ta
Tstg
-55~+125
℃
Pd
Storage Temperature Range
V
VSS-0.3~7.0
120
150
-40~+85
℃
■ELECTRICAL CHARACTERISTICS
XC6120 Series
Ta=25℃
PARAMETER
SYMBOL
CONDITION
MIN.
TYP.
MAX.
UNITS
CIRCUIT
Operating Voltage
VIN
VDF(T)=1.0∼5.0V (*1)
0.7
-
6.0
V
-
Detect Voltage
VDF
VDF(T)=1.0V∼5.0V
V
①
Hysteresis Width
VHYS
VDF(T)=1.0V∼5.0V
V
①
Supply Current 1
ISS1
VIN=VDF(T)×1.1
E-2
μA
②
Supply Current 2
ISS2
VIN= VDF(T)×0.9V
E-3
μA
②
③
IOUTN
Output Current
VIN=0.7V
IOUTP (*2)
VOUT=0.5V
VOUT=0.3V
VOUT=0.1V
VIN=6.0V, VOUT=5.5V
VIN=6.0V,
VOUT=6.0V
ILEAK
Temperature
Characteristics
ΔVDF
ΔTa・VDF
Detect Delay Time (*3)
TDF
Release Delay Time (*5)
TDR
XC6120C
XC6120N
-40 oC≦Ta≦85 oC
VIN=6.0V→0.7V
VIN=VDF to VOUT=0.5V
VIN=0.7V→6.0V
VIN=VDR to VOUT=VDR (*4)
E-1
VDF
×0.03
VDF
×0.05
VDF
×0.07
0.09
0.08
0.05
0.57
0.56
0.30
-
mA
-
-0.95
-0.60
mA
-
0.001
0.001
0.100
μA
-
±100
-
ppm/oC
①
-
30
100
μs
④
-
20
100
μs
④
③
*1: VDF (T): Setting detect voltage
*2: For XC6120C Series only
*3: A time taking from the time at VIN = VDF to the time at VOUT=0.5V when VIN falls from 6.0V to 0.7V.
*4: VDR: Release voltage (VDR = VDF + VHYS)
*5: A time taking from the time at VIN = VDR to the time at VOUT = VDR when VIN rise from 0.7V to 6.0V.
●XC6120N Series recommended pull-up resistance
Input Voltage Range
Pull-up Resistance
0.7V~6.0V
0.8V~6.0V
1.0V~6.0V
≧ 220kΩ
≧ 100kΩ
≧ 33kΩ
3/13
XC6120 Series
■ELECTRICAL CHARACTERISTICS (Continued)
● DETECT VOLTAGE ACCURACY AND SUPPLY CURRENT SPECIFICATIONS
SYMBOL
E-1
PARAMETER
DETECT VOLTAGE
E-2
E-3
VDF (V)
SUPPLY CURRENT 1
SUPPLY CURRENT 2
XC6120xxx2 Series
ISS1 (μA)
SETTING DETECT
ISS2 (μA)
VOLTAGE
(※6 )
VDF(T)
MIN.
MAX.
1.0
0.970
1.030
1.1
1.070
1.130
1.2
1.170
1.230
1.3
1.270
1.330
1.4
1.370
1.430
1.5
1.470
1.530
1.6
1.568
1.632
1.7
1.666
1.734
1.8
1.764
1.836
1.9
1.862
1.938
2.0
1.960
2.040
2.1
2.058
2.142
2.2
2.156
2.244
2.3
2.254
2.346
2.4
2.352
2.448
2.5
2.450
2.550
2.6
2.548
2.652
2.7
2.646
2.754
2.8
2.744
2.856
2.9
2.842
2.958
3.0
2.940
3.060
3.1
3.038
3.162
3.2
3.136
3.264
3.3
3.234
3.366
3.4
3.332
3.468
3.5
3.430
3.570
3.6
3.528
3.672
3.7
3.626
3.774
3.8
3.724
3.876
3.9
3.822
3.978
4.0
3.920
4.080
4.1
4.018
4.182
4.2
4.116
4.284
4.3
4.214
4.386
4.4
4.312
4.488
4.5
4.410
4.590
4.6
4.508
4.692
4.7
4.606
4.794
4.8
4.704
4.896
4.9
4.802
4.998
5.0
4.900
5.100
TYP.
MAX.
TYP.
MAX.
0.5
1.4
0.4
1.35
0.6
1.7
0.5
1.60
0.7
1.9
0.6
1.80
When setting detect voltage is 1.0V≦VDF(T)＜1.5V, detect accuracy is ±30mV.
When setting detect voltage is 1.5V≦VDF(T)≦5.0V, detect accuracy is ±2%.
4/13
XC6120
Series
■TEST CIRCUITS
Circuit 1
R=100kΩ
(Unused for the CMOS output products)
Circuit 2
Circuit 3
Circuit 4
R=100kΩ
(Unused for the CMOS output products)
Measurement of waveform
5/13
XC6120 Series
■OPERATIONAL EXPLANATION
●Typical Application Circuit
R
(Unused for the CMOS output products)
VIN
VIN
VOUT
VOUT
VSS
●Timing Charge
⑥
Input Voltage
(VIN)
Release Voltage (VDR)
Detect Voltage (VDF)
Minimum Operating Voltage (VMIN)
Ground Voltage (VSS)
①
②
③
④
⑤
Output
Voltage
(VOUT)
Ground Voltage (VSS)
Note: For explaining in a simplified case, an operation time of the circuit is not counted.
The following explains the operation of the typical application circuit along number symbols shown in the timing chart.
① When input voltage (VIN) rises above detect voltage (VDF), output voltage (VOUT) will be equal to input voltage (VIN). (A
condition of high impedance exists with N-ch open drain output configurations.)
② When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the ground voltage
(VSS) level.
③ When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become
unstable. If In this condition, VIN will equal the pulled-up output (should output be pulled-up.) (Input voltage, VIN, in
the typical application circuit.)
④ When input voltage (VIN) rises above the minimum operating voltage (VMIN) level until it achieves a release voltage
(VDR), output keeps the ground voltage level (VSS).
⑤ When the input voltage (VIN) rises above the release voltage (VDR), output voltage (VOUT will be equal to input voltage
(VIN). (A condition of high impedance exists with N-ch open drain output configurations.)
⑥ The difference between VDR and VDF represents the hysteresis width.
6/13
XC6120
Series
■NOTE ON USE
1.
2.
3.
4.
5.
Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent
damage to the device.
In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than
several μs / V.
With a resistor connected between the VIN pin and the power supply VDD some errors may be observed from the input
voltage at the detect and release voltage. Those errors are not constant because of the fluctuation of the supply current.
When a resistor is connected between the VIN pin and the power supply VDD, oscillation may occur as a result of through
current and voltage drop at the RIN at the time of voltage release. (refer to the Oscillation Description (1) below ) Especially
in the CMOS output configurations, oscillation may occur regardless of detect/release operation if load current (IOUT)
exists. (refer to the Oscillation Description (2) below)
Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and the power supply
VDD power source. In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1μF.
XC6120N
[Figure 1: Circuit connected with the input resistor]
●
Oscillation Description
(1) Oscillation as a result of through current
Since the XC6120 series are CMOS ICs, transient through current will flow when the IC's internal circuit switching operates
regardless of output configuration. Consequently, oscillation is liable to occur as a result of the similar operations as in (1)
above. This oscillation does not occur during the detect operation.
(2) Output current oscillation with the CMOS output configuration
As shown in figure 2, when the voltage applied at the power supply (VDD) rises from below detect voltage to above release
voltage, the IC commence release operations and the internal P-ch driver transistor will be on. The output current (IOUT) flows
the input resistor (RIN) via the P-ch driver transistor. Because of the input resistor (RIN) and the output current (IOUT), an input pin
voltage drops RIN x IOUT. If the voltage drop level is larger than the IC’s hysteresis width (VHYS), the input pin voltage will falls
below the VDF and detect operations will commerce so that the internal P-ch driver transistor will be off. The voltage drop will
stop because the output current (IOUT) which was flowing the P-ch driver transistor will run down. The input pin voltage will
become the same voltage level as the input voltage (VIN). For this, the input pin voltage will rise above the release voltage (VDR),
therefore, the release operations will begin over again. Oscillation may occur with this repetition. Further, this condition will
also appear via means of a similar mechanism during detect operations.
XC6120C
[Figure 2: Oscillation caused by the input resistor of the CMOS output product and the output current]
7/13
XC6120 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Supply Current vs. Input Voltage
XC6120x102xx
XC6120x502xx
3.5
Ta= 85℃
25℃
-40℃
3.0
2.5
Supply Current: ISS (μA)
Supply Current: ISS (μA)
3.5
2.0
1.5
1.0
0.5
0.0
0
1
2
3
4
5
Ta= 85℃
25℃
-40℃
3.0
2.5
2.0
1.5
1.0
0.5
0.0
6
0
1
Input Voltage: VIN (V)
2
3
4
5
6
Input Voltage: VIN (V)
(2) Output Voltage vs. Input Voltage
XC6120C202xx
XC6120N202xx
Ta= 25℃
Vpull-up=6V Rpull-up=100kΩ
6
7
5
6
Output Voltage: VOUT (V)
Output Voltage: VOUT (V)
Ta= 85℃
4
3
2
1
0
25℃
5
-50℃
4
3
2
1
0
0
1
2
3
4
5
6
0.0
0.5
Input Voltage: VIN (V)
1.0
1.5
2.0
2.5
3.0
Input Voltage: VIN (V)
(3) Detect Voltage, Release Voltage vs. Ambient Temperature
2.4
2.4
1.15
1.15
2.3
2.3
1.10
1.10
VDR
1.05
1.05
1.00
1.00
VDF
0.95
0.95
0.90
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
8/13
0.90
100
Detect Voltage: VDF (V)
1.20
Release Voltage: VDR (V)
Detect Voltage: VDF (V)
1.20
2.2
2.2
VDR
2.1
2.1
2.0
2.0
VDF
1.9
1.9
1.8
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
1.8
100
Release Voltage: VDR (V)
XC6120x202xx
XC6120x102xx
XC6120
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Current (Nch Driver) vs. Input Voltage
XC6120x502xx
XC6120x502xx
VOUT=0.5V
Output Current(Nch): IOUTN (mA)
Output Current(Nch): IOUTN (mA)
Ta= -40℃
8
25℃
85℃
6
VOUT=0.3V
10
10
4
2
0
Ta= -40℃
8
25℃
85℃
6
4
2
0
0
1
2
3
4
5
6
0
1
2
Input Voltage: VIN [V]
3
4
5
6
Input Voltage: VIN (V)
(5) Output Current (Pch Driver) vs. Input Voltage
XC6120x502xx
XC6120C102xx
VOUT=0.1V
VOUT=VIN-0.5V
0.00
Output Current(Pch): IOUTP (mA)
Output Current(Nch): IOUTN (mA)
6
5
Ta= -40℃
4
25℃
3
85℃
2
1
Ta= 85℃
25℃
-40℃
-0.25
-0.50
-0.75
-1.00
-1.25
-1.50
0
0
1
2
3
4
5
1
6
2
5
6
VOUT=VIN-0.1V
VOUT=VIN-0.3V
0.00
Output Current(Pch): IOUTP (mA)
0.00
Output Current(Pch): IOUTP (mA)
4
XC6120C102xx
XC6120C102xx
Ta= 85℃
25℃
-40℃
-0.20
3
Input Voltage: VIN (V)
Input Voltage: VIN (V)
-0.40
-0.60
-0.80
Ta= 85℃
25℃
-40℃
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-1.00
1
2
3
4
Input Voltage: VIN (V)
5
6
1
2
3
4
5
6
Input Voltage: VIN (V)
9/13
XC6120 Series
■PACKAGING INFORMATION
●USP-3
●SSOT-24
1.2±0.08
1.2±0.08
0.6 MAX
1pin INDENT
0.2±0.1
(0.6)
0.3±0.05
1
2
*Solder
filet is not formed because
※端子側
レット at the lead side
of no plating
3
1.0±0.1
0.2±0.05
3
(0.05)
0.7±0.1
(R 0.1)
(R 0.05)
●USP-3 Reference Pattern Layout
●USP-3 Reference Metal Mask Design
0.6
0.35
0.35
0.35
0.3
1.0
0.3
R 0.1
R 0.05
0.5
0.25
0.25
0.7
1.2
1.35
0.3
0.4
0.35
0.35
0.8
0.35
*Thickness of solder paste：120μm（recommended）
10/13
XC6120
Series
■ MARKING RULE
●SSOT-24
①
Represents output configuration and detect voltage Range
MARK
K
L
M
N
OUTPUT CONFIGURATION OUTPUT VOLTAGE
CMOS
Nch open drain
PRODUCT SERIES
1.0V∼2.9V
3.0V∼5.0V
1.0V∼2.9V
3.0V∼5.0V
XC6120C
XC6120N
SSOT-24
(TOP VIEW)
②
Represents detect voltage
MARK
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
③,④
DETECT VOLTAGE (V)
1.0
1.1
1.2
1.3
1.4
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
MARK
F
H
K
L
M
N
P
R
S
T
U
V
X
Y
Z
DETECT VOLTAGE (V)
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
4.5
4.6
4.7
4.8
4.9
5.0
-
Represents production lot number
01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated.
(G, I, J, O, Q, W excluded. Reversed character is not used.)
11/13
XC6120 Series
■ MARKING RULE (Continued)
●USP-3
3
④ ⑤
2
MARK
PRODUCT SERIES
0
XC6120******
① ② ③
1
Represents product series
①
3
USP-3
②
Standard：Represents output configuration and integer number of detect voltage
(TOP VIEW)
●CMOS Output (XC6120C Series)
MARK
A
B
C
D
E
③
MARK
F
H
K
L
M
DETECT VOLTAGE (V)
1.X
2.X
3.X
4.X
5.X
Standard：Represents decimal point of detect voltage
MARK
3
0
④,⑤
12/13
DETECT VOLTAGE (V)
1.X
2.X
3.X
4.X
5.X
●Nch open drain (XC6120N Series)
DETECT VOLTAGE (V)
X.3
X.0
PRODUCT SERIES
XC6120**3***
XC6120**0***
Represents production lot number
01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated.
(G, I, J, O, Q, W excepted.)
XC6120
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this catalog is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this catalog.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this catalog.
4. The products in this catalog are not developed, designed, or approved for use with such
equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this catalog within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this catalog may be copied or reproduced without the
prior permission of Torex Semiconductor Ltd.
13/13