your innovation. our memory. 2014 2H Micron Product Guide ® your innovation. our memory. We have the right device for your design. Micron has one of the most comprehensive, cost-competitive memory product portfolios in the industry. We’re committed to meeting our customers’ needs with a broad continuum of memory solutions, from legacy designs to long-term stability for current designs, new innovations, and emerging technologies. 6 Segment Directory 13 DRAM 10 DDR3 SDRAM 240-pin ECC UDIMM 16 DDR3 SDRAM 240-pin VLP ECC UDIMM DDR SDRAM 184-pin RDIMM DDR3 SDRAM 244-pin Mini-UDIMM DDR SDRAM 184-pin VLP RDIMM DDR3 SDRAM 244-pin VLP Mini-UDIMM SDRAM 168-pin UDIMM MT40 and EDY DDR4 SDRAM DDR3 SDRAM 204-pin SODIMM SDRAM 168-pin ECC UDIMM MT41 and EDJ DDR3 SDRAM DDR3 SDRAM 204-pin ECC SODIMM MT47 DDR2 SDRAM DDR3 SDRAM 200-pin SORDIMM 17 14 MT48 SDRAM DDR3 SDRAM 240-pin RDIMM DDR3 SDRAM 240-pin VLP RDIMM 12 MT44 RLDRAM 3 Memory DDR3 SDRAM 244-pin Mini-RDIMM MT49 RLDRAM 2 Memory DDR3 SDRAM 244-pin VLP Mini-RDIMM MT52 Mobile LPDDR3 DDR2 SDRAM 240-pin UDIMM MT42 Mobile LPDDR2 DDR2 SDRAM 240-pin ECC UDIMM MT46 Mobile LPDDR DDR2 SDRAM 200-pin SODIMM ® DDR2 SDRAM 200-pin SORDIMM MT45 PSRAM CellularRAM Memory 15 17 Hybrid Memory Cube 17 Bare Die and Wafer-Level Products NAND Flash DDR2 SDRAM 244-pin VLP Mini-RDIMM DDR SDRAM 100-pin UDIMM DDR4 SDRAM 260-pin SODIMM DDR SDRAM 168-pin UDIMM DDR4 SDRAM 288-pin ECC SODIMM DDR SDRAM 184-pin UDIMM DDR4 SDRAM 288-pin RDIMM DDR SDRAM 168-pin ECC UDIMM DDR4 SDRAM 288-pin VLP RDIMM 16 MT29 SLC NAND Flash NAND Small Page (SP) Flash MT29 MLC NAND Flash MT29 Serial NAND Flash DDR2 SDRAM 244-pin Mini-RDIMM DDR4 SDRAM 288-pin ECC UDIMM DDR3 SDRAM 240-pin UDIMM 18 DDR2 SDRAM 240-pin FBDIMM DDR4 SDRAM 288-pin UDIMM DDR4 SDRAM 288-pin LRDIMM DDR2 SDRAM 240-pin RDIMM DDR2 SDRAM 240-pin VLP RDIMM Modules 13 Hybrid Memory Cube (HMC) ® EDW GDDR5 SGRAM Memory 12 SDRAM 144-pin SODIMM SDRAM 168-pin RDIMM MT46 DDR SDRAM 11 DDR SDRAM 200-pin ECC SODIMM Managed NAND 19 MTFC e •MMC Memory for Embedded MTED and MTFD Embedded USBs MT29 Enhanced ClearNAND Flash Memory DDR SDRAM 184-pin ECC UDIMM DDR SDRAM 144-pin SODIMM DDR SDRAM 200-pin SODIMM 3 your innovation. our memory. Product NOR Flash 20 25 M25PE Serial NOR Flash Embedded M25PX Serial NOR Flash Embedded M29AW Parallel NOR Flash Automotive M45PE Serial NOR Flash Embedded M29DW Parallel NOR Flash Automotive N25Q Serial NOR Flash Embedded 31 DRAM Components 33 GDDR5, Hybrid Memory Cube N25Q Serial NOR Flash Embedded (con’t.) 34 NOR MCP MT25Q Serial NOR Flash Embedded 35 MCP NAND/NOR + LPDDR1 37 MCP e •MMC/NAND + LPDDR Solid State Drives (SSDs) 39 e •MMC Memory Legacy 40 e •MMC Memory Next Generation 27 M500 Self-Encrypting Drive Client SATA SSD 41 DDR4 Module M550 Self-Encrypting Drive Client SATA SSD 42 DDR3 Module M29F Parallel NOR Flash Automotive M29W Parallel NOR Flash Automotive 21 26 M58BW Parallel NOR Flash Automotive M58WR Parallel NOR Flash Automotive G18 Parallel NOR Flash Automotive J3 Parallel NOR Flash Embedded M28W Parallel NOR Flash Embedded 22 43 DDR2 Module M510 Self-Encrypting Drive Client SATA SSD M29EW Parallel NOR Flash Embedded 44 DDR and SDRAM Module M550 Client SATA SSD M29W Parallel NOR Flash Embedded 45 PSRAM CellularRAM Memory M510 Client SATA SSD 46 NAND Flash M500 Enterprise SATA SSD 47 P30 Parallel NOR Flash Embedded (con’t.) NAND Small Page Flash Memory, N25Q Serial NOR Flash Memory M500DC Enterprise SATA SSD P33 Parallel NOR Flash Embedded 48 M25/M45 Serial NOR Flash Memory P320h Enterprise PCIe SSD M25P Serial NOR Flash Automotive (Legacy) P420m Enterprise PCIe SSD 49 M29 Parallel NOR Flash Memory, M29AW Automotive Uniform Block MLC Flash 50 M29DW Parallel NOR Flash, M29EW Parallel NOR Flash 51 M29F Automotive Single-Bank 5V Flash Memory 52 P30/P33 Parallel NOR Flash Memory, P30/P33 Stacked 53 G18 Parallel NOR Flash Memory, J3 Parallel NOR Flash Memory MT25T Serial NOR Flash Automotive (Twin QSPI, x8) 54 M28W Parallel NOR Flash Memory, M58BW Parallel NOR Flash Memory M25P Serial NOR Flash Embedded 55 M58WR Parallel NOR Flash Memory M29DW Parallel NOR Flash Embedded 28 P30 Parallel NOR Flash Embedded 29 23 M25PE Serial NOR Flash Automotive (Page Erase) 24 M25PE Serial NOR Flash Automotive (Dual I/O) N25Q Serial NOR Flash Automotive (Multiple I/O) 4 Part Numbering Guides Multichip Packages (MCPs) 30 MT29C NAND Flash + LPDDR MCPs MT29R NAND Flash + LPDDR2 MCPs MT38 NOR Flash-Based MCPs 56 3xx and 4xx SSD 57 4xx and 5xx SSD 58 Product Lifecycle Solutions 59 Web Tools 5 Automotive Solutions for the road Power and efficiency Connected Home Powering smart innovations Graphics and Consumer 6 Balancing cost and performance From workstations and netbooks, to tablets and ultrathins, computing designs require a multitude of packages, densities, and speeds. Our products enable you to optimize performance in key areas like signaling speeds and bandwidth and to find the right combination of power, efficiency, and cost. From components to modules to SSDs, we manufacture our products from start to finish. We invest time up front, rigorously testing and validating that our products are right the first time. Plus, our experienced technical support will help you get your design to market faster, easier, and better. Today’s network-connected home enables consumers to receive, access, and share content of all types via devices like set-top boxes and wireless modems. It also provides consumers the ability to automatically or manually monitor and manage connected home systems—like lighting, appliances, heating/cooling, and security—from locations both in and away from the home, over a secured connection. Our memory plays a key role in making these innovations possible. We offer a wide range of high-performance, highquality memory solutions that support all connectivity options. The convergence of applications in the graphics and consumer segment is bringing TV, social media, home entertainment, and gaming to end consumers through one piece of equipment. Micron offers one of the industry’s broadest portfolios to meet this very competitive segment’s demands for high-performance, cost-efficient memory solutions. We’ve got the memory you need for a broad range of designs, including digital TVs, Blu-ray Disc™ players, video game consoles, portable game systems, personal media players, PC graphics cards, media tablets, cameras, or printers. 10 DRAM Components 12 PSRAM CellularRAM Memory 18 NAND Flash 20 NOR Flash 11 Mobile LPDRAM 19 e •MMC Memory 12 DRAM Modules 27 Solid State Drives (SSDs) 10 DDR3/DDR4 SDRAM Components 20 NOR Flash 10 DRAM Components 20 NOR Flash 18 NAND Flash 19 Managed NAND 30 Multichip Packages (MCPs) 10 DRAM and GDDR5 Components 20 NOR Flash 18 NAND Flash 19 Managed NAND Flash 30 Multichip Packages (MCPs) Segment Directory Product Client Building on our decades of experience in the memory business, we’ve established a broad portfolio of products and technologies that maximize the functionality of today’s sophisticated automotive electronics. Our engineers have the technical background to help you choose the best of our high-quality, rigorously tested automotive memory solutions to optimize your design. 7 IMM Mobile/Tablet Staying connected in a wireless world Networking Enabling applications now and into the future Enterprise and Cloud Rigorously tested for reliability We’ve developed some of the industry’s highestperformance mobile memory solutions, but we deliver more than just great products. We strive to solve design challenges through better engineering— raising the bar on features, functionality, and performance. We work with chipset vendors, OS designers, and other enablers to ensure our parts are optimized for your design. You get a comprehensive product portfolio of mobile memory solutions that maximize performance, along with the technical experts to help you make it work for your applications. The unique requirements of communications and networking applications demand high-performance, specialty memory with low latency, rigorous thermal specifications, pristine signal integrity, and ECC data protection. Choosing the right memory technology for your design is a critical decision you make on the initial board layout; so is choosing a memory supplier to provide it. Micron engineers and manufactures a broad portfolio of specific solutions to meet the needs of your mission-critical networking applications. Server designs demand reliability, performance, and low power consumption. We’ve developed a host of solutions—from professional-grade SSDs to the industry’s lowest-voltage modules—that can help you address these challenges and overcome power and space constraints in data centers. We design and build our memory solutions from start to finish—beginning with memory component design—rigorously testing at each stage of the manufacturing process. We also work with board makers and industry organizations to define and develop the leading technologies that will enable your next server design. 10 DRAM Components 11 Mobile LPDRAM 20 NOR Flash 19 e •MMC Memory 12 PSRAM CellularRAM Memory 18 NAND Flash 11 Mobile LPDRAM 18 NAND Flash 12 PSRAM CellularRAM Memory 30 NAND and NOR Flash-Based Multichip Packages (MCPs) 7 Segment Directory One source for industrial/multi-market applications Our exacting quality standards, broad product portfolio, individualized category support, and commitment to supply stability set us apart as the memory provider that IMM customers can rely on to serve mission-critical application needs. Our memory solutions are the top choice for PC, network infrastructure, and communications equipment used in extreme environments—empowering the newest technology developments in the fields of science, medicine, and manufacturing. e •MMC Memory 10 DRAM and RLDRAM Components 12 DRAM Modules 18 NAND Flash 19 eUSB, e •MMC Memory 27 Solid State Drives (SSDs) 20 NOR Flash 17 Hybrid Memory Cube (HMC) 12 GDDR5 13 LRDIMMs 12 RDIMMs 18 NAND Flash 27 SATA and PCIe Solid State Drives (SSDs) 17 Hybrid Memory Cube (HMC) 9 Density DRAM Bus Width Voltage Clock Rate Package Temp Range MT44 RLDRAM® 3 Memory 576Mb x18, x36 1.35V 800–1067 MHz 168-ball FBGA 0˚C to +95˚C, –40˚C to +95˚C 1.15Gb x18, x36 (576Mb DDP) 1.35V 800 MHz 168-ball FBGA 0˚C to +95˚C, –40˚C to +95˚C Note: Products meet RoHS 5/6 standards. Bus Width Voltage Clock Rate Package Temp Range MT40 and EDY DDR4 SDRAM 288Mb x9, x18, x36 1.8V 300–400 MHz 144-ball uBGA 0˚C to +95˚C, –40˚C to +95˚C 4Gb 576Mb x9, x18, x36 1.8V 300–533 MHz 144-ball uBGA 0˚C to +95˚C, –40˚C to +95˚C 1.2V 667–800 MHz 216-ball UFBGA –30˚C to +85˚C –30˚C to +85˚C 8Gb x4, x8, x16 1.2V 1067–1600 MHz 78-, 96-ball FBGA 0˚C to +95˚C Note: Products meet RoHS 5/6 standards. x4, x8, x16 (SDP), x4 (4Gb DDP) 1.2V 1067–1600 MHz 78-, 96-ball FBGA 0˚C to +95˚C Note: Products meet RoHS standards. 1Gb x4, x8, x16 1.35–1.5V 667–1067 MHz 78-, 96-ball FBGA 0˚C to +95˚C, –40˚C to +95˚C, –40˚C to +105˚C 2Gb x4, x8, x16 1.35–1.5V 800–1067 MHz 78-, 96-ball FBGA 0˚C to +95˚C, –40˚C to +85˚C, –40˚C to +95˚C, –40˚C to +105˚C 4Gb x4, x8, x16 1.35–1.5V 800–1067 MHz 78-, 96-ball FBGA 0˚C to +95˚C, –40˚C to +95˚C, –40˚C to +105˚C 8Gb x4, x8, x16 (SDP and 4Gb DDP) 1.35V 800–1067 MHz 78-, 96-ball FBGA 0˚C to +95˚C, –40˚C to +95˚C 16Gb x16 (8Gb DDP) 1.35V 933 MHz 78-ball FBGA 0˚C to +95˚C MT47 DDR2 SDRAM 512Mb x4, x8, x16 1.8V 400–533 MHz 60-, 84-ball FBGA 0˚C to +85˚C, –40˚C to +95˚C, –40˚C to +105˚C 1Gb x4, x8, x16 1.8V 333–533 MHz 60-, 84-ball FBGA 0˚C to +85˚C, –40˚C to +95˚C, –40˚C to +105˚C 2Gb x4, x8, x16 (SDP); x4, x8 (2Gb DDP) 1.8V 400–533 MHz 60-, 63-, 84-ball FBGA 0˚C to +85˚C, –40˚C to +95˚C, –40˚C to +105˚C 4Gb x4, x8 (2Gb DDP) 1.8V 400 MHz 63-ball FBGA 0˚C to +85˚C Note: Products meet RoHS standards. your innovation. our memory. x8, x16 2.5V 200 MHz 60-ball FBGA, 66-pin TSOP 0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C 512Mb x4, x8, x16 2.5V 200 MHz 60-ball FBGA, 66-pin TSOP 0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C Note: Products meet RoHS 5/6 standards. MT48 SDRAM x8, x16, x32 3.3V 3.3V 133–200 MHz 54-, 86-pin TSOP, 54-, 90-ball VFBGA 133–167 MHz 54-, 86-pin TSOP, 54-, 90-ball VFBGA, 60-ball FBGA 0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C 0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C 256Mb x4, x8, x16 3.3V 133–167 MHz 54-pin TSOP, 54-ball VFBGA, 60-ball FBGA 0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C 512Mb x4, x8, x16 3.3V 133 MHz 54-pin TSOP 0˚C to +70˚C, –40˚C to +85˚C Note: Products meet RoHS 5/6 standards. x32, x64 1.2V 667–800 MHz 12Gb x32, x64 1.2V 667–800 MHz 216-ball FBGA –30˚C to +85˚C 16Gb x32, x64 1.2V 667–800 MHz 216-ball VFBGA, 216-ball WFBGA, 253-ball TFBGA –30˚C to +85˚C 134-ball VFBGA –25˚C to +85˚C, –40˚C to +105˚C MT42 Mobile LPDDR2 1Gb x32 1.2V 400 MHz 2Gb x16, x32 1.2V 333–400 MHz 168-ball PoP –25˚C to +85˚C –25˚C to +85˚C 4Gb x32, x64 1.2V 333–533 MHz 168-, 216-ball PoP, 134-, 168-, 240-ball WFBGA, 216-ball UFBGA 6Gb x32 1.2V 333–400 MHz 168-ball VFBGA –25˚C to +85˚C 8Gb x32, x64 1.2V 333–533 MHz 168-, 216-, 240-ball PoP, 168-, 216-, 272-ball WFBGA –25˚C to +85˚C 16Gb x64 1.2V 400–533 MHz 216-, 220-, 253-ball VFBGA –25˚C to +85˚C MT46 Mobile LPDDR 256Mb 128Mb 8Gb 216-, 253-ball WFBGA, 178-, 253-ball VFBGA Note: Products meet RoHS standards. MT46 DDR SDRAM x8, x16, x32 x32 Note: Products meet RoHS standards. Note: Products meet RoHS standards. 64Mb MT52 Mobile LPDDR3 4Gb MT41 and EDJ DDR3 SDRAM 10 MT49 RLDRAM 2 Memory DRAM Density 128Mb x16 1.8V 167–200 MHz 60-ball VFBGA 0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C 256Mb x16, x32 1.8V 167–200 MHz 60-, 90-ball VFBGA 0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C 512Mb x16, x32 1.8V 167–200 MHz 60-, 90-ball VFBGA, WFBGA, 152-ball PoP –40˚C to +85˚C 1Gb x16, x32 1.8V 167–200 MHz 60-, 90-ball VFBGA, 168-ball PoP –40˚C to +85˚C, –40˚C to +105˚C 2Gb x16, x32 1.8V 167–200 MHz 60-, 90-ball VFBGA, 168-ball PoP, 60-ball WFBGA –25˚C to +85˚C, –40˚C to +85˚C 4Gb x32 1.8V 167–200 MHz 168-, 240-ball PoP –25˚C to +85˚C, –40˚C to +85˚C 8Gb x32 1.8V 167–200 MHz 168-ball PoP –25˚C to +85˚C, –40˚C to +85˚C Note: Products meet RoHS standards. 11 Density Bus Width RoHS I/O Voltage Access Time Package Temp Range MT45 PSRAM CellularRAM® Memory Component Count RoHS x16 32Mb x16 Green 1.8V 64Mb x16 Green 1.8V 70ns 48-, 54-ball VFBGA –40˚C to +85˚C, –30˚C to +85˚C DDR3 SDRAM 240-pin UDIMM 128Mb x16 Green 1.8V 70ns, 85ns 54-ball VFBGA –40˚C to +85˚C, –40˚C to +105˚C 1GB x64 8 2GB x64 4, 8 4GB x64 8GB 16GB 1.8V 70ns 48-, 54-ball VFBGA –40˚C to +85˚C, –40˚C to +105˚C 70ns 48-, 54-ball VFBGA –40˚C to +85˚C, –40˚C to +105˚C I/O Voltage Data Rate Module Ranks Temp Range Depth Package Temp Range 16GB x72 36 Green 1.2V 2133 MT/s Dual 0˚C to +95˚C 32GB x72 72 Green 1.2V 2133 MT/s Quad 0˚C to +95˚C Green 1.35 V 1333 MT/s Single 0˚C to +95˚C Green 1.35 –1.5V 1600 MT/s Single 0˚C to +95˚C 8 Green 1.35–1.5V 1600–1866 MT/s Single 0˚C to +95˚C x64 16 Green 1.35 –1.5V 1600–1866 MT/s Dual 0˚C to +95˚C x64 16 Green 1.35V 1866 MT/s Dual 0˚C to +95˚C x32 1.5V 64Mb 170-, 238-ball FBGA 0˚C to +95˚C DDR3 SDRAM 240-pin ECC UDIMM 4Gb x32 1.5V 128Mb 170-, 238-ball FBGA 0˚C to +95˚C 1GB x72 9 Green 1.5V 1333 MT/s Single 0˚C to +95˚C 2GB x72 9, 18 Green 1.35 –1.5V 1333–2133 MT/s Single, Dual 0˚C to +95˚C 4GB x72 9, 18 Green 1.35–1.5V 1333–1866 MT/s Single, Dual 0˚C to +95˚C 8GB x72 18 Green 1.35 –1.5V 1333–1866 MT/s Dual 0˚C to +95˚C 16GB x72 18 Green 1.35 –1.5V 1600–1866 MT/s Dual 0˚C to +95˚C Modules Density Bus Width Component Count DDR3 SDRAM 240-pin VLP ECC UDIMM RoHS Voltage Data Rate Module Ranks Temp Range 4GB x64 8 Green 1.2V 2133 MT/s Single 0˚C to +95˚C 8GB x64 16 Green 1.2V 2133 MT/s Dual 0˚C to +95˚C DDR4 SDRAM 288-pin ECC UDIMM x72 9 Green 1.2V 2133 MT/s Single 0˚C to +95˚C 8GB x72 18 Green 1.2V 2133 MT/s Dual 0˚C to +95˚C DDR4 SDRAM 260-pin SODIMM 4GB x64 8 Green 1.2V 2133–2400 MT/s Single 0˚C to +95˚C 8GB x64 16 Green 1.2V 2133–2400 MT/s Dual 0˚C to +95˚C DDR4 SDRAM 288-pin ECC SODIMM 18 Green x72 9 Green 1.35V 1333 MT/s Single 0˚C to +95˚C 4GB x72 9, 18 Green 1.35 –1.5V 1333–1600 MT/s Single, Dual 0˚C to +95˚C 8GB x72 18 Green 1.35–1.5V 1333–1600 MT/s Dual 0˚C to +95˚C 16GB x72 18 Green 1.35V 1600 MT/s Dual 0˚C to +95˚C 2GB x72 9 Green 1.35 –1.5V 1333–1600 MT/s Single 0˚C to +95˚C 4GB x72 9, 18 Green 1.35 –1.5V 1333 MT/s Single, Dual 0˚C to +95˚C 8GB x72 18 Green 1.35V 1600 MT/s Dual –40˚C to +95˚C DDR3 SDRAM 244-pin VLP Mini-UDIMM 4GB x72 2GB DDR3 SDRAM 244-pin Mini UDIMM DDR4 SDRAM 288-pin UDIMM 8GB Modules 2Gb DRAM 16Mb Bus Width Voltage DDR4 SDRAM 288-pin LRDIMM EDW GDDR5 SGRAM Memory 1.2V 2133–2400 MT/s Dual 0˚C to +95˚C 2GB x72 4GB 8GB 9 Green 1.5V 1333 MT/s Single 0˚C to +95˚C, –40˚C to +95˚C x72 9 Green 1.35 V 1333 MT/s Single 0˚C to +95˚C, –40˚C to +95˚C x72 18 Green 1.35V 1600 MT/s Dual 0˚C to +95˚C DDR3 SDRAM 204-pin SODIMM 1GB x64 4, 8 Green 1.35V 1333– 1600 MT/s Single 0˚C to +95˚C 2GB x64 4, 8, 16 Green 1.35–1.5V 1333– 1866 MT/s Single, Dual 0˚C to +95˚C 1600– 1866 MT/s Single, Dual 0˚C to +95˚C 4GB x64 8, 16 Green 1.35V and RS 8GB x64 16 Green 1.35–1.5V and RS 1600–1866 MT/s Dual 0˚C to +95˚C x64 16 Green 1.35V 1866 MT/s Dual 0˚C to +95˚C DDR4 SDRAM 288-pin RDIMM 4GB x72 9 Green 1.2V 2133 MT/s Single 0˚C to +95˚C 8GB x72 18 Green 1.2V 2133 MT/s Single, Dual 0˚C to +95˚C 16GB 16GB x72 36 Green 1.2V 2133 MT/s Dual 0˚C to +95˚C DDR3 SDRAM 204-pin ECC SODIMM DDR4 SDRAM 288-pin VLP RDIMM 4GB x72 18 Green 1.35 V 1333–1600 MT/s Dual 0˚C to +95˚C x72 18 Green 1.35V 1333–1600 MT/s Dual 0˚C to +95˚C 1.35 V 1600 MT/s Quad 0˚C to +95˚C 4GB x72 18 Green 1.2V 2133 MT/s Single 0˚C to +95˚C 8GB 8GB x72 36 Green 1.2V 2133 MT/s Dual 0˚C to +95˚C DDR3 SDRAM 200-pin SORDIMM 16GB 12 Bus Width Yes, Green Density your innovation. our memory. Density x72 36 Green 13 Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range Component Count RoHS Voltage Data Rate Module Ranks Temp Range Yes 1.8V 667 MT/s Single 0˚C to +85˚C 9 Green 1.5V 1333 MT/s Single 0˚C to +95˚C 512MB x72 x72 9, 18 Green 1.35 –1.5V 1333–1866 MT/s Single, Dual 0˚C to +95˚C 1GB x72 9, 18 Yes 1.8V 667– 800 MT/s Single, Dual 0˚C to +85˚C x72 9, 18, 36 Green 1.35–1.5V 1333–1866 MT/s Single, Dual 0˚C to +95˚C 2GB x72 18, 36 Yes, Green 1.8V 667– 800 MT/s Single, Dual 0˚C to +85˚C 8GB x72 18, 36 Green 1.35 –1.5V 1333–1866 MT/s Single, Dual 0˚C to +95˚C 4GB x72 18, 36 Yes 1.8V 667– 800 MT/s Dual 0˚C to +85˚C 16GB x72 18, 36 Green 1.35 –1.5V 1333–1866 MT/s Single, Dual 0˚C to +95˚C 8GB x72 36, 72 Yes 1.8V 667– 800 MT/s Dual, Quad 0˚C to +85˚C 32GB x72 36, 72 Green 1.35 –1.5V 1066–1866 MT/s Dual, Quad 0˚C to +95˚C DDR2 SDRAM 240-pin VLP RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0˚C to +85˚C 1.35–1.5V 1333–1600 MT/s Single, Dual 0˚C to +95˚C 1GB x72 9 Yes 1.8V 667– 800 MT/s Single 0˚C to +85˚C 1GB x72 2GB 4GB DDR3 SDRAM 240-pin VLP RDIMM 9 x72 9, 18 Green 4GB x72 18 Green 1.35–1.5V 1333–1866 MT/s Single, Dual 0˚C to +95˚C, –40˚C to +95˚C 2GB x72 18 Yes 1.8V 667– 800 MT/s Single, Dual 0˚C to +85˚C 8GB x72 18 Green 1.35 –1.5V 1333–1866 MT/s Single, Dual 0˚C to +95˚C 4GB x72 18, 36 Yes 1.8V 667– 800 MT/s Dual 0˚C to +85˚C 16GB x72 36 Green 1.35–1.5V 1333–1866 MT/s Dual, Quad 0˚C to +95˚C DDR2 SDRAM 240-pin FBDIMM 1GB x72 9 Yes 1.8V 667– 800 MT/s Single 0˚C to +95˚C 16GB x72 36 Green 1.35V 1600 MT/s Quad 0˚C to +95˚C 2GB x72 18 Yes 1.8V 667– 800 MT/s Dual 0˚C to +95˚C 32GB x72 72 Green 1.35V–1.5V 1333–1866 MT/s Quad 0˚C to +95˚C 4GB x72 36 Yes 1.8V 667– 800 MT/s Dual, Quad 0˚C to +95˚C 8GB x72 36, 72 Yes 1.8V 667– 800 MT/s Dual, Quad 0˚C to +95˚C DDR3 SDRAM 244-pin Mini-RDIMM 4GB x72 18 Green 1.5V 1333 MT/s Dual 0˚C to +95˚C 8GB x72 18 Green 1.35V 1333 MT/s Dual –40˚C to +95˚C DDR3 SDRAM 244-pin VLP Mini-RDIMM 4GB x72 9 Green 1.35 V 1333 MT/s Single –40˚C to +95˚C 8GB x72 18 Green 1.35V 1333 MT/s Dual 0˚C to +95˚C, –40˚C to +95˚C DDR2 SDRAM 240-pin UDIMM 512MB x64 4 Yes 1.8V 800 MT/s Single 0˚C to +85˚C 1GB x64 8 Green 1.8V 800 MT/s Single 0˚C to +85˚C 2GB x64 16 Yes 1.8V 800 MT/s Dual 0˚C to +85˚C DDR2 SDRAM 240-pin ECC UDIMM DDR2 SDRAM 244-pin Mini-RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0˚C to +85˚C 1GB x72 9 Yes 1.8V 800 MT/s Single 0˚C to +85˚C 2GB x72 18 Yes, Green 1.8V 800 MT/s Dual 0˚C to +85˚C DDR2 SDRAM 244-pin VLP Mini-RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0˚C to +85˚C 1GB x72 9 Yes 1.8V 800 MT/s Single 0˚C to +85˚C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0˚C to +85˚C 4GB x72 18 Yes 1.8V 667 MT/s Dual 0˚C to +85˚C Yes 2.5V 400 MT/s Single 0˚C to +70˚C DDR SDRAM 100-pin UDIMM 512MB x32 8 1GB x72 9 Yes 1.8V 667 – 800 MT/s Single 0˚C to +85˚C 2GB x72 9, 18 Yes 1.8V 667 – 800 MT/s Single, Dual 0˚C to +85˚C DDR SDRAM 168-pin UDIMM 4GB x72 18 Yes 1.8V 667 MT/s Dual 0˚C to +85˚C 64MB x64 4 Yes 3.3V 133 MHz Single 0˚C to +70˚C 128MB x64 4 Yes 3.3V 133 MHz Single 0˚C to +70˚C 256MB x64 8, 16 Yes 3.3V 133 MHz Single, Dual 0˚C to +70˚C 4 Yes 2.5V 400 MT/s Single 0˚C to +70˚C DDR2 SDRAM 200-pin SODIMM 256MB x64 4 Yes 1.8V 667– 800 MT/s Single 0˚C to +85˚C 512MB x64 4, 8 Yes, Green 1.8V 667– 800 MT/s Single, Dual 0˚C to +85˚C 1GB x64 8, 16 Yes, Green 1.8V 667– 800 MT/s Single, Dual 0˚C to +85˚C, –40˚C to 95˚C 256MB x64 2GB x64 8, 16 Yes 1.8V 667– 800 MT/s Single, Dual 0˚C to +85˚C, –40˚C to 95˚C 512MB x64 8 Yes 2.5V 400 MT/s Single 0˚C to +70˚C 4GB x64 16 Yes 1.8V 800 MT/s Dual 0˚C to +85˚C 1GB x64 16 Yes 2.5V 400 MT/s Dual 0˚C to +70˚C x72 1GB 2GB DDR SDRAM 184-pin UDIMM DDR SDRAM 168-pin ECC UDIMM DDR2 SDRAM 200-pin SORDIMM 512MB Modules 2GB DDR3 SDRAM 240-pin LRDIMM your innovation. our memory. Bus Width DDR2 SDRAM 240-pin RDIMM DDR3 SDRAM 240-pin RDIMM 14 Density 9 Yes 1.8V 667 MT/s Single 0˚C to +85˚C 128MB x72 9 Yes 3.3V 133 MHz Single 0˚C to +70˚C x72 9 Yes 1.8V 667– 800 MT/s Single 0˚C to +85˚C 256MB x72 18 Yes 3.3V 133 MHz Dual 0˚C to +70˚C x72 18 Yes 1.8V 800 MT/s Dual 0˚C to +85˚C 15 Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR SDRAM 184-pin ECC UDIMM Density Bus Width Component Count RoHS Voltage Clock Rate Module Ranks Temp Range Yes 3.3V 133 MHz Single 0˚C to +70˚C SDRAM 144-pin SODIMM 512MB x64 9 Yes 2.5V 400 MT/s Single 0˚C to +70˚C 64MB x64 4 1GB x64 18 Yes 2.5V 400 MT/s Dual 0˚C to +70˚C 128MB x64 4, 8 Yes 3.3V 133 MHz Single, Dual 0˚C to +70˚C 256MB x64 8 Yes, 5/6 3.3V 133 MHz Dual 0˚C to +70˚C 512MB x64 16 Yes 3.3V 133 MHz Dual 0˚C to +70˚C DDR SDRAM 144-pin SODIMM 64MB x64 4 Yes 3.3V 133 MHz Single 0˚C to +70˚C 128MB x64 4, 8 Yes 3.3V 133 MHz Single 0˚C to +70˚C SDRAM 168-pin RDIMM 256MB x64 8 Yes 3.3V 133 MHz Single, Dual 0˚C to +70˚C 128MB x72 9 Yes, 5/6 3.3V 133 MHz Single 0˚C to +70˚C 512MB x64 16 Yes 3.3V 133 MHz Dual 0˚C to +70˚C 256MB x72 9 Yes 3.3V 133 MHz Single 0˚C to +70˚C 512MB x72 18 Yes 3.3V 133 MHz Single 0˚C to +70˚C DDR SDRAM 200-pin SODIMM x64 4 Yes 2.5V 333 MT/s Single 0˚C to +70˚C 256MB x64 4 Yes 2.5V 512MB x64 8 Yes 2.5V 333– 400 MT/s Single 0˚C to +70˚C, –40˚C to +95˚C 333– 400 MT/s Single, Dual 0˚C to +70˚C 1GB x64 16 Yes 2.5V 400 MT/s Dual 0˚C to +70˚C DDR SDRAM 200-pin ECC SODIMM 256MB x72 9 Yes 2.5V 333 MT/s Single 0˚C to +70˚C, –40˚C to +95˚C 512MB x72 9 Yes 2.5V 333– 400 MT/s Single 0˚C to +70˚C 1GB x72 18 Yes 2.5V 333– 400 MT/s Dual 0˚C to +70˚C 9 Yes 2.5V 400 MT/s Single 0˚C to +70˚C Modules 128MB Hybrid Memory Cube (HMC) DDR SDRAM 184-pin RDIMM Package Description 15G SR x4 160 896-ball BGA, 31mm x 31mm x 4mm 15G SR x4 160 896-ball BGA, 31mm x 31mm x 4mm 2GB 15G SR x2 120 666-ball FBGA, 16mm x19.5mm x 3.9mm 4GB 15G SR x2 120 666-ball FBGA, 16mm x19.5mm x 3.9mm 512MB x72 9 Yes 2.5V 333– 400 MT/s Single 0˚C to +70˚C 1GB x72 18 Yes 2.5V 333– 400 MT/s Single, Dual 0˚C to +70˚C Hybrid Memory Cube 2GB x72 36 Yes 2.5V 400 MT/s Dual 0˚C to +70˚C 2GB 4GB 0˚C to +70˚C 512MB 1GB Density x72 9 Yes 2.5V 400 MT/s Single x72 18 Yes 2.5V 333 MT/s Dual 0˚C to +70˚C Bus Width Component Count RoHS Voltage Clock Rate Module Ranks Temp Range SDRAM 168-pin UDIMM 64MB x64 4 Yes 3.3V 133 MHz Single 0˚C to +70˚C 128MB x64 4 Yes, 5/6 3.3V 133 MHz Single 0˚C to +70˚C 256MB x64 8, 16 Yes 3.3V 133 MHz Single, Dual 0˚C to +70˚C SDRAM 168-pin ECC UDIMM 128MB x72 9 Yes 3.3V 133 MHz Single 0˚C to +70˚C 256MB x72 18 Yes 3.3V 133 MHz Dual 0˚C to +70˚C Bare Die and Wafer-Level Products Bare Die your innovation. our memory. MAX Effective BW (GB/s) Density HMC Links x72 DDR SDRAM 184-pin VLP RDIMM 16 Link Description (Gb/s) 256MB Requirements for increasingly smaller form factors and higher memory densities are fueling the need for an array of bare die memory solutions. Our bare die offerings are designed to enable you to choose the wafer-level products that best meet your project’s needs. And we’re committed to delivering bare die products that maintain reliability and quality levels similar to our fully tested and burned-in packaged devices. Find out more at micron.com/baredie. 17 NAND Flash Bus Width Voltage Interface Package Temp Range MT29 SLC NAND Flash* Voltage Technology JEDEC Package Temp Range Applications x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0˚C to +70˚C, –40˚C to +85˚C 2Gb x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0˚C to +70˚C, –40˚C to +85˚C 4Gb x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0˚C to +70˚C, –40˚C to +85˚C 8Gb x8, x16 1.8, 3.3V Async (ONFI 1.0)/ Sync (ONFI 2.1) 48-pin TSOP, 63-ball VFBGA, 100-ball VBGA, Wafer 0˚C to +70˚C, –40˚C to +85˚C 48-pin TSOP, 63-ball VFBGA, 100-ball VBGA, Wafer 0˚C to +70˚C, –40˚C to +85˚C 16Gb x8, x16 1.8, 3.3V Async/Sync (ONFI 2.1/2.2) 32Gb x8 3.3V Async/Sync (ONFI 2.1/2.2/3.0) 48-pin TSOP, 100-ball VBGA, 132-ball VBGA 0˚C to +70˚C, –40˚C to +85˚C 64Gb x8 3.3V Async/Sync (ONFI 2.1/2.2/3.0) 48-pin TSOP, 100-ball VBGA, 100-ball TBGA, 132-ball VBGA, 152-ball VBGA 0˚C to +70˚C, –40˚C to +85˚C 128Gb x8 3.3V Async/Sync (ONFI 2.1/2.2/3.0) 48-pin TSOP, 100-ball TBGA, 100-ball LBGA, 132-ball TBGA, 152-ball VBGA 0˚C to +70˚C, –40˚C to +85˚C 256Gb x8 3.3V Async/Sync (ONFI 2.2/3.0) 100-, 132-ball LBGA, 152-ball TBGA 0˚C to +70˚C, –40˚C to +85˚C 512Gb x8 3.3V Async/Sync (ONFI 3.0) 152-ball LBGA 0˚C to +70˚C, –40˚C to +85˚C 128Mb x8 3.3V Async 48-pin TSOP –40˚C to +85˚C 256Mb x8 3.3V Async 48-pin TSOP, 55-ball VFBGA –40˚C to +85˚C 512Mb x8 1.8, 3.3V Async 48-pin TSOP, 63-ball VFBGA –40˚C to +85˚C 2GB x8 3.3VCC (3.3V/1.8V VCCQ) 25nm MLC 4.41 153-ball WFBGA –25˚C to +85˚C Consumer 4GB x8 3.3VCC (3.3V/1.8V VCCQ) 25nm MLC/ 20nm MLC 4.41, 4.51 100-ball LBGA, 153-ball TFBGA, 153-ball WFBGA –25˚C to +85˚C, –40˚C to +85˚C Consumer, Industrial, Automotive 8GB x8 3.3VCC (3.3V/1.8V VCCQ) 25nm MLC/ 20nm MLC 4.41, 4.51, 5.0 100-ball LBGA, 153-ball TFBGA, 153-ball WFBGA –25˚C to +85˚C, –40˚C to +85˚C Consumer, Industrial, Automotive 16GB x8 3.3VCC (3.3V/1.8V VCCQ) 25nm MLC/ 20nm MLC 4.41, 4.51, 5.0 100-ball LBGA, 169-ball TFBGA, 169-ball WFBGA –25˚C to +85˚C, –40˚C to +85˚C Consumer, Industrial, Automotive 32GB x8 3.3VCC (3.3V/1.8V VCCQ) 25nm MLC/ 20nm MLC 4.41, 4.51, 5.0 100-ball LBGA, 169-ball TFBGA, 169-ball VFBGA –25˚C to +85˚C, –40˚C to +85˚C Consumer, Industrial, Automotive 64GB x8 3.3VCC (3.3V/1.8V VCCQ) 25nm MLC/ 20nm MLC 4.41, 4.51, 5.0 169-ball LBGA/LFBGA –25˚C to +85˚C, –40˚C to +85˚C Consumer, Industrial, Automotive Note: Products meet RoHS standards. Enhanced SLC partition up to 100% of the user area. Density Package RoHS Voltage Interface Temp Range MTED and MTFD Embedded USBs 2GB eUSB Yes 5V, 3.3V USB 2.0 0˚C to +70˚C, –40˚C to +85˚C 16Gb x8 3.3V Async/Sync (ONFI 2.2) 48-pin TSOP, Wafer 0˚C to +70˚C, –40˚C to +85˚C 4GB eUSB Yes 5V, 3.3V USB 2.0 0˚C to +70˚C, –40˚C to +85˚C 32Gb x8 3.3V Async/Sync (ONFI 2.2/2.3) 48-pin TSOP, 100-ball VBGA, Wafer 0˚C to +70˚C, –40˚C to +85˚C 8GB eUSB Yes 5V, 3.3V USB 2.0 0˚C to +70˚C, –40˚C to +85˚C 64Gb x8 3.3V Async/Sync (ONFI 2.2/2.3) 48-pin TSOP, 100-ball VBGA, Wafer 0˚C to +70˚C, –40˚C to +85˚C 16GB eUSB Yes 5V, 3.3V USB 2.0 0˚C to +70˚C, –40˚C to +85˚C 48-pin TSOP, 100-ball LBGA, 100-ball TBGA, 132-ball TBGA, 152-ball VBGA, Wafer 0˚C to +70˚C, –40˚C to +85˚C RoHS Voltage 128Gb x8 3.3V Async/Sync (ONFI 2.2/2.3/3.0) 196Gb x8 3.3V Async/Sync (ONFI 3.2) 272-ball VFBGA 0˚C to +70˚C 48-pin TSOP, 100-ball LBGA, 100-ball TBGA, 132-ball TBGA, 152-ball VBGA 0˚C to +70˚C, –40˚C to +85˚C 256Gb x8 3.3V Async/Sync (ONFI 2.2/2.3/3.0) 512Gb x8 3.3V Async/Sync (ONFI 2.2/3.2) 132-ball LBGA, 152-ball TBGA, 272-ball TFBGA 0˚C to +70˚C, –40˚C to +85˚C 1Tb x8 3.3V Async/Sync (ONFI 3.2) 152-ball LBGA, 272-ball TFBGA/LFBGA 0˚C to +70˚C, –40˚C to +85˚C 2Tb x8 3.3V Async/Sync (ONFI 3.2) 152-ball LBGA, 272-ball LFBGA 0˚C to +70˚C Density Bus Width Voltage Technology Package Temp Range Managed NAND 1Gb MT29 MLC NAND Flash* your innovation. our memory. Bus Width MTFC e •MMC Memory for Embedded NAND Small Page (SP) Flash* 18 Density NAND Density Managed NAND Density Bus Width Bits/Cell Package Temp Range MT29 Enhanced ClearNAND Flash Memory 32GB x8 Yes 3.3V MLC 100-ball LBGA 0˚C to +70˚C 64GB x8 Yes 3.3V MLC 100-ball LBGA 0˚C to +70˚C MT29 Serial NAND Flash* 1Gb x1 3.3V SLC 63-ball VFBGA 0˚C to +70˚C, –40˚C to +85˚C 2Gb x1 3.3V SLC 63-ball VFBGA 0˚C to +70˚C, –40˚C to +85˚C 4Gb x1 3.3V SLC 63-ball VFBGA 0˚C to +70˚C, –40˚C to +85˚C *Products meet RoHS standards. 19 Density NOR Flash Density Bus Width RoHS Voltage 1Gb x16 x16 Yes Yes 2.7–3.6V 2.7–3.6V Speed Package Boot Block Temp Range 110ns, 100ns 110ns, 100ns 56-pin TSOP, 64-ball BGA 56-pin TSOP, 64-ball BGA High/Low Lock High/Low Lock –40˚C to +85˚C –40˚C to +85˚C M29DW Parallel NOR Flash Automotive Speed Package Boot Block Temp Range 16Mb x32 Yes, No 2.7–3.6V 45ns, 55ns, 70ns 80-ball LBGA, 80-pin PQFP Bottom Boot –40˚C to +125˚C 32Mb x32 Yes, No 2.7–3.6V 45ns, 55ns 80-ball LBGA, 80-pin PQFP Bottom Boot –40˚C to +125˚C Note: Available in tape and reel. 32Mb x16 Yes 1.7–2.0V 70ns 56-ball VFBGA Bottom Boot –40˚C to +85˚C 64Mb x16 Yes 1.7–2.0V 70ns 56-ball VFBGA Bottom/Top Boot –40˚C to +85˚C 64-ball TBGA Uniform, A/D MUX –40˚C to +105˚C 64-ball TBGA Uniform, A/D MUX –40˚C to +105˚C 64-ball TBGA Uniform, A/D MUX –40˚C to +105˚C 64-ball Easy BGA Uniform, AD, AA/D MUX –40˚C to +85˚C 64-ball Easy BGA Uniform, AD, AA/D MUX –40˚C to +85˚C 64-ball Easy BGA Uniform, AD, AA/D MUX –40˚C to +85˚C Note: Available in tray or tape and reel. G18 Parallel NOR Flash Automotive 256Mb x16 Yes 1.7–2.0V 32Mb x8/x16 Yes 2.7–3.6V 70ns 48-pin TSOP Multibank –40˚C to +85˚C, –40˚C to +125˚C 512Mb x16 Yes 1.7–2.0V 256Mb x16 Yes 2.7–3.6V 70ns 56-pin TSOP Multibank –40˚C to +85˚C, –40˚C to +125˚C 1Gb x16 Yes 1.7–2.0V Note: Available in tray or tape and reel. Note: Available in tray or tape and reel. M29F Parallel NOR Flash Automotive G18 Parallel NOR Flash Embedded x8/x16 Yes 4.5–5.5V 55ns 44-pin SOIC, 48-pin TSOP Bottom/Top Boot –40˚C to +85˚C, –40˚C to +125˚C 256Mb x16 Yes 1.7–2.0V 4Mb x8/x16 Yes, No 4.5–5.5V 55ns 44-pin SOIC, 48-pin TSOP Bottom/Top Boot –40˚C to +85˚C, –40˚C to +125˚C 512Mb x16 Yes 1.7–2.0V 8Mb x8/x16 Yes 4.5–5.5V 55ns 44-pin SOIC, 48-pin TSOP Bottom/Top Boot –40˚C to +85˚C, –40˚C to +125˚C 1Gb x16 Yes 1.7–2.0V 16Mb x8/x16 Yes 4.5–5.5V 55ns 48-pin TSOP Bottom/Top Boot –40˚C to +85˚C, –40˚C to +125˚C M29W Parallel NOR Flash Automotive 104ns, 133 MHz/Sync 104ns, 133 MHz/Sync 104ns, 133 MHz/Sync 96ns, 133 MHz/Sync 96ns, 133 MHz/Sync 96ns, 133 MHz/Sync Note: Available in tray or tape and reel. Also available in AD and AA/D MUX configurations for up to 50%-reduced active ball count. J3 Parallel NOR Flash Embedded 32Mb x8/x16 Yes 2.7–3.6V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm –40˚C to +85˚C 4Mb x8/x16 Yes 2.7–3.6V 55ns 48-pin TSOP, 48-ball TFBGA Bottom/Top Boot –40˚C to +85˚C, –40˚C to +125˚C 64Mb x8/x16 Yes, No 2.7–3.6V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm –40˚C to +85˚C 8Mb x8/x16 Yes 2.7–3.6V 70ns 48-pin TSOP, 48-ball TFBGA Bottom/Top Boot –40˚C to +85˚C, –40˚C to +125˚C 128Mb x8/x16 Yes, No 2.7–3.6V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm –40˚C to +85˚C 16Mb x8/x16 Yes 2.7–3.6V 70ns, 80ns 48-pin TSOP, 48-ball TFBGA Bottom/Top Boot –40˚C to +85˚C, –40˚C to +125˚C 256Mb x8/x16 Yes, No 2.7–3.6V 95ns, 105ns 56-pin TSOP, 64-ball Easy BGA Uniform –40˚C to +85˚C 32Mb x8/x16 Yes 2.7–3.6V 70ns, 80ns 48-pin TSOP, 48-ball TFBGA Bottom/Top Boot –40˚C to +85˚C, –40˚C to +125˚C M28W Parallel NOR Flash Embedded x8/x16 Yes 2.7–3.6V 60ns, 70ns 48-, 56-pin TSOP, 48-ball TFBGA, 64-ball TBGA Bottom/Top Boot, High/Low Lock –40˚C to +85˚C, –40˚C to +125˚C 16Mb x16 Yes 2.7–3.6V 70ns 48-pin TSOP, 46-ball TFBGA Bottom/Top Boot 64Mb –40˚C to +85˚C 32Mb x16 Yes 2.7–3.6V 70ns Bottom/Top Boot –40˚C to +85˚C High/Low Lock –40˚C to +85˚C, –40˚C to +125˚C 48-pin TSOP, 47-ball TFBGA 64Mb x16 Yes 2.7–3.6V 70ns 48-pin TSOP, 48-ball TFBGA Bottom/Top Boot –40˚C to +85˚C 128Mb x8/x16 Yes 2.7–3.6V 70ns 56-pin TSOP, 64-ball FBGA, 64-ball TBGA 256Mb x8/x16 Yes 2.7–3.6V 70ns 56-pin TSOP, 64-ball FBGA High/Low Lock –40˚C to +85˚C, –40˚C to +125˚C 512Mb x8/x16 Yes 2.7–3.6V 70ns 56-pin TSOP Low Lock –40˚C to +85˚C, –40˚C to +125˚C NOR 2Mb Note: Available in tray or tape and reel. your innovation. our memory. Voltage M58WR Parallel NOR Flash Automotive Note: Available in tape and reel. 20 RoHS M58BW Parallel NOR Flash Automotive M29AW Parallel NOR Flash Automotive 512Mb Bus Width Notes: Available in tray or tape and reel. Features: Hardware write protection, OTP space, OTP SD, Krypto® Flex Lock, Krypto Encrypted Access SD. Note: Available in tray or tape and reel. 21 Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range M29DW Parallel NOR Flash Embedded 32Mb x8/x16 Yes 2.7–3.6V Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range P30 Parallel NOR Flash Embedded (continued) 70ns 48-pin TSOP, 48-ball-TFBGA Multibank –40˚C to +85˚C Multibank –40˚C to +85˚C Multibank –40˚C to +85˚C 128Mb x8/x16, x16 Yes 2.7–3.6V 60ns, 70ns 64-ball TBGA, 56-pin TSOP 256Mb x16 Yes 2.7–3.6V 70ns 56-pin TSOP M29EW Parallel NOR Flash Embedded 64Mb x8/x16 Yes 2.7–3.6V 60ns, 70ns 48-, 56-pin TSOP, 64-ball FBGA, 48-ball BGA 128Mb x8/x16 Yes 2.7–3.6V 60ns, 70ns 56-pin TSOP, 64-ball FBGA High/Low Lock, Secure 256Mb x8/x16 Yes 2.7–3.6V 100ns, 110ns 56-pin TSOP, 64-ball FBGA 512Mb x8/x16 Yes 2.7–3.6V 100ns, 110ns 1Gb x8/x16 Yes 2.7–3.6V 2Gb x8/x16 Yes 2.7–3.6V 512Mb x16 Yes 1.7–3.6V 100ns, 110ns 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA Bottom/Top Boot, Uniform –40˚C to +85˚C 1Gb x16 Yes 1.7–2.0V 100ns, 110ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, Uniform –40˚C to +85˚C 2Gb x16 Yes 1.7–3.6V 105ns 64-ball Easy BGA Uniform –40˚C to +85˚C P33 Parallel NOR Flash Embedded Bottom/Top Boot, High/Low Lock, Secure –40˚C to +85˚C 64Mb x16 Yes 2.3–3.6V 60ns, 70ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot –40˚C to +85˚C –40˚C to +85˚C 128Mb x16 Yes 2.3–3.6V 60ns, 70ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP –40˚C to +85˚C High/Low Lock, Secure –40˚C to +85˚C 256Mb x16 Yes, No 2.3–3.6V 85ns, 95ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP –40˚C to +85˚C 56-pin TSOP, 64-ball FBGA High/Low Lock, Secure –40˚C to +85˚C 512Mb x16 Yes 2.3–3.6V 95ns, 105ns 56-pin TSOP, 64-ball FBGA High/Low Lock, Secure Bottom/Top Boot, Uniform, OTP –40˚C to +85˚C 100ns, 110ns 56-pin TSOP, 64-ball Easy BGA –40˚C to +85˚C 100ns 64-ball FBGA High/Low Lock –40˚C to +85˚C 1Gb x16 Yes 2.3–3.6V 95ns, 105ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, Uniform –40˚C to +85˚C Bus Width RoHS M29W Parallel NOR Flash Embedded x8/x16 Yes 2.7–3.6V 55ns, 70ns 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot –40˚C to +85˚C 8Mb x8/x16 Yes 2.7–3.6V 45ns, 70ns 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot –40˚C to +85˚C M25P Serial NOR Flash Automotive (Legacy) 16Mb x8/x16 Yes 2.7–3.6V 70ns 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot –40˚C to +85˚C 1Mb x1 Yes 2.3–3.6V 32Mb x8/x16 Yes 2.7–3.6V 70ns 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot –40˚C to +85˚C 2Mb x1 Yes Bottom/Top Boot, High/Low Lock, Secure 4Mb x1 70ns 64-ball FBGA, 48-ball TFBGA, 48-, 56-pin TSOP, 64-ball TBGA 8Mb 64-ball FBGA, 64-pin LBGA 64-ball TBGA, 56-pin TSOP High/Low Lock, Secure –40˚C to +85˚C 64-ball FBGA, 64-ball TBGA, 56-pin TSOP High/Low Lock –40˚C to +85˚C your innovation. our memory. 64Mb 22 128Mb 256Mb x8/x16 x8/x16 x8/x16 Yes Yes Yes 2.7–3.6V 2.7–3.6V 2.7–3.6V 70ns 70ns Density Voltage Speed Package Type Temp Range 50 MHz 8-pin SOP2 Narrow, 8-pin U-PDFN Data Storage –40˚C to +85˚C, –40˚C to +125˚C 2.7–3.6V 75 MHz 8-pin SOP2 Narrow Data Storage –40˚C to +85˚C, –40˚C to +125˚C Yes 2.3–3.6V 75 MHz 8-pin SOP2 Narrow, 8-pin U-PDFN Data Storage –40˚C to +85˚C, –40˚C to +125˚C x1 Yes 2.7–3.6V 75 MHz 8-pin SOP2 Narrow, 8-pin SOP2 Wide Data Storage –40˚C to +85˚C, –40˚C to +125˚C 16Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SOP2 Narrow, 8-pin SOP2 Wide Data Storage –40˚C to +85˚C, –40˚C to +125˚C 32Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SOP2 Wide, 16-pin SOP2 Data Storage –40˚C to +85˚C, –40˚C to +125˚C 64Mb x1 Yes 2.7–3.6V 75 MHz 16-pin SOP2 Data Storage –40˚C to +85˚C, –40˚C to +125˚C –40˚C to +85˚C NOR 4Mb Note: Available in tray, tube, or tape and reel. P30 Parallel NOR Flash Embedded M25PE Serial NOR Flash Automotive (Page Erase) 64Mb x16 Yes 1.7–2.0V 65ns, 75ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot –40˚C to +85˚C 4Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SOP2 Narrow Page Erase –40˚C to +85˚C Yes 2.7–3.6V 75 MHz 8-pin SOP2 Narrow Page Erase –40˚C to +85˚C Yes, No 1.7–2.0V 65ns, 75ns Bottom/Top Boot, OTP x1 x16 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA 8Mb 128Mb –40˚C to +85˚C Note: Available in tape and reel. 256Mb x16 Yes, No 1.7–2.0V 100ns, 110ns 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA Bottom/Top Boot –40˚C to +85˚C (P30 Parallel NOR Flash Embedded continued on next page) 23 Density Bus Width RoHS Voltage Speed Package Type Temp Range Density Bus Width RoHS Voltage Speed Temp Range 64Mb** x1 Yes 2.7–3.6V 75 MHz 16-pin SO16 Wide, 8-pin V-PDFN (8x6) Data Storage –40˚C to +85˚C 128Mb x1 Yes 2.7–3.6V 75 MHz 8-pin V-PDFN (8x6), 16-pin SO16 Wide Data Storage –40˚C to +85˚C 8Mb x1/x2 Yes 2.7–3.6V 75 MHz 8-pin SOP2 Narrow Dual I/O –40˚C to +85˚C, –40˚C to +125˚C 16Mb x1/x2 Yes 2.7–3.6V 75 MHz 8-pin SOP2 Narrow Dual I/O –40˚C to +85˚C Note: Available in tray, tube, or tape and reel. *N25Q032 suggested for new design. **N25Q064 suggested for new design. 32Mb x1/x2 Yes 2.7–3.6V 75 MHz 8-pin V-PDFN-8, 24-ball T-PBGA-24b05 Dual I/O –40˚C to +85˚C M25PE Serial NOR Flash Embedded Note: Available in tube or tape and reel. 1Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow, KGD Page Erase –40˚C to +85˚C N25Q Serial NOR Flash Automotive (Multiple I/O) 2Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow, KGD Page Erase –40˚C to +85˚C 4Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN (6x5), KGD Page Erase –40˚C to +85˚C 8Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN (6x5) Page Erase –40˚C to +85˚C 16Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Wide, 8-pin V-PDFN (6x5) Page Erase –40˚C to +85˚C 75 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN (6x5) Dual I/O –40˚C to +85˚C Dual I/O –40˚C to +85˚C 32Mb 32Mb x1/x2/x4 Yes x1/x2/x4 Yes 2.7–3.6V 1.7–2.0V 8-pin SP2 Narrow, 16-pin SOP2 Wide, 16-pin SOP2 Multi I/O 108 MHz 8-pin SOP2 Wide Multi I/O –40˚C to +125˚C Multi I/O –40˚C to +85˚C, –40˚C to +125˚C 108 MHz –40˚C to +85˚C, –40˚C to +125˚C 64Mb x1/x2/x4 Yes 1.7–2.0V, 2.7–3.6V 108 MHz 8-pin V-PDFN-8, 8-pin SOP2 Wide, 16-pin SOP2 Wide, 24-ball T-PBGA-24b05 128Mb x1/x2/x4 Yes 2.7–3.6V 108 MHz 8-pin V-PDFN-8, 16-pin SOP2, 24-ball T-PBGA-24b05 Multi I/O –40˚C to +85˚C, –40˚C to +105˚C, –40˚C to +125˚C 256Mb x1/x2/x4 Yes 2.7–3.6V 108 MHz 8-pin V-PDFN-8, 16-pin SOP2, 24-ball T-PBGA-24b05 Multi I/O –40˚C to +85˚C, –40˚C to +125˚C 16Mb x1/x2 Yes 2.3–3.6V 75 MHz 512Mb x1/x2/x4 Yes 2.7–3.6V 108 MHz 16-pin SOP2, 24-ball T-PBGA-24b05 Multi I/O –40˚C to +85˚C, –40˚C to +125˚C 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN (6x5), 24-ball T-PBGA, KGD 32Mb* x1/x2 Yes 2.7–3.6V 75 MHz 8-pin SO8 Wide, 16-pin SO16 Wide, 8-pin V-PDFN (6x5), 24-ball T-PBGA Dual I/O –40˚C to +85˚C 64Mb** x1/x2 Yes 2.7–3.6V 75 MHz 8-pin V-PDFN (8x6), 16-pin SO16 Wide Dual I/O –40˚C to +85˚C Note: Available in tray, tube, or tape and reel. M25PX Serial NOR Flash Embedded 8Mb x1/x2 Yes 2.3–3.6V Note: Available in tape and reel. 256Mb x1/x2/x4/x8 Yes 2.7–3.6V 108 MHz 16-pin SOP2 Dual QSPI –40˚C to +105˚C 512Mb x1/x2/x4/x8 Yes 2.7–3.6V 108 MHz 16-pin SOP2 Dual QSPI –40˚C to +105˚C Note: Available in tube or tape and reel. Available in 1S#/1CLK or 2S#/2CLK configuration, with or without HW RESET#. Density Bus Width RoHS Voltage Speed Package Type Temp Range 50 MHz 8-pin SO8 Narrow Data Storage –40˚C to +85˚C 50 MHz 8-pin U-PDFN (2x3), 8-pin SO8 Narrow, 8-pin V-PDFN (6x5), KGD Data Storage –40˚C to +85˚C Data Storage –40˚C to +85˚C Note: Available in tray, tube, or tape and reel. *N25Q032 suggested for new design. **N25Q064 suggested for new design. M45PE Serial NOR Flash Embedded 1Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow Page Erase –40˚C to +85˚C 2Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow Page Erase –40˚C to +85˚C 4Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN (6x5) Page Erase –40˚C to +85˚C 8Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN (6x5) Page Erase –40˚C to +85˚C 16Mb x1 Yes 2.7–3.6V 75 MHz 8-pin V-PDFN (6x5), 8-pin SO8 Wide Page Erase –40˚C to +85˚C M25P Serial NOR Flash Embedded 512K 1Mb x1 x1 Yes Yes 2.3–3.6V 2.3–3.6V 2Mb x1 Yes 2.3–3.6V 75 MHz 8-pin V-PDFN (6x5), 8-pin SO8 Narrow, KGD 4Mb x1 Yes 2.3–3.6V 75 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN (2x3), 8-pin V-PDFN (6x5) Data Storage –40˚C to +85˚C N25Q Serial NOR Flash Embedded 8Mb x1 Yes 2.7–3.6V 75 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN (4x3), 8-pin V-PDFN (6x5) Data Storage –40˚C to +85˚C 16Mb x1/x2/x4 Yes 1.7–2.0V 108 MHz 8-pin XF-SCSP (2x2.8), 8-pin SO8 Narrow Multi I/O –40˚C to +85˚C 75 MHz 16-pin SO16 Wide, 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN (4x3), 8-pin V-PDFN (6x5), 8-pin V-PDFN (8x6), KGD Data Storage 32Mb x1/x2/x4 Yes 1.7–2.0V, 2.7–3.6V 108 MHz 8-pin SO8 Wide, 8-pin SO8 Narrow, 8-pin SO16 Wide, 8-pin U-PDFN (4x3), 8-pin V-PDFN (6x5), KGD Multi I/O –40˚C to +85˚C 16-pin SO16 Wide, 8-pin SO8 Wide, 8-pin V-PDFN (6x5), 8-pin V-PDFN (8x6) 64Mb x1/x2/x4 Yes 1.7–2.0V, 2.7–3.6V 108 MHz 8-pin SO8 Wide, 8-pin V-PDFN (6x5, 8x6), 16-pin SO16 Wide, 24-ball T-PBGA, KGD Multi I/O –40˚C to +85˚C Data Storage 128Mb x1/x2/x4 Yes 1.7–2.0V, 2.7–3.6V 108 MHz 16-pin SO16 Wide, 24-ball T-PBGA, 8-pin V-PDFN (6x5, 8x6), 8-pin SO8 Wide, KGD Multi I/O –40˚C to +85˚C 16Mb 32Mb* x1 x1 Yes Yes 2.7–3.6V 2.7–3.6V 75 MHz –40˚C to +85˚C Note: Available in tray, tube, or tape and reel. –40˚C to +85˚C Note: Available in tray, tube, or tape and reel. *N25Q032 suggested for new design. (M25P Serial NOR Flash Embedded continued on next page) NOR MT25T Serial NOR Flash Automotive (Twin QSPI, x8) your innovation. our memory. Type M25P Serial NOR Flash Embedded (continued) M25PX Serial NOR Flash Automotive (Dual I/O) 24 Package (N25Q Serial NOR Flash Embedded continued on next page) 25 Density Bus Width RoHS Voltage Speed Package Type Temp Range N25Q Serial NOR Flash Embedded (continued) 256Mb x1/x2/x4 Yes 1.7–2.0V, 2.7–3.6V 108 MHz 8-pin V-PDFN (8x6), 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O –40˚C to +85˚C 512Mb* x1/x2/x4 Yes 1.7–2.0V, 2.7–3.6V 108 MHz 8-pin V-PDFN (8x6), 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O –40˚C to +85˚C 1Gb** x1/x2/x4 Yes 1.7–2.0V, 2.7–3.6V 108 MHz 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O –40˚C to +85˚C Solid State Drives (SSDs) Capacity Form Factor Height MT/s Read Performance Write Performance Voltage Interface Operating Temp M500 Self-Encrypting Drive Client SATA SSD Note: Available in tray, tube, or tape and reel. *MT25x512 suggested for new design. **MT25x01 suggested for new design. 120GB 2.5in 7mm 6.0 Gb/s 500 MB/s 130 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C MT25Q Serial NOR Flash Embedded 240GB 2.5in 7mm 6.0 Gb/s 500 MB/s 250 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 480GB 2.5in 7mm 6.0 Gb/s 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 512Mb 1Gb 2Gb x1/x2/x4 x1/x2/x4 x1/x2/x4 Yes 1.7–2.0V, 2.7–3.6V Yes 1.7–2.0V, 2.7–3.6V Yes 1.7–2.0V, 2.7–3.6V Note: Available in tray, tube, or tape and reel. 133 MHz 133 MHz 133 MHz SO16 Wide, 24-ball TPBGA 24-ball TPBGA 24-ball TPBGA Multi I/O Multi I/O Multi I/O –40˚C to +85˚C –40˚C to +85˚C –40˚C to +85˚C 960GB 2.5in 7mm 6.0 Gb/s 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 120GB mSATA 3.75mm 6.0 Gb/s 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 240GB mSATA 3.75mm 6.0 Gb/s 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 480GB mSATA 3.75mm 6.0 Gb/s 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 120GB M.2 3.5mm 6.0 Gb/s 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 240GB M.2 3.5mm 6.0 Gb/s 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 480GB M.2 3.5mm 6.0 Gb/s 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 2.5in 7mm 6.0 Gb/s 550 MB/s 190 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 128GB 2.5in 7mm 6.0 Gb/s 550 MB/s 350 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 256GB 2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 512GB 2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 1024GB 2.5in 7mm 6.0 Gb/s 550MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 64GB 2.5in 5mm 6.0 Gb/s 550 MB/s 190 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 128GB 2.5in 5mm 6.0 Gb/s 550 MB/s 350 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 256GB 2.5in 5mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 512GB 2.5in 5mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 1024GB 2.5in 5mm 6.0 Gb/s 550MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 64GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 190 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 128GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 350 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 256GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 512GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 64GB M.2 3.5mm 6.0 Gb/s 550 MB/s 190 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 128GB M.2 3.5mm 6.0 Gb/s 550 MB/s 350 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 256GB M.2 3.5mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 512GB M.2 3.5mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C SSDs 26 64GB NOR your innovation. our memory. M550 Self-Encrypting Drive Client SATA SSD* Note: *Available in self-encrypting drive (SED) and non-SED versions. 27 Capacity Form Factor Height MT/s Read Performance Write Performance Voltage Interface Operating Temp 28 Form Factor Height Random Read Random Write Sequential Read Sequential Write Voltage Interface Operating Temp 2.1K IOPS 500 MB/s 130 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C M500 Enterprise SATA SSD 128GB 2.5in 7mm 6.0 Gb/s 520 MB/s 150 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 120GB 2.5in 7mm 54K IOP/s 256GB 2.5in 7mm 6.0 Gb/s 520 MB/s 300 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 240GB 2.5in 7mm 60K IOP/s 3K IOPS 500 MB/s 250 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 128GB 2.5in 5mm 6.0 Gb/s 520 MB/s 150 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 480GB 2.5in 7mm 63K IOP/s 3.7K IOPS 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 256GB 2.5in 5mm 6.0 Gb/s 520 MB/s 300 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 960GB 2.5in 7mm 64K IOP/s 3.8K IOPS 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C mSATA 3.75mm 54K IOP/s 2.1K IOPS 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 128GB mSATA 3.75mm 6.0 Gb/s 520 MB/s 150 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 120GB 256GB mSATA 3.75mm 6.0 Gb/s 520 MB/s 300 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 240GB mSATA 3.75mm 60K IOP/s 3K IOPS 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 128GB M.2 3.5mm 6.0 Gb/s 520 MB/s 150 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 480GB mSATA 3.75mm 63K IOP/s 3.7K IOPS 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 256GB M.2 3.5mm 6.0 Gb/s 520 MB/s 300 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 120GB M.2 3.5mm 54K IOP/s 2.1K IOPS 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C Note: *Available in self-encrypting drive (SED) and non-SED versions. 240GB M.2 3.5mm 60K IOP/s 3K IOPS 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C M550 Client SATA SSD 480GB M.2 3.5mm 63K IOP/s 3.7K IOPS 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 64GB 2.5in 7mm 6.0 Gb/s 550 MB/s 190 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 128GB 2.5in 7mm 6.0 Gb/s 550 MB/s 350 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 256GB 2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 512GB 2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 1024GB 2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 64GB 2.5in 5mm 6.0 Gb/s 550 MB/s 190 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 128GB 2.5in 5mm 6.0 Gb/s 550 MB/s 350 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 256GB 2.5in 5mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 512GB 2.5in 5mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 1024GB 2.5in 5mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 64GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 190 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 128GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 350 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 256GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 512GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 64GB M.2 3.5mm 6.0 Gb/s 550 MB/s 190 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 128GB M.2 3.5mm 6.0 Gb/s 550 MB/s 350 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 256GB M.2 3.5mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 512GB M.2 3.5mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C M510 Client SATA SSD 128GB 2.5in 7mm 6.0 Gb/s 520 MB/s 150 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 256GB 2.5in 7mm 6.0 Gb/s 520 MB/s 300 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 128GB 2.5in 5mm 6.0 Gb/s 520 MB/s 150 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 256GB 2.5in 5mm 6.0 Gb/s 520 MB/s 300 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 128GB mSATA 3.75mm 6.0 Gb/s 520 MB/s 150 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 256GB mSATA 3.75mm 6.0 Gb/s 520 MB/s 300 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 128GB M.2 3.5mm 6.0 Gb/s 520 MB/s 150 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C 256GB M.2 3.5mm 6.0 Gb/s 520 MB/s 300 MB/s 3.3V SATA 6.0 Gb/s 0˚C to +70˚C Note: M500 enterprise specifications listed here show the results of running enterprise test suites on a Micron M500 drive. We present them due to the interest in the M500 from enterprise customers. This is the same product as Micron’s M500 client drive and can be ordered using the same part numbers. M500DC Enterprise SATA SSD 120GB 1.8in 5mm 63K IOP/s 23K IOPS 425 MB/s 200 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 240GB 1.8in 5mm 63K IOP/s 33K IOPS 425 MB/s 330 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 480GB 1.8in 5mm 63K IOP/s 35K IOPS 425 MB/s 375 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 800GB 1.8in 5mm 65K IOP/s 24K IOPS 425 MB/s 375 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 120GB 2.5in 7mm 63K IOP/s 23K IOPS 425 MB/s 200 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 240GB 2.5in 7mm 63K IOP/s 33K IOPS 425 MB/s 330 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 480GB 2.5in 7mm 63K IOP/s 35K IOPS 425 MB/s 375 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C 800GB 2.5in 7mm 65K IOP/s 24K IOPS 425 MB/s 375 MB/s 5V SATA 6.0 Gb/s 0˚C to +70˚C P320h Enterprise PCIe SSD 175GB 2.5in 15mm up to 415K IOPS up to 145K IOPS up to 1.75 GB/s up to 1.1 GB/s 12V x4 PCIe Gen2 0˚C to +85˚C 350GB 2.5in 15mm up to 415K IOPS up to 145K IOPS up to 1.75 GB/s up to 1.1 GB/s 12V x4 PCIe Gen2 0˚C to +85˚C 350GB HHHL 14.47mm up to 785K IOPS up to 205K IOPS up to 3.2 GB/s up to 1.9 GB/s 12V x8 PCIe Gen2 0˚C to +85˚C 700GB HHHL 14.47mm up to 785K IOPS up to 205K IOPS up to 3.2 GB/s up to 1.9 GB/s 12V x8 PCIe Gen2 0˚C to +85˚C P420m Enterprise PCIe SSD 350GB 2.5in 15mm up to 400K IOPS up to 51K IOPS up to 1.7 GB/s up to 500 MB/s 12V x4 PCIe Gen2 0˚C to +85˚C 700GB 2.5in 15mm up to 400K IOPS up to 51K IOPS up to 1.7 GB/s up to 500 MB/s 12V x4 PCIe Gen2 0˚C to +85˚C 700GB HHHL 14.71mm up to 750K IOPS up to 95K IOPS up to 3.3 GB/s up to 630 MB/s 12V x8 PCIe Gen2 0˚C to +85˚C 1.4TB HHHL 14.71mm up to 750K IOPS up to 95K IOPS up to 3.3 GB/s up to 630 MB/s 12V x8 PCIe Gen2 0˚C to +85˚C SSDs your innovation. our memory. M510 Self-Encrypting Drive Client SATA SSD* Capacity 29 Multichip Packages Bus Width LPDDR Density Secondary Bus Width Voltage Clock Rate Package Temp Range MT29C NAND Flash + LPDDR MCPs 512Mb x16, x32 1.7–1.9V 200 MHz 130-ball, 8.0 x 9.0 x 1.0mm –40˚C to +85˚C 2Gb x8, x16 1Gb x16, x32 1.7–1.9V 200 MHz 130-ball, 8.0 x 9.0 x 1.0mm, 137-ball, 10.5 x 13.0 x 1.1mm –40˚C to +85˚C Micron Technology 4Gb x8, x16 2Gb x32 1.7–1.9V 208 MHz 130-ball, 8.0 x 9.0 x 1.0mm, 137-ball, 10.5 x 13.0 x 1.1mm –40˚C to +85˚C Product Family 4Gb x16 4Gb x32 1.7–1.9V 208 MHz 168-ball, 12 x 12 x 1mm –40˚C to +85˚C 8Gb x16 4Gb x32 1.7–1.9V 208 MHz 137-ball, 10.5 x 13.0 x 1.1mm, 137-ball, 12 x 12 x 1mm –40˚C to +85˚C Bus Width LPDDR2 Density Secondary Bus Width Die Revision Designator Special Processing 40= DDR4 SDRAM 41= DDR3 SDRAM 42= Mobile LPDDR2 44= RLDRAM® 3 Memory 46= DDR SDRAM/ Mobile LPDDR 47= DDR2 SDRAM 48= SDRAM/ Mobile LPSDR 49= RLDRAM 1 & 2 Memory 52= Mobile LPDDR3 Process Technology Voltage Clock Rate Package Temp Range A = 1.2V VDD CMOS C = 5.0V VCC CMOS G = 3.0V VDD CMOS H = 1.8V VDD CMOS HC = 1.8V VDD CMOS, 1.2V I/O J = 1.5V VDD CMOS MT29R NAND Flash + LPDDR2 MCPs K = 1.35V VDD CMOS L = 1.2V VDD CMOS LC= 3.3V VDD CMOS N = 1.0V VDD CMOS R = 1.55V VDD CMOS V = 2.5V VDD CMOS 1Gb x16 512Mb x16 1.7–1.9V 400 MHz 121-ball, 7.5 x 8.0 x 0.8mm –25˚C to +85˚C, –40˚C to +85˚C 2Gb x8 1Gb x32 1.7–1.9V 400 MHz 162-ball, 8.0 x 10.5 x 0.8mm –25˚C to +85˚C Device Number (depth, width) 2Gb x8 1Gb x32 1.7–1.9V 533 MHz 162-ball, 8.0 x 10.5 x 0.8mm –40˚C to +85˚C 4Gb x8 2Gb x32 1.7–1.9V 533 MHz 162-ball, 11.5 x 13.0 x 0.9mm –25˚C to +85˚C Blank = Bits K=Kilobits 4Gb x8 2Gb x32 1.7–1.9V 533 MHz 162-ball, 8.0 x 10.5 x 0.8mm –40˚C to +85˚C Note: Products meet RoHS standards. NOR Density NOR Family PSRAM Density LPDDR Density Bus Width Voltage Sync Clock Rate Package Temp Range MT38 NOR Flash-Based MCPs 32Mb WR 16Mb NA x16 1.7–1.95V 66 MHz 64Mb WR 16Mb NA x16 1.7–1.95V 66 MHz 64Mb WR 32Mb NA x16 1.7–1.95V 128Mb LR 32Mb NA x16 1.7–1.95V 128Mb LR 64Mb NA x16 256Mb LR 64Mb NA x16 256Mb –40˚C to +85˚C 66 MHz 52-ball TFBGA, 6 x 4mm (AD-MUX); 88-ball TFBGA, 8 x 10mm 80 MHz 88-ball TFBGA, 8 x 10mm –40˚C to +85˚C 1.7–1.95V 80 MHz 56-ball TFBGA, 8 x 6mm (AD-MUX) –40˚C to +85˚C 1.7–1.95V 80 MHz 88-ball TFBGA, 8 x 10mm –40˚C to +85˚C 133 MHz 56-ball TFBGA, 8 x 8mm (AD-MUX) –40˚C to +85˚C –40˚C to +85˚C –40˚C to +85˚C M18 128Mb NA x16 1.7–1.95V 256Mb LR NA 512Mb x16/ x16 1.7–1.95V 80 MHz 133-ball TFBGA, 8 x 8mm –40˚C to +85˚C 256Mb M18 NA 512Mb x16/ x16 1.7–1.95V 133 MHz 133-ball TFBGA, 8 x 8mm –40˚C to +85˚C 512Mb M18 NA 512Mb x16/ x16 1.7–1.95V 133 MHz 133-ball TFBGA, 8 x 8mm –40˚C to +85˚C 512Mb M18 128Mb NA x16 1.7–1.95V 133 MHz 56-ball TFBGA, 8 x 8mm (AD-MUX) –40˚C to +85˚C Note: Products meet RoHS standards. IT ES :A M= Megabits G=Gigabits Blank = Production ES = Engineering Sample MS = Mechanical Sample Operating Temperatures Blank = Commercial Temperature IT1 = Industrial Temperature AT = Automotive Temperature WT = Wireless Temperature 1The number one (1) and the capital letter “I” utilize the same laser mark—“I” Special Options (Multiple processing codes are separated by a space and are listed in hierarchical order.) A = Automotive M = Reduced Standby L = Low Power X = Product Longevity G = Graphics Program (PLP) Access/Cycle Time Device Versions Alphanumeric character(s) specified by individual data sheet. L2, S2, and S4 devices are made with dual die in package. DRAM Technology Mobile devices C1 = Single die, 2n prefetch C2 = 2-die stack, 2n prefetch D1 = Single die, 4n prefetch D2 = 2-die stack, 4n prefetch D4 = 4-die stack, 4n prefetch LA=2-die stack, reduced-page-size addressing LF =Single die, standard addressing LG=Single die, reduced-page-size addressing L2=2-die stack, standard addressing L4=4-die stack, standard addressing R4=4-die stack, reduced-page-size addressing All DRAM RLDRAM only Blank = Common I/O C = Separate I/O Package Codes Lead Plating Pb-Free/RoHS- Compliant Plating Package Description 2, 3 DDR4 SDRAM – – – HA HX TRF Part Numbering Guides x8, x16 NAND Density your innovation. our memory. MT 48 A 128M16 D1 KL - 25 1Gb Note: Products meet RoHS standards. 30 DDR4, DDR3, DDR2, DDR, SDRAM, Mobile LPDDR2/LPDDR/LPSDR, and RLDRAM® Memory MCPs NAND Density Part Numbering Guides FBGA (96-ball, 9 x 14) FBGA (78-ball, 9 x 11.5) FBGA (Twindie®, 78-ball, 9 x 11.5) Package codes and descriptions continued on next page. Speed Grade Mark Speed Grade Mark -0 -A t RAC Access Time Untested Untested MAX Clock Frequency PC Targets CL-tRCD-tRP 933 MHz 933 MHz 1067 MHz 1067 MHz 1200 MHz 13-13-13 14-13-13 15-15-15 16-15-15 16-16-16 400 MHz 400 MHz 533 MHz 533 MHz 667 MHz 667 MHz 667 MHz 800 MHz 800 MHz 933 MHz 1067 MHz 6-6-6 5-5-5 8-8-8 7-7-7 10-10-10 9-9-9 8-8-8 11-11-11 10-10-10 13-13-13 14-14-14 DDR4 SDRAM -107E -107H -093E -093H -083E DDR3 SDRAM -25 -25E -187 -187E -15 -15E -15F -125 -125E -107 -093 Access/cycle time continued on next page. 31 DRAM Component Part Numbering (Continued) GDDR5 Part Numbering Package Codes Lead Plating Pb-Free/ RoHSPlating Access/Cycle Time Package Description 2, 3 DDR3 SDRAM Mobile LPDDR3 DA HA HX JP JT RA RE RH SHM STA SMA SLD THD THE THG THV THA TNA THW TRF F BGA (78-ball, 8 x 10.5) FBGA (96-ball, 9 x 14) FBGA (78-ball, 9 x 11.5) FBGA (78-ball, 8 x 11.5) FBGA (96-ball, 8 x 14) FBGA (78-ball, 10.5 x 12) FBGA (96-ball, 10.5 x 12) FBGA (78-ball, 9 x 10.5) FBGA (QuadDie, 78-ball, 10.5 x 12) FBGA (QuadDie, 3DS, 78-ball, 10.5 x 12) FBGA (QuadDie, 78-ball, 9.5 x 11.5) FBGA (TwinDie, 136-ball, 10 x 14) FBGA (TwinDie, 78-ball, 9 x 11.5 x 1.2) FBGA (TwinDie, 78-ball, 10.5 x 12) FBGA (TwinDie, 3DS, 78-ball, 10.5 x 12) FBGA (TwinDie, 78-ball, 8 x 11.5) FBGA (QuadDie, 78-ball, 10 x 11.5) FBGA (TwinDie, 96-ball, 10x14, x8 + x8) FBGA (QuadDie, 78-ball, 8 x 11.5) FBGA (TwinDie, 78-ball, 9.5 x 11.5) DDR2 SDRAM FP FG JN HW F6 FN HV HW PK – – – – – – BP BG CF HR B6 BN HQ HR RT HG EB WTR THM THN THN – – WTR THT FBGA (60-ball, 8 x 12) FBGA (84-ball, 8 x 14) FBGA (60-ball, 8 x 10) FBGA (84-ball, 8 x 12.5) FBGA (60-ball, 10 x 10) FBGA (84-ball, 10 x 12.5) FBGA (60-ball, 8 x 11.5) FBGA (84-ball, 8 x 12.5) FBGA (84-ball, 9 x 12.5) FBGA (60-ball, 84-ball, 11.5 x 14) FBGA (60-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 12 x 14) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 8 x 10 [1Gb, 50nm only]) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (Quad die, 65-ball, 9 x 11.5) your innovation. our memory. DDR SDRAM 32 Package Description 2, 3 CV FG FN CY BG BN TG P FBGA (84-ball, 60-ball, 8 x 12.5) FBGA (84-ball, 60-ball, 8 x 14) FBGA (54-ball, 60-ball, 84-ball, 10 x 12.5) TSOP (Type II) SDRAM FB FG BB BG F4 F5 TG xTG B4 B5 P xP FBGA (60-ball, 8 x 16) VFBGA (54-ball); FBGA (84-ball, 60-ball, 8 x 14) VFBGA (54-ball, 8 x 8) VFBGA (90-ball, 8 x 13) TSOP (Type II) Stacked TSOP, x = internal stacking code EL EM EN ET WFBGA (178-ball SDP, 11 x 11.5 x 0.8) VFBGA (178-ball DDP, 11 x 11.5 x 0.9) VFBGA (253-ball DDP, 11.5 x 11.5 x 0.9) TFBGA (178-ball QDP, 11 x 11.5 x 1.2) Mobile LPDDR2 AB AC EU EV GU GV KH KJ KL KP KQ KU KV LC LD LE LF LG LH LK LL LM MA MC MG MH MP PoP (121-ball SDP, 6.5 x 8 x 0.8) PoP (134-ball DDP ICE, 10 x 11.5 x .65) PoP (253-ball DDP, 11 x 11 x 0.9) PoP (253-ball DDP, 11 x 11 x 1.2) PoP (134-ball SDP, 10 x 11 x 0.7) PoP (134-ball DDP, 10 x 11 x .85) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball QDP, 12 x 12 x 1) PoP (168-ball SDP & DDP, 12 x 12 x 0.8) PoP (168-ball QDP, 12 x 12 x 1) PoP (168-ball JD32, 12 x 12 x 0.75) PoP (216-ball 3DP, 12 x 12 x 0.9) PoP (216-ball SDP, 12 x 12 x 0.65) PoP (240-ball QDP, 14 x 14 x 1) PoP (220-ball QDP, 14 x 14 x 1) PoP (168-ball 3DP, 12 x 12 x 1, 0.35mm ball) PoP (168-ball SDP , 12 x 12 x 0.75) PoP (168-ball DDP, 12 x 12 x 0.8) PoP (216-ball SDP, 12 x 12 x 0.65) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball QDP, 12 x 12 x 1) PoP (168-ball SDP, 12 x 12 x 0.7) PoP (240-ball DDP, 14 x 14 x 0.8) PoP (134-ball QPD, 11.5 x 11.5 x 1.2) PoP (134-ball QPD, 11 x 11.5 x 1) PoP (220-ball DDP, 14 x 14 x 0.8) Mobile LPDDR BF B5 B7 CK CM CX JV KQ MA VFBGA (60-ball SDP, 8 x 9 x 1) VFBGA (90-ball SDP, 8 x 13 x 1) VFBGA (60-ball SDP, 10 x 10 x 1) VFBGA (60-ball SDP, 10 x 11.5 x 1) VFBGA (90-ball SDP, 10 x 13 x 1) VFBGA (90-ball SDP, 9 x 13 x 1) PoP (168-ball QDP, 12 x 12 x 1) PoP (168-ball DDP, 12 x 12 x 0.75) PoP (168-ball SDP, 12 x 12 x 0.7) Mobile LPSDR B4 B5 BF VFBGA (54-ball SDP, 8 x 8) VFBGA (90-ball SDP, 8 x 13 x 1) VFBGA (60-ball SDP, 8 x 9 x 1) RLDRAM 1 and 2 FM HU BM HT µBGA (144-ball, 11 x 18.5) FBGA (144-ball, 11 x 18.5) RLDRAM 3 PA RB PKM RCT 2Due FBGA (168-, 169-ball, 13.5 x 13.5 x 1.2) SDP FBGA (168-, 169-ball, 13.5 x 13.5 x 1.45) DDP to space limitations, FBGA- and µBGA-packaged components and flip chips in packages have an abbreviated part mark that is different from the part number. See our Web site for more information on abbreviated component marks. 3Dimensions in millimeters. Note: Some device offerings are available in a VFBGA rather than an FBGA package; this is noted on the data sheet. Speed Grade Mark MAX Clock Frequency PC Targets CL-tRCD-tRP E D W 40 32 B A BG - 70 - F Micron Technology Environment Code F = Lead free (RoHS compliant) and halogen free DDR2 SDRAM -5E -37E -3 -3E -25 -25E -187E 200 MHz 267 MHz 333 MHz 333 MHz 400 MHz 400 MHz 533 MHz 3-3-3 4-4-4 5-5-5 4-4-4 6-6-6 5-5-5 7-7-7 Type Speed D = Packaged device 7A= 7 Gb/s 70= 7 Gb/s 6A= 6 Gb/s 60= 6 Gb/s 50= 5 Gb/s Product Family W=GDDR5 DDR SDRAM -75 -6T -6 -5B 133 MHz 167 MHz 167 MHz 200 MHz 2.5-3-3 2.5-3-3 2.5-3-3 3-3-3 133 MHz 133 MHz 143 MHz 167 MHz 167 MHz 183 MHz 200 MHz 3-3-3 2-2-2 3-3-3 3-3-3 3-3-3 3-3-3 3-3-3 SDRAM -75 -7E -7 -6 -6A -55 -5 Package Code Density/Bank BG = FBGA 20= 2Gb/16 bank 40= 4Gb/16 bank Die Revision Power Supply Organization B = 1.5V, VDD 32= x32 Mobile LPDDR3 -15 -125 667 MHz 800 MHz 10-10-10 12-12-12 Part Numbering Guides – – – – – – – – – – – – – – – – – – – – Pb-Free/ RoHSPlating Hybrid Memory Cube Part Numbering Mobile LPDDR2 -18 -25 -3 -37 -5 533 MHz 400 MHz 333 MHz 266 MHz 200 MHz Mobile LPDDR -75 -6 -54 -5 -48 133 MHz 167 MHz 185 MHz 200 MHz 208 MHz Mobile LPSDR -8 -75 -6 125 MHz 133 MHz 167 MHz RLDRAM 1 and 2 -5 -33 -25 -25E -18 200 MHz 300 MHz 400 MHz4 400 MHz5 533 MHz RLDRAM 3 -125 -125E -107 -107E -093 -093E 800 MHz6 800 MHz7 933 MHz 7 933 MHz8 1067 MHz7 1067 MHz8 with tRC 20ns. with tRC 15ns. 6Available with tRC (MIN) 12ns. 7Available with tRC (MIN) 10ns. 8Available with tRC (MIN) 8ns. 4Available MT 43 A 04G 04 01 00 NGF - S15 Micron Technology ES :A Die Revision Designator Special Processing Product Family 43= HMC Blank = Production ES = Engineering Sample MS = Mechanical Sample DRAM Voltage A= 1.2V VDD CMOS Operating Temperatures DRAM Die Density per Layer Blank = Standard Temperature G = Gigabits Number of DRAM Die in Package Special Options Blank = No Special Options Link Description Logic Design Designator Sequential Number for Product Variations Package Codes Codes Package Description (mm) NFA NFH NGF NGK BBGA (896-ball, 4 DRAM high, 31 x 31 x 4) BBGA (896-ball, 8 DRAM high, 31 x 31 x 4) BFBGA (666-ball, 4 DRAM high, 16 x 19.5 x 3.9) BFBGA (666-ball, 8 DRAM high, 16 x 19.5 x 3.9) Electrical & Physical Link Specification SerDes I/O Interface -515 -U10 15 Gb/s 10 Gb/s 5Available 33 NOR MCP Part Numbering MCP NAND/NOR + LPDDR1 Part Numbering MT 29C 1G 12M A A C A KC - xx MT 38W 203 3 A 9 0 2 ZQx* Z W XQ5 - ES Micron Technology Production Status Blank = Production ES = Engineering Sample MS = Mechanical Sample Product Family 38L= NOR L-Series + xNAND + xDRAM 38M= NOR M-Series + xNAND + xDRAM 38W= NOR W-Series + xNAND + xDRAM Die Revision Code Contact factory Density NOR xNAND xDRAM 0 1 2 3 4 5 6 7 8 9 A B C D – 32Mb = 4MB 64Mb = 8MB 128Mb = 16MB 256Mb = 32MB 512Mb = 64MB 768Mb = 96MB 1Gb = 128MB 1.25Gb = 160MB 1.5Gb = 192MB 1.75Gb = 224MB 2Gb = 256MB 3Gb = 384MB 4Gb = 512MB N/A – 16Mb = 2MB 32Mb = 4MB 64Mb = 8MB 128Mb = 16MB 256Mb = 32MB 384Mb = 48MB 512Mb = 64MB 768Mb = 96MB 1Gb = 128MB 1.5Gb = 192MB 2Gb = 256MB 3Gb = 384MB 4Gb = 512MB Operating Temperature Range Special Options Contact factory Package Code NOR xDRAM 1 2 3 4 1.8V 3.0V 1.8–3.0V 3.0V 1.8V 3.0V 1.8–3.0V 3.0V your innovation. our memory. Die Count 34 Mark NOR xDRAM A B 1 1 1 2 = a null character used as a placeholder xDRAM Description 0 = N/A 1 = Async PSRAM 2 = Sync PSRAM, No MUX 3 = Sync PSRAM, A/D MUX 4 = Sync PSRAM, AA/D MUX 5 = x16 DDR, 1KB Page 6 = x16 DDR, 2KB Page 7 = x16 DDR, 4KB Page 8 = x32 DDR, 4KB Page NAND Description NOR Configuration Mark Boot MUX 1 2 3 4 5 6 7 8 9 A B C Uniform Uniform Uniform Uniform Bottom Bottom Bottom Bottom Top Top Top Top NO AD A/D, AA/D** AA/D NO A/D A/D, AA/D** AA/D NO A/D A/D, AA/D** AA/D **AA/D ZA = 44-ball VBGA (7.5 x 5 x 1), F10x4+4, 0.5 19Z = 64-ball VBGA (7.7 x 9 x 1), F10x6+4, P.5, B.3 ZQ = 88-ball TFBGA (8 x 10 x 1.2), F8x10+8, 0.8 ZS = 56-ball VFBGA (8 x 6 x 1), 10x6-8+4, .5, B.3 3RZ = 133-ball VFBGA (8 x 8 x 1), 3R14x14+1, 0.5 *x Voltage Range (Core I/O) Mark I = Industrial (–40˚C to +85˚C) W = Wireless (–25˚C to +85˚C) interface configurable through register. 0 = N/A Micron Technology Production Status Blank = Production ES = Engineering Sample DC = Daisy Chain QS = Qualification Sample MS = Mechanical Sample Product Family 27C= OneNAND + LPDRAM MCP/PoP 28C= NOR + LPDRAM MCP/PoP 29C= NAND + LPDRAM MCP/PoP Operating Temperature Range NAND Density 1G=1Gb 2G=2Gb 4G=4Gb 8G=8Gb AG=16Gb BG=32Gb CG=64Gb DG=128Gb IT = Industrial Temp (–40˚C to +85˚C) W = Wireless (–25˚C to +85˚C) DM= 128Mb EM=256Mb FM=512Mb Special Options Blank = Standard E = On-die ECC enabled LPDRAM Density 56M=256Mb 12M=512Mb 40M=640Mb 52M=1,152Mb 24M=1Gb 48M=2Gb 72M=3Gb 96M=4Gb 92M=8Gb LPDRAM Access Time Operating Voltage Range A=1.70–1.95V B=1.65–1.9V C=1.5–1.7V -5 =200 MHz CL3 -54 =185 MHz CL3 -6 =166 MHz CL3 -75 = 135 MHz CL3 -8 = 125 MHz -10 = 100 MHz -48 = 208 MHz Package Code D=1.2–1.5V F =1.0 –1.2V G= 1.7–1.95V DRAM; 2.7–3.6V NOR VCC ; 1.65–3.6V VCCQ NAND Flash Configuration Type Width Density Generation Type Width Density Generation A B C D E F G H J K M N P R T U V Y Z x8 x16 x8 x16 x8 16 x8 x16 x8 x16 x16 x8 x16 x8 x16 x8 x16 x8 x16 – – 1Gb 1Gb – – – – 2Gb 2Gb – 4Gb 4Gb – – 1Gb 1Gb 4Gb 4Gb – – First First – – – – Second Second – First First – – Second Second Second Second AA AB AC AD AE AF AG AH AI AJ AK AL AM KH x8 x16 x8 x16 x8 x16 x8 x16 x8 x16 x16 x16 x16 x16 2Gb 2Gb 1Gb 1Gb 8Gb 8Gb 4Gb 4Gb 1Gb 1Gb – 8Gb 128Gb – Third Third Third Third First First Fourth Fourth Fourth Fourth – First First – Type Package Package Description JA JC JG JI JR JS JV KC KD KN KQ KS MA MC MD ME MF MJ MK ML MS NE RN TE PL SK SP MCP MCP PoP PoP MCP MCP PoP MCP MCP PoP PoP MCP PoP PoP MCP PoP PoP PoP MCP MCP PoP MCP MCP MCP MCP MCP MCP 137-ball TFBGA (10.5 x 13 x 1.2) 107-ball TFBGA (10.5 x 13 x 1.2) 168-ball VFBGA (12 x 12 x 0.9) 168-ball TFBGA (12 x 12 x 1.1) 137-ball LFBGA (10.5 x 13 x 1.4) 137-ball TFBGA (10.5 x 13 x 1.2) 168-ball VFBGA (12 x 12 x 1.0) 107-ball TFBGA (10.5 x 13 x 1.1) 137-ball TFBGA (10.5 x 13 x 1.1) 184-ball VFBGA (14 x 14 x 1.0) 168-ball WFBGA (12 x 12 x 0.75) 137-ball VFBGA (10.5 x 13 x 1.0) 168-ball WFBGA (12 x 12 x 0.7) 240-ball WFBGA (14 x 14 x 0.8) 130-ball VFBGA (8 x 9 x 1.0) 240-ball TFBGA (14 x 14 x 1.12) 168-ball VFBGA (12 x 12 x 0.85) 240-ball VFBGA (14 x 14 x 0.85) 153-ball VFBGA (10 x 12 x 0.9) 153-ball VFBGA (8 x 9 x 0.9) 191-ball WFBGA (12 x 12 x 0.8) 133-ball VFBGA (11 x 10 x 1.0) 160-ball FBGA (11.5 x 11.5 x 0.94) 153-ball VFBGA (10 x 12 x 1.0) 162-ball WFBGA (11.5 x 13 x 0.8) 162-ball VFBGA (11.5 x 13 x 0.9) 162-WFBGA (8 x 10.5 x 0.8) LPDRAM Configuration Part Numbering Guides Mark IT ES Chip Count LPDRAM Configuration continued on next page. Type CE#, CS# Chip Count A B C D E F G H 1, 1 1, 1 1, 2 1, 2 1, 2 1, 2 1, 2 1, 3 1 Flash, 1 LPDRAM 2 Flash, 1 LPDRAM 1 Flash, 2 LPDRAM 2 Flash, 2 LPDRAM 1 Flash, 3 LPDRAM 2 Flash, 3 LPDRAM 1 Flash, 4 LPDRAM 1 Flash, 3 LPDRAM 35 MCP NAND/NOR + LPDDR1 Part Numbering (Continued) MCP e•MMC/NAND + LPDDR Part Numbering MT 29RZ 4C 2D ZZ H G SK - 18 W x x .80E Micron Technology LPDRAM Configuration Type DDR SDR DDR SDR DDR SDR DDR SDR DDR SDR DDR SDR DDR DDR SDR Type your innovation. our memory. AA AB AC AE AF AG AH AJ AK AL AM AN AP AR AS AT AU AV AY AZ BA BB 36 DDR – – SDR SDR SDR DDR SDR DDR SDR DDR SDR DDR SDR SDR DDR DDR SDR DDR DDR DDR DDR Density Generation x16 – x32 – x16 – x32 – x16 x16 x32 x32 x16 x32 x16 512Mb – 512Mb – 1Gb – 1Gb – 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 256Mb First – First – First – First – Second Second Second Second Third Third First Width Density Generation x16 – – x16 x32 x16 + x16 x16 x16 x32 x32 x16 x16 x32 x32 x16 (2) + x16 x16 (2) + x32 x32 x32 x32 (x2) x16 x32 – 256Mb – – 512Mb 512Mb 512Mb + 128Mb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 2Gb 2Gb 1Gb + 128Mb 2Gb + 1Gb 256Mb 256Mb 4Gb + 1Gb 2Gb 2Gb – First – – Third Third First Second First Second First First First First First First First First First First/Second Second Second – Product Family Production Status 29J= LPDDR + SLC e •MMC 29K= LPDDR + MLC e •MMC 29M= LPDDR2-S4 + SLC e •MMC 29P= LPDDR2-S4 + MLC e •MMC 29R= LPDDR2-S4 + SLC NAND 29T= LPDDR3-S4 + MLC e •MMC Blank = Production ES = Engineering Sample MS = Mechanical Sample Special Options Blank = Standard A = Customer variant B = 2MB Boot area/2Mb RPMB E = On-die ECC enabled Z = A null character used as a placeholder. NAND Density and Configuration LPDRAM Density and Configuration Type Density Type Width Z T U V W X Y 1 2 3 4 6 8 9 None 768Mb 640Mb 512Mb 256Mb 128Mb 64Mb 1Gb 2Gb 3Gb 4Gb 6Gb 8Gb 9Gb Z A B C D E F None x4 x8 x16 x32 x64 x96 Operating Temperature Range IT = Industrial Temp (–40˚C to +85˚C) W = Wireless (–25˚C to +85˚C) LPDRAM Speed Grade -5 = 200 MHz CL3 (LPDDR 400) -54 = 185 MHz CL3 (LPDDR 1) -6 = 166 MHz CL3 (LPDDR 333) -75 = 133 MHz CL3 (LPDDR 266) -125 = 800 MHz CL12 (LPDDR 1600) -18 = 533 MHz CL8 (LPDDR 1066) -25 = 400 MHz CL6 (LPDDR 800) -3 = 333 MHz CL5 (LPDDR 667) -37 = 266 MHz CL4 (LPDDR 533) Part Numbering Guides A B C D J K L M N P R T V Y Z Width Die Revision Package Code e •MMC Density and Controller Type Z V W X 1 2 4 5 6 7 8 e •MMC Density None 512MB 256MB 128MB 1GB 2GB 4GB 8GB 16GB 32GB 64GB Type Type Z K L M N P Q R S T U V W X Y Controller Version None e •MMC version 4.2 e •MMC version 4.2/4.3 e •MMC version 4.2/4.3 e •MMC version 4.4 e •MMC version 4.4 e •MMC version 4.4 e •MMC version 4.41 e •MMC version 4.41 e •MMC version 4.41 e •MMC version 4.41 e •MMC version 4.5 e •MMC version 4.5 e •MMC version 4.41 e •MMC version 5.0 Operating Voltage Range (Volts) Operating Voltage Range continued on next page. AH AK DI DM EQ EW HS JD KK MF MJ MM MW MX PL RD RL SK SP TA TF TN Package Description 221-ball (11.5 x 13 x 1.0) 153-ball (11.5 x 13 x 1.1) 169-ball (12 x 16 x 1.2) 153-ball (11.5 x 13 x 1.2) 162-ball (11.5 x 13 x 1.3) 162-ball (11.5 x 13 x 1.1) 199-ball (12 x 18 x 1.4) 199-ball (12 x 18 x 1.2) 168-ball (12 x 12 x 0.9) 168-ball (12 x 12 x 0.85) 240-ball (14 x 14 x 0.85) 162-ball (11 x 13.5 x 1.0) 162-ball (11.5 x 13 x 1.2) 152-ball (14 x 14 x 1.2) 162-ball (11.5 x 13 x 0.8) 162-ball (12 x 12 x 1.1) 221-ball (11.5 x 13 x 0.9) 162-ball (11.5 x 13 x 0.9) 162-ball (8 x 10.5 x 0.8) 162-ball (11 x 13.5 x 1.1) 162-ball (11.5 x 13 x 1.0) 121-ball (7.5 x 8 x 0.5) Chip Count Chip Count continued on next page. 37 MCP e•MMC/NAND + LPDDR Part Numbering (Continued) e •MMC Memory Legacy Part Numbering MT 29RZ 4C 2D ZZ H G SK - 18 W x x .80E MT FC xx x x xx - xx xx x x x Chip Count Operating Voltage Range (Volts) Type e •MMC LPDRAM VCC VDD VDDQ VCCM VCCQM – 1.8 1.8 1.8 1.8 1.8 – 1.8 – – 1.8 1.8 1.8 1.8 1.8 1.35 1.2 1.8 1.8 1.8 1.2 1.2 – 1.8 1.8 1.8 1.8 1.2 1.2 1.2 1.8 1.8 1.8 1.2 1.2 – 1.2 1.2 1.2 1.8 1.8 1.8 1.8 3.3 1.8 3.3 – 1.8 3.3 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8/3.3 1.8 1.8/3.3 – 1.8 1.8/3.3 – – – Type A B C D E F G H I J K L M N Chip Count 1 NAND Flash (CEO), 1 LPDRAM, 1 e •MMC 2 NAND Flash (CEO), 1 LPDRAM, 1 e •MMC 1 NAND Flash (CEO), 2 LPDRAM (CSO#/CS1#), 1 e •MMC 2 NAND Flash (CEO), 2 LPDRAM (CSO#/CS1#), 1 e •MMC 0 NAND Flash, 1 LPDRAM, 1 e •MMC 0 NAND Flash, 2 LPDRAM (CSO#/CS1#), 1 e •MMC 1 NAND Flash, 1 LPDRAM, 0 e •MMC 1 NAND Flash, 2 LPDRAM, 0 e •MMC 2 NAND Flash, 2 LPDRAM, 0 e •MMC 0 NAND Flash, 0 LPDRAM, 2 e •MMC 0 NAND Flash, 4 LPDRAM, 1 e •MMC 0 NAND Flash, 3 LPDRAM, 1 e •MMC 2 NAND Flash, 1 LPDRAM, 0 e •MMC 4 NAND Flash, 4 LPDRAM, 0 e •MMC Blank = N/A A = Design revision A Flash + Controller = FC Production Status NAND Density 2G=4GB 4G=4GB 8G=8GB Blank = Production ES = Engineering sample MS = Mechanical sample 16G=16GB 32G=32GB 64G=64GB Wafer Process Applied NAND Component Type 0 J L M Blank = No polyimide Z = Polyimide NAND Device No silicon in package 25nm, 64Gb, x8, 3.3V 25nm, 32Gb, x8, 3.3V 25nm, 16Gb, x8, 3.3V Controller ID Type Controller ID 0 C D G T U V W No silicon in package Version 4.51, embedded, 1st generation Version 4.51, embedded, 2nd generation Version 4.41, automotive, 2nd generation Version 4.41, automotive, 2nd generation, custom Version 4.41, automotive, 1st generation Version 4.41, embedded, 1st generation Version 4.51, automotive, 1st generation Operating Temperature Range WT = Standard: –25˚C to +85˚C IT = Extended: –40˚C to +85˚C AIT = Industrial: –40˚C to +85˚C + HR-certified test flow AITI = Industrial: –40˚C to +85˚C + HR-certified test flow Special Options Blank = No special options Type Details 0M 1M 2M 3M 4M 5M 6M L1 R1 1MB max boot area/100% max enhanced 2MB max boot area/100% max enhanced 4MB max boot area/100% max enhanced 8MB max boot area/100% max enhanced 16MB max boot area/100% max enhanced 32MB max boot area/100% max enhanced 64MB max boot area/100% max enhanced Custom Custom Part Numbering Guides A B C D E F G H J K L M N NAND Design Revision Micron Technology your innovation. our memory. Package Codes 38 Type Package Description AM DE DM DN DQ EA EC ED EF NA 153-ball VFBGA (11.5 x 13 x 1.0) 153-ball LFBGA (11.5 x 13 x 1.4) 153-ball TFBGA (11.5 x 13 x 1.2) 169-ball LFBGA (14 x 18 x 1.4) 100-ball LBGA (14 x 18 x 1.4, 1.0 pitch) 153-ball WFBGA (11.5 x 13 x 0.8) 169-ball WFBGA (14 x 18 x 0.8) 169-ball VFBGA (14 x 18 x 1.0) 169-ball TFBGA (14 x 18 x 1.2) 100-ball TBGA (14 x 18 x 1.2) All packages are PB free. 39 e •MMC Memory Next-Generation Part Numbering DDR4 Module Part Numbering MT FC xx x x xx - xx xx x MT 36 A SF 2G 72 P Z - 2G1 A 1 Operating Temperature Range 128G = 128GB WT = Standard: –25˚C to +85˚C IT = Extended: –40˚C to +85˚C AIT = Industrial: –40˚C to +85˚C + HR-certified test flow NAND Component AA AC AG AJ AK 20nm, Rev A, 64Gb, x8, 3.3V 20nm, 32Gb, x8, 3.3V 20nm, 128Gb, x8, 3.3V 20nm, 128Gb, x8, 3.3V 20nm, Rev D, 64Gb, x8, 3.3V Controller ID Type AA AE Special Options Device Controller ID Version 4.51, embedded Version 5.0 Blank = No special options Type Details 0M 1M 2M 3M 4M 5M 6M L1 R1 1MB max boot area/100% max enhanced 2MB max boot area/100% max enhanced 4MB max boot area/100% max enhanced 8MB max boot area/100% max enhanced 16MB max boot area/100% max enhanced 32MB max boot area/100% max enhanced 64MB max boot area/100% max enhanced Custom Custom Package Codes Type your innovation. our memory. DE DL DM DN EF EA AM NA CN EY NS 40 Package Description 153-ball LFBGA (11.5 x 13 x 1.4) 169-ball TFBGA (12 x 18 x 1.2) 153-ball TFBGA (11.5 x 13 x 1.2) 169-ball LFBGA (14 x 18 x 1.4) 169-ball TFBGA (14 x 18 x 1.2) 153-ball WFBGA (11.5 x 13 x 0.8) 153-ball VFBGA (11.5 x 13 x 1.0) 100-ball TBGA (14 x 18 x 1.2) 153-ball VFBGA (11.5 x 13 x 1.0) 153-ball LFBGA (11.5 x 13 x 1.4) 153-ball VFBGA (11.5 x 13 x 1.2) Die Revision A=1.2V Product Family TF = FBGA without temp sensor TS = DDP (dual die in package) without temp sensor TQ = QDP (quad die in package) without temp sensor SF = FBGA with temp sensor SS = DDP with temp sensor SQ = QDP with temp sensor DF = VLP (very low profile) with temp sensor DS = VLP DDP with temp sensor DQ= VLP QDP with temp sensor SZF = FBGA with temp sensor and heat spreader SZS = DDP with temp sensor and heat spreader SZQ= QDP with temp sensor and heat spreader DZF = VLP with temp sensor and heat spreader DZS = VLP DDP with temp sensor and heat spreader DZQ= VLP QDP with temp sensor and heat spreader Module Speed -1G9 -1S9 -2G1 -2S1 -2G4 -107E -107H -093E -093H -083E DDR4-1866 DDR4-1866 DDR4-2133 DDR4-2133 DDR4-2400 Module Version A = 284-pin Unbuffered DIMM H = 256-pin SODIMM L = 284-pin LRDIMM LS= 284-pin 3DS LRDIMM P = 284-pin RDIMM PS= 284-pin 3DS RDIMM 1866 1866 2133 2133 2400 PC4-1866 PC4-1866 PC4-2133 PC4-2133 PC4-2400 13-13-13 14-13-13 15-15-15 16-15-15 16-16-16 SPD = serial presence-detect pin (module only) CL = CAS latency; tRCD = active-to-command time; tRP = precharge time Device Number (depth, width) Blank = Megabits G= Gigabits 933 933 1067 1067 1200 Part Numbering Guides Type Process Technology Module Configuration SPD (CL-tRCD-tRP) 16G=16GB 32G=32GB 64G=64GB Module Bandwidth 4G=4GB 8G=8GB Printed Circuit Board Revision Designator Number of Memory Components Data Rate (MT/s) NAND Density MB Vendor/Revision (LRDIMM only) Clock Frequency (MHz) Flash + Controller = FC Micron Technology JEDEC Component Speed Grade Blank = Production ES = Engineering sample MS = Mechanical sample Component Speed Grade/ Part Mark Production Status Module Speed Grade Micron Technology Package Codes Pb-Free Devices Z DZ DZM IZ ZM Package Descriptions Commercial temp; halogen-free; single-, dual-, quad-, or octal-rank DIMM Commercial temp; halogen-free; select single-, dual-, quad-, or octal-rank DIMM Commercial temp; reduced standby; halogen-free; select single-, dual-, quad-, or octal-rank DIMM Industrial temp, halogen-free; single-, dual-, or quad-rank DIMM Commercial temp; reduced standby; halogen-free; select single-, dual-, quad-, or octal-rank DIMM All packages are PB free. 41 DDR3 Module Part Numbering DDR2 Module Part Numbering MT 36 K SF 2G 72 P Z - 1G6 E 1 Data Rate (MT/s) Module Bandwidth Module Configuration SPD (CL-tRCD-tRP) 800 800 1066 1066 1066 1333 1333 1333 1333 1600 1600 1600 1866 1866 1866 2133 2133 2133 PC3-6400 PC3-6400 PC3-8500 PC3-8500 PC3-8500 PC3-10600 PC3-10600 PC3-10600 PC3-10600 PC3-12800 PC3-12800 PC3-12800 PC3-14900 PC3-14900 PC3-14900 PC3-17000 PC3-17000 PC3-17000 6-6-6 5-5-5 8-8-8 7-7-7 6-6-6 10-10-10 9-9-9 8-8-8 11-11-11 11-11-11 10-10-10 9-9-9 13-13-13 12-12-12 11-11-11 14-14-14 13-13-13 12-12-12 9-G1A = -1333 SPD with -125 tested DRAM SPD = serial presence-detect pin (module only) CL = CAS latency; tRCD = active-to-command time; tRP = precharge time Package Codes your innovation. our memory. Module Version 42 Blank = 240-pin Registered DIMM A = 240-pin Unbuffered DIMM AK= 244-pin Unbuffered Mini-DIMM H = 204-pin SODIMM L = 240-pin LRDIMM LS= 240-pin 3DS LRDIMM P = 240-pin Parity RDIMM PK= 244-pin Parity Mini-DIMM Pb-Free Devices Y Z IZ DY DZ Package Descriptions Commercial temp; single- or dual-rank DIMM Halogen-free; commercial temp; single- or dual-rank DIMM Industrial temp, halogen-free; commercial temp; single- or dual-rank DIMM Commercial temp; select dual- or quad-rank DIMM Halogen-free; commercial temp; select dual- or quad-rank DIMM Device Number (depth, width) Blank = Megabits G= Gigabits Module Version Blank = 240-pin Registered DIMM A= 240-pin Unbuffered DIMM F= 240-pin FBDIMM H= 200-pin SODIMM P= Parity PK= 244-pin Parity Mini-RDIMM RH = 200-pin SORDIMM Die Revision Module Speed -40E -53E -667 -80E -800 -1GA -5E -37E -3 -25E -25 -187E DDR2-400 200 DDR2-533 267 DDR2-667 333 DDR2-800 400 DDR2-800 400 DDR2-1066 533 Module Configuration SPD (CL-tRCD-tRP) Clock Frequency (MHz) 400 400 533 533 533 667 667 667 667 800 800 800 933 933 933 1067 1067 1067 TF =FBGA TS = DDP (dual die in package) TZS = DDP with heat spreader VF = VLP (very low profile) VS = VLP DDP VZS = VLP DDP with heat spreader Module Bandwidth JEDEC Component Speed Grade DDR3-800 DDR3-800 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1866 DDR3-1866 DDR3-1866 DDR3-2133 DDR3-2133 DDR3-2133 Product Family Data Rate (MT/s) Component Speed Grade/ Part Mark -25 -25E -187 -187E -187F -15 -15E -15F -125 -125 -125E -125F -107 -107E -107F -093 -093E -093F Printed Circuit Board Revision Designator JEDEC Component Speed Grade Module Speed Grade -80B -80C -1G0 -1G1 -1G2 -1G3 -1G4 -1G5 -1GA9 -1G6 -1G7 -1G8 -1G9 -1GB -1GC -2G1 -2G2 -2G3 E= Intel (FBDIMM) D= IDT (FBDIMM) N= NEC (FBDIMM) 400 533 667 800 800 1066 PC2-3200 PC2-4200 PC2-5300 PC2-6400 PC2-6400 PC2-8500 3-3-3 4-4-4 5-5-5 5-5-5 6-6-6 7-7-7 Part Numbering Guides TF=FBGA TS = DDP (dual die in package) SF = FBGA with temp sensor SS = DDP with temp sensor SQ = QDP with temp sensor BF = VLP (very low profile) (17.9mm) with temp sensor BS = VLP (17.9mm) DDP with temp sensor DF = VLP (18.75mm) with temp sensor DS = VLP (18.75mm) DDP with temp sensor GF = 1.5U height with temp sensor HF = 2U height with temp sensor LF = 4U height with temp sensor SZF = FBGA with temp sensor and heat spreader SZS = DDP with temp sensor and heat spreader SZQ = QDP with temp sensor and heat spreader BZF = VLP (17.9mm) with temp sensor and heat spreader BZS = VLP (17.9mm) DDP with temp sensor and heat spreader DYS = VLP (18.75mm) with temp sensor and alternate heat spreader DZF = VLP (18.75mm) with temp sensor and heat spreader DZS = VLP (18.75mm) DDP with temp sensor and heat spreader DZQ= VLP (18.75mm) QDP with temp sensor and heat spreader Blank = Megabits G= Gigabits H=1.8V G= 1.5V R=1.55V Module Speed Product Family Process Technology Die Revision J =1.5V K=1.35V M= 1.35V Reduced Standby AMB Vendor Number of Memory Components Component Speed Grade/ Part Mark Process Technology AMB Vendor Rev (FBDIMM only) Clock Frequency (MHz) Printed Circuit Board Revision Designator Number of Memory Components Device Number (depth, width) Micron Technology MB Vendor/Revision (LRDIMM only) Module Speed Grade Micron Technology MT 36 H TF 1G 72 P Z - 80E C 1 SPD = serial presence-detect pin (module only) CL = CAS latency; tRCD = active-to-command time; tRP = precharge time Package Codes Pb-Free Devices Package Descriptions Y Z Commercial temp; single- or dual-rank DIMM Halogen-free; commercial temp; single- or dual-rank DIMM Commercial temp; select dual-rank DIMM Halogen-free; commercial temp; select dualor quad-rank DIMM Industrial temp; select dual-rank DIMM Industrial temp; select dual-rank DIMM Halogen-free; industrial temp; select singleand dual-rank DIMM Halogen-free; industrial temp; select dualand quad-rank DIMM DY DZ IY TY IZ TZ 43 DDR and SDRAM Module Part Numbering MT 36 V DDF 256 72 PSRAM CellularRAM® Memory Part Numbering Y - 40B J 2 MT 45 W 1M W 16 P A FA - 70 1 Micron Technology Printed Circuit Board Revision Designator Number of Memory Components Die Revision Designator Process Technology Module Speed Blank = 168-pin/184-pin/240-pin Registered DIMM A= 168-pin/184-pin/240-pin Unbuffered DIMM H= 144-pin/200-pin SODIMM PH= 144-pin/200-pin Unbuffered SODIMM with PLLs U= 100-pin Unbuffered DIMM All SDRAM and DDR SDRAM DIMMs have serial-presence detect. SDRAM Modules Module Speed -133 -13E Allowable Component Speed -6A, -75, -7E -7E your innovation. our memory. DDR SDRAM Modules 44 Module Speed -335 -40B Data Rate (MT/s) Module Bandwidth Module Configuration SPD (CL-tRCD-tRP) -6T -6 -5B DDR333 TSOP DDR333 FBGA DDR40012 167 167 200 333 333 400 PC2700 PC2700 PC3200 2.5-3-3 2.5-3-311 3-3-3 SPD = serial presence-detect pin (module only) CL = CAS latency; tRCD = active-to-command time; tRP = precharge time 11Data valid window is 150ps greater than -6T. 12DDR400 nominal voltage is 2.6V. Module Version 10 10 Clock Frequency (MHz) Blank = Megabits G= Gigabits JEDEC Component Speed Grade Device Number (depth, width) -335 -335 -40B CL-tRCD-tRP 3-3-3 2-2-2 Package Codes Lead-Plated Devices G DG I T Pb-Free Devices Y DY IY TY Package Descriptions Commercial temp; single- or dual-rank DIMM Commercial temp; select dual-rank DIMM Industrial-temp DIMM Industrial temp; select dual-rank DIMM Micron Technology Production Status Blank = Production ES = Engineering Sample MS = Mechanical Sample Product Family 45= PSRAM CellularRAM® Memory Operating Core Voltage Operating Temperature Range W= 1.70–1.95V V=2.70–3.60V WT = –30˚C to +85˚C IT = –40˚C to +85˚C AT = –40˚C to +105˚C Address Locations Options M= Megabits K=Kilobits Blank = Standard device L = Low power I/O Voltage Frequency W=1.75–3.60V V =2.70–3.60V Bus Configuration 16=x16 Access/Cycle Time Read/Write Mode Operation P= Async/Page B= Async/Page/Burst DB = AA/D MUX MB= MUX Burst MP= Asynchronous MUX Die Rev Code Blank = P25A, P26Z, and P24Z Design A=P24A Design C=P25Z Design D=P23Z Design E=P22Z Design Blank = No burst mode 8 = 80 MHz 1 = 104 MHz 13 = 133 MHz 55= 55ns 70= 70ns 85= 85ns Part Numbering Guides DDF= FBGA (DDR SDRAM) DDT= TSOP (DDR SDRAM) DVF= FBGA VLP (DDR SDRAM) SDF = FBGA (SDRAM) SDT = TSOP (SDRAM) Component Speed Grade/ Part Mark Product Family Module Speed Grade L = 3.3V (SDRAM) V = 2.5V (DDR SDRAM) WT ES Package Code FA = 48-ball VFBGA (6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm) FB = 54-ball VFBGA (6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm) BA = 48-ball VFBGA (Pb-free 13; 6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm) BB = 54-ball VFBGA (Pb-free 13; 6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm) GX= 54-ball VFBGA (Green; 6 x 9 grid, 0.75mm pitch, 8 x 10 x 1mm) GA= 48-ball VFBGA (Green; 6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm) GB= 54-ball VFBGA (Green; 6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm) 13Lead is not intentionally added by Micron during the manufacturing process, but it can be present in trace amounts in the raw materials used to manufacture the finished products. Allowable Component Speed -6, -6T, -5B -5B 45 NAND Flash Part Numbering NAND Small Page Flash Memory Part Numbering NAND 512 R 3 A 2 A ZA 6 E MT 29F 2G 08 A A A A A WP - xx xx x ES: A Micron Technology Design Revision A = 1st Design Revision Product Family Production Status 29F = NAND Flash 29E = Enterprise NAND Flash Blank = Production ES = Engineering Sample QS = Qualification Sample MS = Mechanical Sample Density Features E = Internal ECC enabled X = Product Longevity Program (PLP) M = Media Z = Polyimide (if applicable) R = MLC+ features S = Security features Device Width Operating Temperature Range 01 = 1 bit 08 = 8 bits 16= 16 bits Blank = Commercial (0˚C to +70˚C) IT = Extended (–40˚C to +85˚C) (AKA ET) WT = Wireless Temp (–25˚C to +85˚C) AAT = Automotive Grade (–40˚C to +105˚C) AIT = Automotive Grade (–40˚C to +85˚C) Level Mark Level A C E SLC MLC TLC your innovation. our memory. E = ECOPACK package, standard tray packaging F = ECOPACK package, tape and reel packaging Operating Temperature Range Operating Voltage Range 6 = – 40˚C to +85˚C X = – 40˚C to +85˚C; Product Longevity Program (PLP) R =1.8V W=3.0V Configuration Package Code 3= x8 4= x16 N= 48-pin TSOP ZA/ZD = 55-, 63-ball VFBGA E0= Bare die DI= Known good die NAND Product Family Identifier A = 512B Page NAND SLC Product Version Device Options A, B, C, D 0 = No options (CE care; sequential raw read enabled) 2 = CE don’t care A = CE don’t care; automotive Speed Grade Blank = Async only 6 = 333 MT/s 12 = 166 MT/s 10 = 200 MT/s Package Code14 Classification 46 128 = 128Mb 256 = 256Mb 512 = 512Mb Mark Die nCE RnB I/O Channels B D E F J K L M Q T U V 1 2 2 2 4 4 4 4 8 16 8 16 1 1 2 2 2 2 4 4 4 8 4 8 1 1 2 2 2 2 4 4 4 4 4 4 1 1 2 1 1 2 4 2 4 2 2 4 Operating Voltage Range A= 3.3V (2.70–3.60V) B= 1.8V (1.70–1.95V) C = 3.3V (2.70–3.60V), VCCQ 1.8V (1.70–1.95V) D= 1.8V (1.65–3.6V) SIM E = 3.3V (2.70–3.6V), VCCQ 3.3V or 1.8V (1.70–1.95V) WP = 48-pin TSOP I (CPL version) J1 = 132-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm J2 = 132-ball TBGA (QDP), 12 x 18 x 1.2mm J3 = 132-ball LBGA (8DP), 12 x 18 x 1.4mm J4 = 132-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm J5 = 132-ball TBGA (QDP), 12 x 18 x 1.2mm J6 = 132-ball LBGA (8DP), 12 x 18 x 1.4mm J7 = 152-ball LBGA (16DP), 14 x 18 x 1.5mm J9 = 132-ball LBGA (16DP), 12 x 18 x 1.5mm G1 = 272-ball VFBGA (SDP, DDP, 3DP, QDP), 14 x 18 x 1.0mm G2 = 272-ball TFBGA (8DP), 14 x 18 x 1.3mm G6 = 272-ball LFBGA (16DP), 14 x 18 x 1.5mm H1 = 100-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm H2 = 100-ball TBGA (QDP), 12 x 18 x 1.2mm H3 = 100-ball LBGA (8DP), 12 x 18 x 1.4mm H4 = 63-ball VFBGA (SDP, DDP), 9 x 11 x 1.0mm H6 = 152-ball VBGA (SDP, DDP), 14 x 18 x 1.0mm H7 = 152-ball TBGA (QDP), 14 x 18 x 1.2mm H8 = 152-ball LBGA (8DP), 14 x 18 x 1.4mm HC = 63-ball VFBGA (SDP, DDP), 10.5 x 13 x 1.0mm 14Products are Pb-free and RoHS-compliant. Lead is not intentionally added by Micron during the manufacturing process, but it can be present in trace amounts in the raw materials used to manufacture the finished products. Interface A = Async only B = Sync/Async D = SPI Die Revision A= 1st set of device features B= 2nd set of device features (rev only if different from 1st set) C= 3rd set of device features (rev only if different) D= 4th set of device features (rev only if different) Etc. ... Part Numbering Guides 64G= 64Gb 128G= 128Gb 256G= 256Gb 512G= 512Gb 1Tb = 1024Gb (1Tb) 2Tb = 2048Gb (2Tb) 1G = 1Gb 2G = 2Gb 4G = 4Gb 8G = 8Gb 16G= 16Gb 32G= 32Gb Packaging Density N25Q Serial NOR Flash Memory Part Numbering N25Q 128 A 1 3 E 12 4 0 G SPI NOR Family Identifier N25Q = Multi I/O SPI NOR Flash Density 008= 8Mb 016= 16Mb 032= 32Mb 064= 64Mb 128= 128Mb 256= 256Mb 512= 512Mb 00A= 1Gb Litho A = 65nm Feature Set 1 = Byte addressability, hold pin, Micron XiP 2 = Byte addressability, hold pin, basic XiP 3 = Byte addressability, reset pin, Micron XiP 4 = Byte addressability, reset pin, basic XiP Operating Voltage Range 1= 1.7–2.0V VCC 3= 2.7–3.6V VCC Array Configuration T=Top B=Bottom E=Uniform G= Easy transparent stack Packaging E = Tray F = Tape and reel G = Tube Security 0, 1, 2, 3, 4, 5, 6 Contact Micron Sales for more information Operating Temperature Range 4 = Industrial-tested with standard test flow (–40˚C to +85˚C) A= Automotive: –40˚C to +125˚C + HR-certified test flow H= Automotive: –40˚C to +85˚C + HR-certified test flow Package Code F3= DFN/3 x 2 (MLP) F4= DFN/3 x 4 (MLP) F6= DFN/6 x 5 (MLP) F7= DFN/6 x 5 (MLP), sawn F8= DFN/8 x 6 (MLP) SC= SOP2-8/150 mil (SO8N) SE= SOP2-8/208 mil (SO8W) SF= SOP2-16/300 mil (SO16W) 12= T-PBGA-24b05/6 x 8 (TBGA 24) 51= XF-SCSP (CSP) 47 M25/M45 Serial NOR Flash Memory Part Numbering M29W Parallel NOR Flash Memory Part Numbering M25P 10 x V MN 6 T P x SPI NOR Family Identifier M25P = Data storage family 512K/1Mb – Uniform block erase 32KB 2Mb to 64Mb – Uniform block erase 64KB 128Mb – Uniform block erase 256KB M25PE = Page erase family Uniform block erase 256 byte + 4KB + 64KB M45PE = Page erase family Uniform block erase 256 byte + 64KB M25PX= Dual I/O family Uniform block erase 4KB + 64KB M29 W 320 E T 70 N 6 E Test Flow Blank = Standard parts A = Automotive: –40˚C to +85˚C + HR-certified test flow (designated only for operating temp range 6) RoHS P = RoHS-compliant G = RoHS-compliant Packaging Density 05=512Kb 10=1Mb 20=2Mb 40=4Mb 80=8Mb 16=16Mb 32=32Mb 64=64Mb 128 = 128Mb Security Blank = No security S = UID preprogrammed SO = UID + Permanent block lock ST = UID + Permanent block lock + reverse power-up block lock status Operating Voltage Range V= 2.7–3.6V VCC 2.3–3.6V VCC (M25P available in 512Kb–4Mb; M25PX available in 8Mb–16Mb) Operating Temperature Range 6 = –40˚C to +85˚C 3 = Automotive: –40˚C to +125˚C + HR-certified test flow Package Code BA= PDIP8, 300 mils MB= DFN, 3 x 2 (MLP) MC= DFN, 3 x 4 (MLP) ME= DFN, 8 x 6 (MLP) MF= SOP2-16, 300 mils (SO16W) MN= SOP2-8, 150 mils (SO8N) MP= DFN, 6 x 5, (MLP) MS= DFN, 6 x 5, sawn (MLP) MW= SOP2-8, 208 mils (SO8W) ZM= T-PBGA-24b05, 6 x 8 (TBGA 24) E = ECOPACK package, standard tray packaging F = ECOPACK package, tape and reel packaging M29 = Standard Parallel NOR Operating Voltage Range Operating Temperature Range W = 2.7–3.6V VCC Density 400 = 4Mb 800 = 8Mb 160 = 16Mb 320 = 32Mb 640 = 64Mb 128 = 128Mb 256 = 256Mb 3 = –40˚C to +125˚C (automotive) 6 = –40˚C to +85˚C Package Code /NB = 56-pin TSOP, 14 x 20mm N N/NA = 48-pin TSOP, 12 x 20mm ZA = 48-ball TBGA, 6 x 8mm, 0.8mm pitch (4Mb–64Mb) 64-ball TBGA, 10 x 13mm, 1mm pitch (128Mb/256Mb) ZS = 64-ball FBGA, 11 x 13mm, 1mm pitch ZF = 64-ball TBGA, 10 x 13mm, 1mm pitch ZE = 48-ball TFBGA, 6 x 8mm, 0.8mm pitch Silicon Version or Architecture Option D, E, F, G Functionality/Security Speed H = Uniform block (highest block protected) L = Uniform block (lowest block protected) B = Bottom boot (bottom blocks protected) T = Top boot (top blocks protected) 45 = 45ns 5A = 55ns (automotive, temp range 6) 55 = 55ns 6A = 60ns (automotive, temp range 6) 60 = 60ns 7A = 70ns (automotive, temp range 6) 70 = 70ns Part Numbering Guides Blank = SO Tube (MLP and BGA tray) T = Tape and reel Packaging NOR Family Identifier M29AW Automotive Uniform Block MLC Flash Memory Part Numbering your innovation. our memory. JS 28F 512 M29AW H x 48 Package Code JS= 56-pin TSOP, 14 x 20mm, RoHS PC= 64-ball FBGA, 11x13mm, RoHS Product Line Designator 28F = NOR parallel interface Density 512 =512Mb 00A=1Gb Device Features (Optional) Assigned to cover packing media and/or features or other specific configurations. Packaging B = Tape and reel Functionality/Security H = Uniform block (highest block protected by VPP/WP#) L = Uniform block (lowest block protected by VPP/WP#) Parallel NOR Family Identifier M29AW = Automotive: Parallel Flash memory, uniform block, 3V core 49 M29DW Parallel NOR Flash Memory Part Numbering M29F Automotive Single-Bank 5V Flash Memory Part Numbering M29 DW 323 D T 70 N 6 E M29F 160 F T 55 M 6 Packaging NOR Family Identifier E = ECOPACK package, standard tray packaging F = ECOPACK package, tape and reel packaging M29 = Standard Parallel NOR Operating Voltage Range DW = 2.7–3.6V VCC, multibank Operating Temperature Range Density 3 = –40˚C to +125˚C (automotive) 6 = –40˚C to +85˚C 323 = 32Mb, x8/x16 127 = 128Mb, x8/x16 128 = 128Mb, x16 256 = 256Mb, x16 Package Code Silicon Version or Architecture Option D, E, F, G Functionality/Security Speed H = Uniform block (highest block protected) L = Uniform block (lowest block protected) B = Bottom boot (bottom blocks protected) T = Top boot (top blocks protected) 5A = 55ns (automotive, temp range 6) 60 = 60ns 7A = 70ns (automotive, temp range 6) 70 = 70ns Blank = Standard tray packaging E = Standard tray packaging, RoHS F = Tape and reel packaging, RoHS, 24mm T = Tape and reel packaging, 24mm M29F =Parallel NOR, single bank, top/bottom boot block, 5V supply voltage Density 200 = 16Mb 400 = 32Mb 800 = 64Mb 160 = 128Mb Litho F = 110nm Functionality/Security B = Bottom boot (bottom blocks protected) T = Top boot (top blocks protected) Operating Temperature Range 3 = Automotive: –40˚C to +125˚C 6 = Automotive: –40˚C to +85˚C Package Code = SO44, 0.525in cu M N = 48-pin TSOP-1, 12 x 20mm, AL 4 ZA = 48-ball TBGA, 6 x 8mm, 0.8mm pitch (only 8Mb, bottom boot) Speed 55 = 55ns (temp range 3: –40˚C to +125˚C) 5A = 55ns (temp range 6: –40˚C to +85˚C) Part Numbering Guides F = 56-pin TSOP N N = 48-pin TSOP ZA = 64-ball TBGA ZE = 48-ball TFBGA Packaging NOR Family Identifier M29EW Parallel NOR Flash Memory Part Numbering PC 28F 256 M29EW x H x Package Code Device Features your innovation. our memory. JR= 48-pin TSOP, RoHS, HF JS= 56-pin TSOP, RoHS, HF PC= Fortified 64-ball BGA, RoHS, HF PZ= 48-pin BGA (RoHS, HF) RC= Fortified 64-ball BGA 50 Product Line Designator 28F = NOR parallel interface Density 032 =32Mb, x8/x16 064 =64Mb, x8/x16 128 =128Mb, x8/x16 256 =256Mb, x8/x16 (Optional) Assigned to cover packing media and/or features or other specific configurations. Functionality/Security H = Uniform block (highest block protected) L = Uniform block (lowest block protected) B = Bottom boot (bottom two blocks protected) T = Top boot (top two blocks protected) Lithography 512 =512Mb, x8/x16 00A=1Gb, x8/x16 00B=2Gb (1Gb/1Gb), x8/x16 Blank = 65nm Parallel NOR Family Identifier M29EW = Parallel Flash memory, 3V core, 1.8–3.6V I/O 51 P30/P33 Parallel NOR Flash Memory Part Numbering G18 Parallel NOR Flash Memory Part Numbering PC 28F 128 P 33 T F 60 x Device Features Package Code (Optional) Assigned to cover packing media and/or features or other specific configurations. JS = 56-pin TSOP, RoHS PC= 64-ball Easy BGA, RoHS RC= 64-ball Easy BGA Micron Technology Production Status Blank = Production ES = Engineering samples Product Family 28G = G series Parallel NOR Speed Product Line Designator Density 512 =512Mb, x16 00A=1Gb, x16 00B=2Gb (1Gb/1Gb), x16 Lithography NOR Family Identifier F = 65nm P = P30/P33 Parallel NOR Operating Temperature Range Voltage IT = –40˚C to +85˚C (Grade 3 AEC-Q100) AT = –40˚C to +105˚C (Grade 2 AEC-Q100) U = 1.7–2.0V Density Special Options 256= 256Mb 512= 512Mb 01G= 1Gb A = Automotive quality S = Standard X = Product Longevity Program (PLP) Stack Security Features A = Single die 0 = Standard features Die Rev Code Functionality Operating Voltage Range B = Bottom boot T = Top boot 30 = 1.7–2.0V, 2.3–3.6V 33 = 2.7–3.6V A = Rev. A B = Rev. B C = Rev. C GC = 64-ball TBGA, 10 x 8 x 1.2mm Interface Block Structure Package Codes Part Numbering Guides 60 = 60ns 65 = 65ns 70 = 70ns 75 = 75ns 85 = 85ns 95 = 95ns Blank = Various speeds 28F = NOR parallel interface 640 =64Mb, x16 128 =128Mb, x16 256 =256Mb, x16 MT 28G U A A A 2 E GC - 0 S IT ES E = Uniform 1 = x16 2 = x16 A/D MUX P30/P33 Stacked PC 48F 3000 P0 Z T Q E x Package Code your innovation. our memory. P C= 64-ball Easy BGA, RoHS PF = 88-ball Quad+ BGA, RoHS RC= 64-ball Easy BGA RD= 88-ball Quad+ BGA 52 Product Line Designator 48F = NOR parallel interface for stacked configurations Density 3000= 128Mb, x16 4000= 256Mb, x16 4400= 512Mb (256Mb/256Mb), x16 NOR Family Identifier P0 = P30/P33 Parallel NOR Operating Voltage Range Z = Individual chip enable(s), 1.7–2.0V VCC, 1.7–3.6V VCCQ V = Virtual chip enable(s), 1.7–2.0V VCC, 1.7–3.6V VCCQ X = Individual chip enable(s), 2.3–3.6V VCC, 2.3–3.6V VCCQ T = Virtual chip enable(s), 2.3–3.6V VCC, 2.3–3.6V VCCQ J3 Parallel NOR Flash Memory Part Numbering Device Features PC 28F 320 J 3 F 75 (Optional) Assigned to cover packing media and/or features or other specific configurations. Speed 60 = 60ns 65 = 65ns 70 = 70ns 75 = 75ns 85 = 85ns 95 = 95ns Blank = Various speeds Ballout Designator Q = Quad+ 0 = Discrete Functionality B = Bottom boot, top/bottom boot T = Top boot Package Code JS = 56-pin TSOP, RoHS PC= 64-ball Easy BGA, RoHS RC= 64-ball Easy BGA TE = 56-pin TSOP Product Line Designator 28F = NOR parallel interface Density 320 =32Mb, x8/x16 640 =64Mb, x8/x16 128 =128Mb, x8/x16 256 =256Mb, x8/x16 Speed 75 = 75ns 95 = 95ns 105 = 105ns Lithography F = 65nm with HR-certified test flow D = 130nm Operating Voltage Range 3 = 3V VCC, 3V VPEN NOR Family Identifier J = J3 Parallel NOR 53 M28W Parallel NOR Flash Memory Part Numbering M58WR Parallel NOR Flash Memory Part Numbering M28 W 160C T 70 N 6 T M58 W R 016 K T 7A ZB 6 E NOR Family Identifier Packaging M28 = Parallel NOR Blank = Standard tray packaging E = ECOPACK package, standard tray packaging F = ECOPACK package, tape and reel packaging U = ECOPACK package, tray packaging Operating Voltage Range W = 2.7–3.6V VDD, 1.65–3.6V VDDQ Operating Temperature Range Density/Functionality 160C = 16Mb, x16, boot block 320FC = 32Mb, x16, boot block 640HC = 64Mb, x16, boot block 6 = –40˚C to +85˚C Package Code Functionality Speed B = Bottom boot T = Top boot 70 = 70ns M58 = Parallel NOR Packaging E = Standard tray packaging F = Tape and reel packaging Flash Identifier W = Multiple bank, burst mode Operating Voltage Range R = 1.7–2.0V VDD Density/Functionality 016 = 16Mb, x16 032 = 32Mb, x16 064 = 64Mb, x16 Technology K = 65nm process Operating Temperature Range 6 = –40˚C to +85˚C Package Code ZB = 56-ball VFBGA Automotive Temp Range 7A = Automotive-grade certified –40˚C to +85˚C Functionality B = Bottom boot T = Top boot Part Numbering Guides N = 48-pin TSOP ZB = 46-ball TFBGA NOR Family Identifier M58BW Parallel NOR Flash Memory Part Numbering M58 B W 32F T 4 T 3 T NOR Family Identifier M58 = Parallel NOR Flash Identifier your innovation. our memory. B = Burst mode 54 Packaging F = ECOPACK package, tape and reel packaging T = Standard tray packaging Operating Temperature Range 3 = –40˚C to +125˚C (automotive) Operating Voltage Range W = 2.7–3.6V VDD range for 45ns speed class 2.5–3.3V VDD range for 55ns speed class 2.4V–VDD VDDQ range for 45ns and 55ns speed classes Density/Functionality 16F = 16Mb, x32, boot block, burst, 0.11µm process 32F = 32Mb, x32, boot block, burst, 0.11µm process Package Code T= 80-pin PQFP ZA = 80-ball LBGA Speed 4 = 45ns 5 = 55ns Functionality B = Bottom boot T = Top boot 55 3xx and 4xx SSD Part Numbering 4xx and 5xx SSD Part Numbering MT FD D AC 128 M x x - 1 G 1 2 xx xx ES MT FD D AK 120 M AV - 1 AE 1 2 AB YY ES Micron Technology Production Status Blank = Production ES = Engineering sample MS = Mechanical sample Flash Drive (SSD) Drive Interface Operating Temperature Range A = SATA 1.5 Gb/s B = SATA 3.0 Gb/s D = SATA 6.0 Gb/s G= PCIe Gen2 Blank = Commercial (0˚C to +70˚C) Hardware Feature Set Drive Form Factor AA = 1.8in, 5mm, Micro SATA connector AC = 2.5in, 9.5mm AG = Full-height, full-length x8 AH = Full-height, half-length x8 AK = 2.5in, 7mm AR = Half-height, half-length x8 AT=mSATA Security Feature Set Blank = Blank 1 = Contact factory 2 = SED (self-encrypting drive) 4 = Oprom 1 (Bootable) – P320h only 5 = UEFI – P320h only Drive Density 001= 1GB 002= 2GB 004= 4GB 008= 8GB 014= 14GB 016= 16GB 025= 25GB 030= 30GB 032= 32GB 050= 50GB 060= 60GB NAND Type your innovation. our memory. S=SLC M=MLC 56 064= 64GB 120= 120GB 128= 128GB 175= 175GB 200= 200GB 256 = 256GB 350= 350GB 400= 400GB 512= 512GB 700= 700GB BOM Revision Production: 1 = 1st generation 2 = 2nd generation 3 = 3rd generation Etc. ... ES: A = 1st generation B = 2nd generation C = 3rd generation Etc. ... NAND Component A = 4Gb, SLC, x8, 3.3V, 72nm B = 8Gb, SLC, x8, 3.3V, 50nm C = 16Gb, MLC, x8, 3.3V, 50nm D = 4Gb, SLC, x8, 3.3V, 50nm E = 16Gb, MLC, x8, 3.3V, 34nm F = 32Gb, MLC, x8, 3.3V, 34nm G = 32Gb, MLC, x8, 3.3V, 34nm H = 8Gb, SLC, x8, 3.3V, 50nm J = 32Gb, MLC, x8, 3.3V, 25nm K = 64Gb, MLC, x8, 3.3V, 25nm L = 4Gb, SLC, x8, 3.3V, 34nm M = 8Gb, SLC, x8, 3.3V, 34nm N = 16Gb, SLC, x8, 3.3V, 34nm Sector Size 1 = 512 byte AE= C200/P200 AF= eUSB AG= C300 AH= P320 AJ= e230 AL= P300 AM= C400 AN= P400m AR= P400e Product Family Production Status Blank = Production ES = Engineering sample MS = Mechanical sample Flash Drive (SSD) Drive Interface Customer Designator B = SATA 3.0 Gb/s D = SATA 6.0 Gb/s E = SAS 6.0 Gb/s F = PCIe Gen1 G= PCIe Gen2 YY = Standard Additional Features AB = Standard AF = Contact factory Drive Form Factor AA = 1.8in, 5mm, micro SATA connector AC = 2.5in, 9.5mm AG = Full-height, full-length x8 AH = Full-height, half-length x8 AK = 2.5in, 7mm AR = Half-height, half-length x8 AT=mSATA AV = M.2, 80mm x 22mm x 3.5mm AW= 2.5in, 5mm Drive Density 0 50 = 50GB 060 = 60GB 064 = 64GB 100 = 100GB 120 = 120GB 128 = 128GB 175 = 175GB 200 = 200GB 240 = 240GB 256 = 256GB 350 = 350GB 400 = 400GB 480 = 480GB 500 = 500GB 512 = 512GB 700 = 700GB 800 = 800GB 960 = 960GB 1T0 = 1024GB 1T4 = 1.4TB Extended Firmware Features Z = Blank 1 = Contact factory 2 = SED (self-encrypting drive) 3 = Oprom 1 (Bootable) – P420h only 4 = UEFI – P420h only Sector Size 1 = 512 byte AA = 32Gb, SLC, x8, 3.3V, 25nm AB = 64Gb, MLC, x8, 3.3V, 25nm AC = 64Gb, MLC, x8, 3.3V, 20nm AD = 64Gb, MLC, x8, 3.3V, 20nm AE = 128Gb, MLC, x8, 3.3V, 20nm AF = 32Gb, MLC, x8, 3.3V, 34nm AG = 32Gb, MLC, x8, 3.3V, 25nm AH = 64Gb, MLC, x8, 3.3V, 20nm AJ = 64Gb, SLC, x8, 3.3V, 20nm NAND Component NAND Type S=SLC M=MLC Operating Temperature Range Commercial (0˚C to +70˚C) for all SSDs Part Numbering Guides Blank = Blank AA = Contact factory AB = Contact factory AC = Contact factory Micron Technology BOM Revision Production: 1 = 1st generation 2 = 2nd generation 3 = 3rd generation Etc. ... ES: A = 1st generation (P420m only) B = 2nd generation C = 3rd generation Etc. ... Product Family AV = M500 AY = M550 AX = P420m AZ = M510 57 Product Lifecycle Solutions Web Tools Memory Choices for Mass Market Distribution Customers Micron’s Product Lifecycle Solutions bring the stability of our memory support into alignment with the lifecycle of your design. Depending on your specific requirements, choose between our standard lifecycle support and the extended support of our Product Longevity Program (PLP). Standard Lifecycle Products For customers with application lifecycles of up to 7+ years • Select DRAM, NAND, and NOR products • Stability and longevity for mission-critical applications with extensive design-in or requalification requirements • Minimum 10-year form, fit, function compatibility from the date of introduction • Extended 2-year conversion timeline in case of part number change or discontinuance Customizable Workspace The Micron Workspace is where you can save and organize part pages, data sheets, and links for easy access in the future. • Save parts, documents, and pages for fast and easy access Organize documents and parts in folders • Share parts, pages, or project folders with colleagues • View secure documents that you already have access to view via My Documents • Receive messages from Micron contacts in My Messages • Micron Blog micronblogs.com Join the conversation at Micron’s blog, where we highlight our recent technology developments—from advanced storage solutions to the cutting edge of server, computing, and mobile memory. Extensive Support Resources micron.com/support • Technical notes FBGA decoder • Part numbering guides • General FAQs • Purchasing information • Micron System Power Calculator micron.com/powercalc Web Tools 58 For customers with application lifecycles of up to 7–10+ years Visit micron.com to find all of our detailed product specification data, including part status, recommended parts (where applicable), disty stock and sample information, data sheets, and modeling tools. You also can find information about our plans for long-term product support, design webinars, and product FAQs. Product Lifecycle Solutions LPDRAM, NOR, SLC/ MLC NAND, • e MMC, MCPs, SSDs, and other products • One-stop supplier for a broad range of applications • Leading-edge technology, optimum performance/feature combinations, multiple densities, cost-effective products • Optimum performance/feature combinations, multiple densities, cost-effective products • Strong record of long-term support for legacy products • Up to 5-year roadmap visibility for standard products • Standard JEDEC conversion and discontinuance time lines apply your innovation. our memory. • DRAM, Product Longevity Program (PLP) One-Stop Product Catalogs Sales Representative Lookup micron.com/how-to-buy Locate a sales representative in your area who can help you buy products, create a corporate account, and gain expertise. ©2011 Micron Technology, Inc. All rights reserved. Micron, the Micron logo, and ClearNAND are trademarks of Micron Technology, Inc. RLDRAM is a trademark of Qimonda AG in various countries, and is used by Micron Technology, Inc. under license from Qimonda. CellularRAM is a registered trademark of Micron Technology, Inc., inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of their respective owners. Lead is not intentionally added by Micron during the manufacturing process, but it can be present in trace amounts in the raw materials used to manufacture the finished products. Products are warranted only to meet Micron’s production data sheet specifications. Products and specifications are subject to change without notice. Rev. 10/14 EN.L 59 Product Lifecycle For data sheets, technical notes, and other product and sales information, visit Micron’s web site or phone us today. micron.com (208) 368-3900 (011) +1 (208) 368-3900