MYXFC32GJDDQ MMC Controller and 32GB NAND Flash Advanced information. Subject to change without notice. Features • Tin-lead ball metallurgy • MultiMediaCard (MMC) controller and 32GB NAND Flash • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V • Typical current consumption Standby current: 90μA Active current (RMS): 90mA MMC - Specific Features • JEDEC/MMC standard version 4.41-compliant (JEDEC Standard No. 84-A441) - SPI mode not supported (see www.jedec.org/sites/default/files/docs/JESD84-A441.pdf) Advanced 11-signal interface x1, x4, and x8 I/Os, selectable by host MMC mode operation Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock card) MMCplus™ and MMCmobile™ protocols Temporary write protection 52 MHz clock speed (MAX) Boot operation (high-speed boot) Sleep mode Replay-protected memory block (RPMB) Secure erase and trim Hardware reset signal Multiple partitions with enhanced attribute Permanent and power-on write protection Double data rate (DDR) function High-priority interrupt (HPI) Enhanced reliable write Configurable reliability settings Background operation Fully enhanced configurable Table 1: MLC Partition Performance Condition MYXFC32GJDDQ Units Sequential write 20 MB/s Sequential read 44 MB/s Rando write 90 IOPs Random read 1100 IOPs Note: Bus in x8 I/O mode. Sequential access of 1MB chunk; random access of 4KB chunk. Additional performance data, such as power consumption or timing for different device modes, will be provided in a separate document upon customer request. OptionsCode • Package (Sn63 Pb37 solder) 100-ball LFBGA (14mm x 18mm x 1.4mm) BG • Operating Temperature Industrial (-40°C ≤ TC ≤ +85°C) IT Backward-compatible with previous MMC modes • ECC and block management implemented Micron Part. No. MTFC32GJDDQ-4M November 21, 2014 • Revision 1.0 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Form #: CSI-D-686 Document 013 4GB, 8GB, 16GB, 32GB: e·MMC 100-Ball Signal Assignments MYXFC32GJDDQ • MMC controller and 32GB NAND Flash Advanced information. Subject to change without notice. 100-Ball Signal Assignments 3: 100-Ball LFBGA (Top View, Ball Down) FigureFigure 1: 100-Ball LFBGA 1 2 3 4 (Top View, Ball Down) A NC B NC 5 6 7 8 NC 9 10 NC NC A NC B D RFU RFU RFU RFU RFU RFU RFU RFU D E RFU RFU VDDIM RFU RFU RFU RFU RFU E F VCC VCC VCC VCC VCC VCC VCC VCC F G VSS VSS VSS VSS VSS VSS VSS VSS G H VSSQ VCCQ RFU RFU RFU RFU VCCQ VSSQ H J RFU RFU RFU RFU RFU RFU RFU RFU J K DAT0 DAT2 RFU RFU RFU RFU DAT5 DAT7 K L VCCQ VSSQ VCCQ RFU RFU VCCQ VSSQ VCCQ L M RFU RFU VSSQ RST_n RFU VSSQ RFU RFU M N P Micron Confidential and Proprietary DAT1 DAT3 RFU RFU RFU RFU DAT4 DAT6 VSSQ VCCQ RFU CMD CLK RFU VCCQ VSSQ Package Dimensions T NC U NC N 4GB, 8GB, 16GB, 32GB: e·MMC Package Dimensions P Figure 4: 100-Ball LBGA – 14.0mm x 18.00mm x 1.4mm (Package Code: DQ) T NC NC NC A U NC Seating plane 0.12 A 1. Connect a 1μF decoupling capacitor from VDDI to ground. 2. Some test100X pads on the device are not shown. They are not solder balls and are for MiØ0.466 Micron Confidential and Proprietary Dimensions Figure 2: 100-Ball LFBGA cron internal use apply only. to solder balls postBall A1 ID Ball A1 ID reflow onversions Ø0.40 SMD of Some8GB, previous the JEDEC product or mechanical specification had defined 14.0mm x 18.00mm x 1.4mm 3. 4GB, 16GB, 32GB: e·MMC ball pads. 10 9 8 7 6 5 4 3 2 1 Package reserved for futureDimensions use (RFU) balls as no connect (NC) balls. NC balls assigned in the pre(Package Code: DQ) A ground on the system board. To enavious specifications could have been connected to B age Dimensions ble new feature introduction, some of these ballsC are assigned as RFU in the v4.4 meD chanical specification. Any new PCB footprint implementations should use the new ball E assignments and leave the RFU balls floating on the system board. 4: 100-Ball LBGA – 14.0mm x 18.00mm x 1.4mm (Package Code: DQ) F G 4. VCC, V18 , V , and VSSQ balls must all be connected. CCQ ±0.1 SS Notes: H 10.0 CTR Seating plane J K 16.0 CTR L A 0.12 A M N X Ø0.466 ensions apply older balls postow on Ø0.40 SMD pads. 6 PDF: 09005aef8523caab emmc_4-32gb_ctrd_441_100b-it.pdf - Rev. B 9/13 EN Notes: 1. All dimensionsBall areA1inIDmillimeters. 2. Solder ball material: Sn63/Pb37 10 9 8 7 6 5 4 3 2 1 3. Micron – MTFC32GJDDQ-4M A T 1.0 TYP Ball A1 ID U 1.0 TYP 9.0 CTR B 36X Ø0.325 on 0.5 pitch. Ni/Au plated test pads. No solder balls. D E 10.0 CTR 0 CTR 1.3 ±0.1 0.303 MIN 14 ±0.1 C November 21, 2014 • Revision 1.0 P reserves the right to change products or specifications without notice. Micron Technology, Inc. R © 2013 Micron Technology, Inc. All rights reserved. F G H J K L M N Notes: 1. Dimensions are in millimeters. 2. Solder ball material: SnAgCu (96.5% Sn, 3% Ag, 0.5% Cu). 3. Test pads are not solder balls and are for Micron internal use only. Micross US (Americas) • 407.298.7100 Micross UK (EMEA & ROW) • +44 (0) 1603 788967 [email protected] www.micross.com P R 1.0 TYP T Form #: CSI-D-686 Document 013