TISP61089M

CO
M
PL
IA
N
T
TISP61089M
*R
oH
S
PROGRAMMABLE OVERVOLTAGE PROTECTOR
DUAL FORWARD-CONDUCTING P-GATE THYRISTOR
TISP61089M SLIC Overvoltage Protector
High 70 A 5/310 Capability
Dual Voltage-Programmable Protector
- Supports Voltages Down to -155 V
- Low 5 mA max. Gate Triggering Current
- High 150 mA min. Holding Current
8 Pin Small-Outline (D008) Package (Top View)
K1
(Tip)
1
8
K1 (Tip)
2
7
A
(Ground)
NC
3
6
A
(Ground)
(Ring) K2
4
5
K2 (Ring)
(Gate) G
Description
MD6XANB
NC - No internal connection
Terminal typical application names shown in
parenthesis
The TISP61089M is a dual forward-conducting buffered p-gate overvoltage protector. It is designed to protect monolithic SLICs (Subscriber
Line Interface Circuits) against overvoltages on the telephone line caused
by lightning, a.c. power contact and induction. The TISP61089M limits
voltages that exceed the SLIC supply rail voltage. The TISP61089M
parameters are specified to allow equipment compliance with Bellcore
GR-1089-CORE, ITU-T K.21 and K.45 and YD/T-950.
Device Symbol
K1
The SLIC line driver section is typically powered from 0 V (ground) and a
negative voltage in the region of -20 V to -155 V. The protector gate is
connected to this negative supply. This references the protection
(clipping) voltage to the negative supply voltage. As the protection voltage
will then track the negative supply voltage, the overvoltage stress on the
SLIC is minimized.
K1
A
G
A
Positive overvoltages are clipped to ground by diode forward conduction.
Negative overvoltages are initially clipped close to the SLIC negative
supply rail value. If sufficient current is available from the overvoltage,
then the protector will crowbar into a low voltage on-state condition. As
the overvoltage subsides, the high holding current of the crowbar helps
prevent d.c. latchup.
K2
K2
Terminals K1, K2 and A correspond to the alternative
line designators of T, R and G or A, B and C. The
negative protection voltage is controlled by the
voltage, VGG, applied to the G terminal.
These monolithic protection devices are fabricated in ion-implanted
planar vertical power structures for high reliability and in normal system
operation they are virtually transparent. The TISP61089M buffered gate
design reduces the loading on the SLIC supply during overvoltages
caused by power cross and induction. The TISP61089M is available in
an 8-pin plastic small-outline surface mount package.
SD6XAEBa
How to Order
Device
Package
TISP61089M
8 Pin Small Outline (D008)
Carrier
Embossed Tape Reeled
Order As
Marking Code
TISP61089MDR-S
1089M
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
SEPTEMBER 2013
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Standard Quantity
2500
TISP61089M SLIC Overvoltage Protector
Absolute Maximum Ratings, TJ = 25 °C (Unless Otherwise Noted)
Symbol
Value
Unit
Repetitive peak off-state voltage, I G = 0
Rating
TJ = 25 °C
VDRM
-170
V
Repetitive peak gate-cathode voltage, VKA = 0
TJ = 25 °C
VGKRM
-167
V
ITSP
70
120
0.1 s
11
1s
ITSM
4.5
Non-repetitive peak on-state pulse current (see Notes 1 and 2)
10/1000 μs (Bellcore GR-1089-CORE, Issue 1, November 1994, Section 4)
30
5/310 μs (ITU-T K.20/21/45, YD/T-950, open-circuit voltage wave shape 10/700 μs)
2/10 μs (Bellcore GR-1089-CORE)
A
Non-repetitive peak on-state current, 60 Hz (see Notes 1 and 2 and Figure 2 on Page 4)
5s
A
2.4
300 s
0.95
900 s
0.93
Junction temperature
Storage temperature range
TJ
-40 to +150
°C
Tstg
-40 to +150
°C
NOTES: 1. Initially the protector must be in thermal equilibrium with TJ = 25 °C. The surge may be repeated after the device returns to its
initial conditions.
2. The rated current values may be applied either to the Ring to Ground or to the Tip to Ground terminal pairs. Additionally, both
terminal pairs may have their rated current values applied simultaneously (in this case the Ground terminal current will be twice
the rated current value of an individual terminal pair).
Recommended Operating Conditions
Min
CG
Gate decoupling capacitor
Typ
Max
100
Unit
nF
Electrical Characteristics, TJ = 25 °C (Unless Otherwise Noted)
Parameter
ID
Test Conditions
Off-state current
V(BO)
Breakover voltage
VF
Forward voltage
VFRM
Peak forward recovery
voltage
IH
Holding current
Max
Unit
TJ = 25 °C
-5
µA
TJ = 85 °C
-50
µA
-112
V
I F = 5 A, t w = 200 μs
3
V
2/10 µs, IF = 100 A, di/dt = 80 A/µs, R S = 50 Ω, (see Note 4)
10
V
VD = VDRM, VGK = 0
2/10 µs, I TM = -100 A, di/dt = -80 A/µs, RS = 50 Ω, VGG = -100 V,
(see Note 4)
I T = -1 A, di/dt = 1A/ms, VGG = -100 V
IGAS
Gate reverse current
VGG = VGK = VGKRM, VKA = 0
IGT
Gate trigger current
I T = -3 A, t p(g) ≥ 20 µs, VGG = -48 V
VGT
Gate trigger voltage
IT = -3 A, t p(g) ≥ 20 µs, VGG = -48 V
CAK
Min
Anode-cathode off-state f = 1 MHz, V = 1 V, I = 0, (see Note 3)
d
G
capacitance
Typ
-150
mA
TJ = 25 °C
-5
TJ = 85 °C
-50
µA
5
mA
µA
2.5
V
VD = -3 V
100
pF
VD = -48 V
50
pF
NOTE: 3. These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured
device terminals are a.c. connected to the guard terminal of the bridge.
NOTE: 4. Voltage measurements should be made with an oscilloscope with limited bandwidth (20 MHz) to avoid high frequency noise.
SEPTEMBER 2013
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TISP61089M SLIC Overvoltage Protector
Thermal Characteristics
Parameter
RθJA
Test Conditions
Junction to free air thermal resistance
Min
Typ
Ptot = 0.8 W, TA = 25 °C
5 cm2, FR4 PCB
Max
Unit
160
°C/W
Parameter Measurement Information
+i
Quadrant I
IFSP (= |TSP )
Forward
Conduction
Characteristic
IFSM (= |TSM )
IF
VF
VGK(BO)
VGG
-v
VD
ID
I(BO)
IH
IS
V(BO)
VS
+v
VT
IT
ITSM
Quadrant III
Switching
Characteristic
ITSP
-i
Figure 1. Voltage-Current Characteristic
Unless Otherwise Noted, All Voltages are Referenced to the Anode
SEPTEMBER 2013
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
PM6XAAA
TISP61089M SLIC Overvoltage Protector
Thermal Information
PEAK NON-RECURRING A.C.
vs
CURRENT DURATION
ITSM - Peak Non-Recurrent 60 Hz Current - A
T16LACAa
RING AND TIP CONNECTIONS ITSM applied simultaneously to both
GROUND CONNECTION Return current is twice ITSM
10
VGEN = 600 Vrms
RGEN = 70 to 950 Ω
VG = -48 V, TAMB = 25 °C
1
0.1
1
10
100
1000
t - Current Duration - s
Figure 2. Non-Repetitive Peak On-State Current against Duration
SEPTEMBER 2013
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TISP61089M SLIC Overvoltage Protector
Applications Information
Typical Applications Circuit
Figure 3 shows a typical TISP61089M SLIC card protection circuit. The incoming line conductors, Ring (R) and Tip (T), connect to the relay
matrix via the series overcurrent protection. Positive temperature coefficient (PTC) resistors can be used for overcurrent protection.
Resistors will reduce the prospective current from the surge generator for both the TISP61089M and the ring/test protector.
OVERCURRENT
PROTECTION
TIP
WIRE
RING
RELAY
+t°
R1a
55 Ω
RING
WIRE
TEST
RELAY
SLIC
RELAY
S3a
S1a
SLIC
PROTECTOR
SLIC
Th4
S2a
Th5
+t°
R1b
55 Ω
S3b
S1b
TISP61089M
S2b
C1
100 nF
TEST
EQUIPMENT
RING
GENERATOR
Figure 3. Typical Application Circuit
SEPTEMBER 2013
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
VBAT
AI6XAJd
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Phone
Fax
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Phone
Fax
Technical Assistance
Region
The Americas:
+1-951-781-5500
+1-951-781-5700
Europe:
+41(0)41-7685555
+41(0)41-7685510
Asia-Pacific:
+886-2-25624117
+886-2-25624116
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To obtain technical applications assistance, a quotation, or to place an order, contact a Bourns representative in your area.
“TISP” is a registered trademark of Bourns Ltd., a Bourns Company, in the United States and other countries, except that “TISP” is a registered trademark of
Bourns, Inc. in China.
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