MATERIAL DATA SHEET Material # CDSFR & CDSF series(1005) (Halogen Free) Product Line Integrated Passive & Active Devices Date 2011/10/5 Rev. E COMPONENT DETAILS No. 1 2 3 4 5 Construction element FR-4 Board Wafer Al wire Silver paste Molding Compound Material group Material CAS if applicable Average mass (%) Copper 7440-50-8 27.62% Nickel 7440-02-0 4.244% Gold 7440-57-5 0.140% Continuous Filament Fiber Glass 65997-17-3 68.00% Silicon 7440-21-3 90.40% Aluminum 7429-90-5 0.10% Material weight (mg) Substrate/ Terminal Diode Conductor Welding Outer Total weight Comchip Technology CO., LTD. 2.716 0.057 Gold 7440-57-5 9.50% Al i Aluminum 7429 90 5 7429-90-5 >99% 99% Silicon 7440-21-3 <1% Modified Epoxy Resin 29690-82-2 5~25% Silver 7440-22-4 76~85% Imidazole 827-43-0 1~4% 0.002 0.012 3.762 Amide 461-58-5 1~4% Silica 60676-86-0 70~90% Epoxy Resin 29690-82-2 6~16% Phenolic Resin 9003-35-4 5~15% Carbon Black 1333-86-4 0.1~1% 6.549 www.comchip.com.tw TEL: +886-2-86776675 FAX: +886-2-86776672 1/1 Sum(%) 41.47 0.87 0.03 0.18 57.44 Traces