APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet RoHS Specification SSC-Z5 series August 2012 1 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 X10490 Z-Power LED Technical Data Sheet Z5 series Z5 Features Description • Super high Flux output The Z-Power series is designed for and high Luminance • Designed for high high current operation and high flux current operation output applications. • SMT solderable It incorporates state of the art SMD • Lead Free product • RoHS compliant design and low thermal resistant material. The Z Power LED is ideal light sources for general illumination applications, custom designed solutions, large backlights and Applications high performance torches. • General Torch • Architectural lighting • Projector light source • Traffic signals • Task lighting • Decorative / Pathway lighting • Remote / Solar powered lighting August 2012 2 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet Contents 1. Full code of Z5 series 2. Outline dimensions 3. Characteristics of SZWN5A0B (Neutral) 4. Characteristic diagrams 5. CIE Chromaticity Diagram (Neutral) 6. Bin Code Description 7. Labeling 8. Packing 9. Recommended solder pad 10. Soldering 11. Precaution for use 12. Handling of Silicone Resin LEDs August 2012 3 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 1. Full code of Z5 series Full code form : X1 X2 X3X4 X5X6 X7X8 1. Part Number X1 Company X2 Z-Power LED series number X3X4 Color Specification W0 Pure White WN Neutral White WW Warm White X5 PKG Series 5 Z5 series X6 Lens type X7 PCB Type 2. Internal Number X8 Revision No. August 2012 4 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 2. Outline dimensions Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] Undefined tolerance is ± 0.1mm August 2012 5 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 3. Characteristics of SZWN5A0B (neutral) Neutral White 1-1 Electro-Optical characteristics at 350mA Parameter Luminous Flux CRI Forward Voltage Typ Max - 115 - - 102 - CCT - 4200 - K Ra 80 - - - VF - 3.30 - V ФV (Tj=100 [6] [4] Unit Min ФV [2] Correlated Color Temperature [3] ℃, RH30%) Value Symbol [1] (Ta=25 ℃) lm Thermal resistance (J to S) RθJ-S 6.5 K/W View Angle 2Θ ½ 120 deg. Parameter Symbol Value Unit Forward Current IF Reverse Voltage Vr 5 V Power Dissipation Pd 2.6 W Junction Temperature Tj 145(@ IF ≤ 700mA) ºC Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC - 2 kV 1-2 Absolute Maximum Ratings ESD Sensitivity(HBM) [5] 700 1500 (100ms, 1/10duty) mA *Notes : [1] SSC maintains a tolerance of ±7% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrating sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : ±0.005, CCT ±5% tolerance. [4] Tolerance is ±0.06V on forward voltage measurements [5] A zener diode is included to protect the product from ESD. [6] Tolerance is ±2.0 on CRI measurements August 2012 6 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 4. Characteristic diagrams Color Spectrum (IF=350mA, Ta=25 ℃, RH30%) SZWN5A0B 1.0 Relative Output 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 800 Wavelength[nm] August 2012 7 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet Forward Current Characteristics ℃ Forward Current vs. Forward Voltage, Ta=25 0.8 SZWN5A0B Forward Current[A] 0.6 0.4 0.2 0.0 2.0 2.5 3.0 3.5 4.0 Forward Voltage[V] ℃ Forward Current vs. Normalized Relative Luminous Flux, Ta=25 200 Relative Luminous Flux [%] SZWN5A0B 150 100 50 0 0.0 0.2 0.4 0.6 0.8 Forward Current [A] August 2012 8 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet Forward Current Characteristics ℃ Forward Current vs. Chromaticity Coordinate, Ta=25 Chromaticity Coordinate Shift 0.015 SZWN5A0B CIE X CIE Y 0.010 0.005 0.000 -0.005 -0.010 -0.015 0.0 0.2 0.4 0.6 0.8 Forward Current [A] ℃ Forward Current vs. CCT, Ta=25 500 Relative CCT Shift [K] SZWN5A0B 250 0 -250 -500 0.0 0.2 0.4 0.6 0.8 Forward Current [A] August 2012 9 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet Junction Temperature Characteristics Junction Temperature vs. Relative Light Output at IF=350mA 120 SZWN5A0B Relative Luminous Output[%] 100 80 60 40 20 0 25 50 75 100 125 150 o Junction Temperature[ C] Junction Temperature vs. Forward Voltage at IF=350mA 0.2 Forward Voltage Shift [V] SZWN5A0B 0.0 -0.2 -0.4 -0.6 25 50 75 100 125 150 o Junction Temperature[ C] August 2012 10 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet Junction Temperature Characteristics Junction Temperature vs. Chromaticity Coordinate at IF=350mA Chromaticity Coordinate Shift 0.02 SZWN5A0B CIE X CIE Y 0.01 0.00 -0.01 -0.02 25 50 75 100 o 125 150 Junction Temperature[ C] CCT vs. Junction Temperature at IF=350mA 750 Relative CCT Shift [K] SZWN5A0B 500 250 0 -250 25 50 75 100 125 150 o Junction Temperature [ C] August 2012 11 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet Characteristic diagrams ℃ Ambient Temperature vs. Allowable Forward Current (Tjmax = 145 , @0.7A) Maximum Current [mA] 800 600 400 o Rj-a=10 C/W o Rj-a=15 C/W o Rj-a=20 C/W 200 0 0 20 40 60 80 100 120 140 o Ambient Temperature [ C] Radiation pattern at 350mA 0 1.0 30 Relative Luminous Flux 0.8 0.6 60 0.4 0.2 0.0 -80 -60 -40 -20 0 90 Angle [deg] August 2012 12 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 5. CIE Chromaticity Diagram (Neutral) ℃ IF = 350mA] [Ta = 25 August 2012 13 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 6. Bin Code Description Bin Code Luminous Flux (lm) @ IF = 350mA Color Chromaticity Coordinate @ IF = 350mA Forward Voltage (V) @ IF = 350mA U3 E2 H Luminous Flux (lm) @ IF = 350mA Bin Code Min. Max. U2 100 109 Color Chromaticity Coordinate @ IF = 350mA Bin Code Min. Max. Forward Voltage (V) @ IF = 350mA Bin Code Min. Max. H 3.00 3.25 Ref. 13 pages U3 109 118.5 I 3.25 3.50 V1 118.5 130 J 3.50 3.75 August 2012 14 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 7. Labeling X10X11X12X13 1000 ############### SZWN5A0B SZWN5A0B Full code form X1X2X3X4X5X6X7X8 -X1 : Company -X2 : Z-Power LED series number -X3 X4 : Color Specification -X5 : PKG Series -X6 : Lens type -X7 : PCB Type -X8 : Revision No. Rank X10X11X12X13 -X10 : Luminous Flux : LF [lm] -X11X12: Color coordinates : x, y -X13 : Forward Voltage : VF [V] Lot No #1#2#3#4#5#6 - #7#8#9#10 - #11#12#13 - #1 #2 : Year - #7 #8 #9 #10 : Mass order - #3 #4 : Month - #11 #12 #13 : Tray No. - #5 #6 : Day August 2012 15 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 8. Packing Φ CATHODE MARK Φ 22 13 (1) Quantity : 1000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 10-60g when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package August 2012 16 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 8. Packing ● Reel Packing Structure X10X11X12X13 1000 ############### SZWN5A0B SZWN5A0B X10X11X12X13 2 1000 ############### SZWN5A0B SZWN5A0B ******* ******* ******* ******* ******* August 2012 17 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 9. Recommended solder pad Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] This drawing without tolerances are for reference only [4] Undefined tolerance is ± 0.1mm August 2012 18 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 10. Soldering IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215 260 Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. ℃ ℃ * Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. August 2012 19 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 11. Precaution for use (1) Storage To avoid the moisture penetration, we recommend storing Z5 Series (Z Power) LEDs ℃ to 30℃ in a dry box with a desiccant . The recommended storage temperature range is 5 and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40 ℃ Humidity : less than RH30% b. If the package has been opened more than 1 year (MSL 2) or the color of ± the desiccant changes, components should be dried for 10-12hr at 60 5 ℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. August 2012 20 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 11. Precaution for use (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) The slug is isolated from anode electrically. Therefore, we recommend that you don’t isolate the heat sink. (15) Attaching LEDs, do not use adhesives that outgas organic vapor. (16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. August 2012 21 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12 APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Technical Data Sheet 12. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts. August 2012 22 www.seoulsemicon.com Document No. : SSC- QP- 7- 07- 12