QTR: 2014-00376 Rev: 01 Package: LC3, LC3B

Analog Devices Welcomes
Hittite Microwave Corporation
NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
www.analog.com
www.hittite.com
Report Title:
Qualification Test Report
Report Type:
See Attached
Date:
See Attached
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
HMC258LC3B
HMC260LC3B
HMC264LC3B
HMC292LC3B
HMC329LC3B
HMC338LC3B
HMC341LC3B
HMC344LC3
HMC346LC3B
HMC347LC3B
HMC441LC3B
HMC442LC3B
HMC447LC3
HMC448LC3B
HMC449LC3B
HMC451LC3
HMC524LC3B
HMC547LC3
HMC553LC3B
HMC554LC3B
HMC558LC3B
HMC573LC3B
HMC576LC3B
HMC578LC3B
HMC594LC3B
HMC663LC3
HMC670LC3C
HMC671LC3C
HMC672LC3C
HMC673LC3C
HMC674LC3C
HMC675LC3C
HMC676LC3C
HMC678LC3C
HMC679LC3C
HMC706LC3C
HMC720LC3C
HMC721LC3C
HMC722LC3C
HMC723LC3C
HMC724LC3C
HMC725LC3C
HMC726LC3C
HMC727LC3C
HMC728LC3C
HMC729LC3C
HMC744LC3C
HMC745LC3C
HMC746LC3C
HMC747LC3C
HMC748LC3C
HMC749LC3C
HMC773LC3B
HMC774LC3B
HMC787LC3B
HMC814LC3B
HMC850LC3C
HMC851LC3C
HMC853LC3C
HMC865LC3C
HMC866LC3C
HMC874LC3C
HMC875LC3C
HMC876LC3C
HMC974LC3C
HMC1084LC4
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
Introduction
The Reliability tests summarized in this report are designed to satisfy the reliability requirements designated by
Hittite Microwave Corporation. The testing was devised to simulate exposure to environments the product may
experience during assembly, test, and life in the end user application. The pass/fail criteria are dependent upon DC
and critical RF parameters determined by the appropriate catalog specifications. A complete data sheet for the
devices tested can be found at www.hittite.com.
The Package Reliability Plan is as follows:
Package Reliability
QTR: 2014-00376
Package: LC3, LC3B, LC3C
Rev: 01
Glossary of Terms & Definitions:
1. Autoclave: A highly accelerated moisture stress test (unbiased). Devices are subjected to 96 hours of 100%
relative humidity at a temperature of 121°C and pressure (14.7 PSIG). This test is performed in accordance with
JEDEC JESD22-A102.
2. HTSL: High Temperature Storage Life. Devices are subjected to 1000 hours at 150oC. This test is performed in
accordance with JEDEC JESD22-A103.
3. MSL Preconditioning: Moisture sensitivity level pre-conditioning is performed in accordance with JEDEC
JESD22-A113, lead free, 260°C peak temperature (see Appendix 1 for reflow profile).
4. Physical Dimensions: Devices are inspected to the current package outline drawing to ensure all package
dimensions are within specification (see Appendix 2 for applicable outline drawings).
5. Solderability: Devices are subjected to 8 hours of steam age and Method 1 Dip and Look testing in accordance
with JEDEC JESD22-B102.
6. Temperature Cycle: Devices are subjected to 500 non-operating temperature cycling from -65°C to 150°C in
accordance with JEDEC JESD22-A104.
7. UHAST: Unbiased Highly Accelerated Stress Test. Devices are subjected to 96 hours of 85% relative humidity at
a temperature of 130°C and pressure (18.6 PSIG). This test was performed in accordance with JEDEC JESD22A118.
8. X-Ray Analysis: Devices are inspected to the current assembly drawing to ensure devices are assembled correctly
and are free of any assembly anomalies.
Qualification Sample Selection:
All qualification devices used were manufactured and tested on standard production processes and met pre-stress
acceptance test requirements.
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
Summary of Qualification Tests:
HMC258LC3B (QTR2008-00001)
TEST
QTY IN
QTY OUT
PASS / FAIL
Initial Electrical
174
174
Complete
MSL Preconditioning
144
144
Complete
MSL Preconditioning Final Test
144
144
Pass
Autoclave (Preconditioned)
77
77
Complete
Autoclave Final Test
77
77
Pass
Temperature Cycle (Preconditioned)
67
67
Complete
Temperature Cycle Final Test
67
67
Pass
Solderability
15
15
Pass
Physical Dimensions
15
15
Pass
NOTES
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
HMC814LC3B (QTR2012-00321)
TEST
QTY IN
QTY OUT
PASS / FAIL
Initial Electrical
340
340
Complete
HTOL, 1000 hours
77
77
Complete
Post HTOL Electrical Test
77
77
Pass
HTSL, 1000 hours
80
80
Complete
Post HTSL Electrical Test
80
80
Pass
MSL Preconditioning
156
156
Complete
MSL Preconditioning Final Test
156
156
Pass
UHAST (Preconditioned)
78
78
Complete
UHAST Final Test
78
78
Pass
Temperature Cycle (Preconditioned)
78
78
Complete
Temperature Cycle Final Test
78
78
Pass
Solderability
6
6
Pass
Physical Dimensions
15
15
Pass
X-Ray
6
6
Pass
NOTES
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
Cumulative Summary of All LC3 Package Tests
TEST
Total Units Total Units
Tested
Passed
Total Units
Failed
HTSL, 1000 hours
80
80
0
Temperature Cycle (Preconditioned)
145
145
0
Autoclave (Preconditioned)
77
77
0
UHAST (Preconditioned)
78
78
0
Solderability
21
21
0
Physical Dimensions
30
30
0
X-Ray
6
6
0
Comments
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
Appendix 1
Reflow Profile for MSL Preconditioning
Temperature
(°C)
Time (seconds)
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
Appendix 2
LC3 Outline
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
LC3B Outline
Rev: 01
QTR: 2014-00376
Package: LC3, LC3B, LC3C
LC3C Outline