Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached Package Type: 6L SC70 Package Style: 6 Lead Plastic SC70 Package HMC311SC70 (E) HMC474SC70 (E) HMC476SC70 (E) HMC478SC70 (E) Gain Block Amplifier Gain Block Amplifier Gain Block Amplifier Gain Block Amplifier QTR: 08002 Rev: 01 Package Type: 6L SC70 Package Style: 6 Lead Plastic SC70 Package QTR: 08002 Rev: 01 1.0 Introduction This qualification procedure is designed to satisfy the package reliability requirements for the 6 lead SC70 surface mount plastic encapsulated package. The testing is designed to simulate the worst-case environments the product may experience during assembly, test and life in the end user application. The device is electrically tested to the appropriate catalog specifications. The HMC311SC70E was selected to qualify the SC70 surface mount plastic encapsulated family of packages. 1.1 General Description The 6L SC70 package uses a copper alloy lead frame. The lead frame is silver plated internally to enable gold wire bonding. The MMIC device is epoxy attached to the paddle. The device interconnection is performed using 1 mil gold ball bonds. The part is encapsulated using Sumitomo EME G600 or equivalent epoxy encapsulating compound. The leads are available finished with either 85/15 SnPb or 100% Matte Sn plating. The HMC311SC70E used as the qualification test vehicle is a GaAs InGaP Heterojunction Bipolar Transistor (HBT) Gain Block MMIC SMT DC to 8 GHz amplifier. The amplifier can be used as either a cascadable 50 Ohm gain stage or to drive the LO port of HMC mixers with up to +15 dBm output power. The HMC311SC70(E) offers 15 dB of gain and an output IP3 of +30 dBm while requiring only 54 mA from a +5V supply. The Darlington topology results in reduced sensitivity to normal process variations, and yields excellent gain stability over temperature while requiring a minimal number of external bias components. Figure 1: Typical SC70 Package Package Type: 6L SC70 Package Style: 6 Lead Plastic SC70 Package Figure 2: SC70 Package Outline Drawing QTR: 08002 Rev: 01 Package Type: 6L SC70 Package Style: 6 Lead Plastic SC70 Package Figure 3: Suggested PCB Land Pattern QTR: 08002 Rev: 01 Package Type: 6L SC70 Package Style: 6 Lead Plastic SC70 Package QTR: 08002 Rev: 01 2.0 Summary of Results PARA TEST QTY IN QTY OUT 3.1.1 Initial Electrical Test 137 137 25 25 Complete 137 137 Complete 25 25 Pass/No Failures 61 61 Complete 61 61 Pass/No Failures 76 Complete 3.1.2 3.1.3 3.1.4 3.1.5 3.1.6 Pre Reflow Acoustic Microscopy MSL1 260°C Reflow Preconditioning (3 Passes) Post Reflow Acoustic Microscopy Temperature Cycling Exposure Post Temperature Cycle Electrical Test 3.1.7 Autoclave Exposure 76 3.1.8 Post Autoclave Electrical Test 76 3.2.1 3.2.2 3.2.3 PASS/FAIL Pass/No Failures Pass/No Failures Pass/No Lead Co-planarity 15 15 Failures Pass/No Physical Dimensions 15 15 Failures Pass/No Solderability 14 14 Failures All testing has been completed. There were no relevant failures. 76 NOTES Package Type: 6L SC70 Package Style: 6 Lead Plastic SC70 Package QTR: 08002 Rev: 01 3.0 Test Procedures 3.1 Package Environmental Tests These tests are designed to demonstrate that the SC70 surface mount plastic encapsulated family of packages are capable of maintaining the specified parameters throughout their useful life under rated operating conditions. The HMC311SC70E was selected to qualify the SC70 surface mount plastic encapsulated family of packages. The results of these tests qualify by similarity all other product using the same package. 3.1.1 Initial Characteristics - 137 HMC311SC70E devices were electrically tested for DC and critical RF parameters. These tests are performed at ambient temperature (+25°C). This test was performed at Hittite. There were no failures in this test. 3.1.2 Pre Reflow Acoustic Microscopy – 25 serialized devices from 3.1.1 were inspected using a Sonix acoustic microscope. The devices were inspected for delamination and cracking as a baseline prior to MSL 1 260°C reflow. This analysis was performed at Hittite. 3.1.3 MSL1 260°C Reflow Preconditioning – 137 devices from 3.1.1 were subjected to 168 hours at 85°C/ 85% RH then a reflow simulation at a peak temperature of 260°C for 3 passes (see Figure 1 for profile). 3.1.4 Post Reflow Acoustic Microscopy – 25 serialized devices from 3.1.3 were inspected using a Sonix acoustic microscope. The devices were inspected for any package cracking or significant changes in delamination using the pre MSL 1 260°C reflow results as the baseline. The industry standard specification JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices” was used as the pass / fail guideline. This analysis was performed at Hittite. There were no failures. 3.1.5 Temperature Cycle - 61 devices from 3.1.3 were subjected to 500 cycles of non-operating temperature cycling from -65°C to 150°C. This test is performed at Hittite. 3.1.6 Final Electrical Test - 61 devices from 3.1.5 were electrically tested at ambient temperature to DC and critical RF parameters. Any out of specification parameter is considered a failure. This test was performed at Hittite. There were no failures in this test. 3.1.7 Autoclave - 76 devices from 3.1.3 were subjected to 96 hours of humidity (100%), temperature (121°C) and pressure (15 PSIG). This test is performed at Hittite using an Espec environmental chamber. 3.1.8 Final Electrical Test - 76 devices from 3.1.7 were electrically tested at ambient temperature to DC and critical RF parameters. Any out of specification parameter is considered a failure. This test was performed at Hittite within 48 hours after removal from the chamber. There were no failures in this test. Package Type: 6L SC70 Package Style: 6 Lead Plastic SC70 Package QTR: 08002 Rev: 01 3.2 Package Mechanical Tests 3.2.1 1 Coplanarity - 15 devices were measured for lead coplanarity. Coplanarity in excess of .004” (0.1 mm) was considered a reject. These devices need not be electrically functional. This test is performed at Hittite. There were no failures. 3.2.2 Physical Dimensions - 15 devices were measured to the requirement of the data sheet package outline drawing. These devices need not be electrically functional. Any out of specification parameter is considered a failure. This test is performed at Hittite. There were no failures. 3.2.3 Solderability - 14 devices were subjected to the steam aging and solderability test in accordance with MIL-STD883 Method 2003. These devices need not be electrically functional. This test was performed at Hittite. There were no failures. Package Type: 6L SC70 Package Style: 6 Lead Plastic SC70 Package Temperature (°C) Figure 4: 260°C Reflow Profile Time in Seconds QTR: 08002 Rev: 01