CSOD1100SH

CYStech Electronics Corp.
1.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C338SH
Issued Date : 2010.06.10
Revised Date :2015.06.18
Page No. : 1/6
SOD-123
CSOD1100SH
Features
 For surface mounted applications.
 For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
 Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
 Low leakage current
 High surge capability
 High temperature soldering: 250C/10 seconds at terminals
 Exceeds environmental standards of MIL-S-19500/228
 RoHS compliant package
Mechanical Data
 Case: Molded plastic, JEDEC SOD-123.
 Terminals: Pure tin plated, solderable per MIL-STD-202 method 208
 Polarity: Indicated by cathode band.
 Weight: 0.009 gram approximately
Ordering Information
Device
CSOD1100SH-0-T1-G
Package
SOD-123
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
CSOD1100SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C338SH
Issued Date : 2010.06.10
Revised Date :2015.06.18
Page No. : 2/6
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified.)
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage, IF=1A (Note 1)
Average forward rectified current
Peak forward surge current @8.3ms single half sine wave
superimposed on rated load (JEDEC method)
Maximum DC reverse current
VR=100V,TJ=25℃(Note 1)
VR=100V,TJ=125℃(Note 1)
Maximum thermal resistance, Junction to ambient
Typical Diode junction capacitance @ f=1MHz and applied 5V
reverse voltage
Maximum Reverse Recovery Time @ IF=1A, dIF/dt=100A/μs
Storage temperature range
Operating temperature range
Symbol
VRRM
VRMS
VR
VF
IO
Limits
100
70
100
0.85
1
Units
V
V
V
V
A
IFSM
10
A
IR
Rth,JA
0.3
10
250
℃/W
CD
26
pF
trr
75
ns
Tstg
TJ
-65 ~ +175
-50 ~ +150
℃
℃
mA
mA
Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle
Recommended Soldering Footprint
CSOD1100SH
CYStek Product Specification
Spec. No. : C338SH
Issued Date : 2010.06.10
Revised Date :2015.06.18
Page No. : 3/6
CYStech Electronics Corp.
P e a k F o r w a r d S u r gFSM
e (A)
Current---I
Typical Characteristics
Fig. 1 Forward Current Derating Curve
Average Forward Current---Io(A)
1.2
1
0.8
0.6
0.4
resistive or inductive load
0.375"(9.5mm) lead length
0.2
Fig. 2 Ma x imum Non-re pe titive Pe a k
Forw a rd Surge Curre nt
12
10
8
6
4
2
0
0
0
25
50
75
100
125
150
175
1
200
10
R e v e r s e L e a k a g e RC(μuA)r r e n t - - - I
Case Temperature---TC(℃)
Fig 3. Forward Characteristics
Instantaneous Forward Current---IF(mA)
10000
F i g . 4 T y p i c a l R e v e r se
C h a r a c t e r i st
1000
1000
100
10
Pulse width=300μs,
1% Duty cycle
1
Tj=125℃
100
Tj=75℃
10
1
Tj=25℃
0.1
0
0.2
0.4
0.6
0.8
1
1.2
Forward Voltage---VF(V)
1.4
0
10
20
30
40
50
60
70
80
90 100
R e v e r s e V o l tRa( gV e) - - - V
Fig. 6 Typical Transient Thermal
Impedance
Fig. 5 Typical Junction Capacitance
100
100
Transient Thermal Impedance(℃/W)
Junction Capacitance---C J(pF)
100
Numbe r of c yc le s a t 60Hz
10
Tj=25℃, f=1.0MHz
Vsig=50mVp-p
1
10
1
0.1
0.1
1
10
Reverse Voltage---VR(V)
CSOD1100SH
100
0.01
0.1
1
10
100
Pulse Duration---t(s)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C338SH
Issued Date : 2010.06.10
Revised Date :2015.06.18
Page No. : 4/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260
+0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak
temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6C/second max.
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
CSOD1100SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C338SH
Issued Date : 2010.06.10
Revised Date :2015.06.18
Page No. : 5/6
Reel Dimension
Carrier Tape Dimension
CSOD1100SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C338SH
Issued Date : 2010.06.10
Revised Date :2015.06.18
Page No. : 6/6
SOD-123 Dimension
Marking:
SP
2-Lead SOD-123 Plastic
Surface Mounted Package
CYStek Package Code: SH
Inches
Min.
Max.
0.102
0.110
0.059
0.067
0.041
0.049
DIM
A
B
C
Millimeters
Min.
Max.
2.600
2.800
1.500
1.700
1.050
1.250
Style: Pin 1.Cathode 2.Anode
DIM
D
E
Inches
Min.
Max.
0.018
0.026
0.140
0.152
Millimeters
Min.
Max.
0.450
0.650
3.550
3.850
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
 Lead: Pure tin plated.
 Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
 CYStek reserves the right to make changes to its products without notice.
 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSOD1100SH
CYStek Product Specification