CYStech Electronics Corp. Fast Switching Diodes Spec. No. : C335SH Issued Date : 2011.05.10 Revised Date : 2015.05.27 Page No. : 1/1 SOD-123 BAS21SH Features •Fast switching speed •Low forward voltage drop •Pb-free lead plating package Mechanical Data • Case: Molded plastic, JEDEC SOD-123. • Terminals: Pure tin plated, solderable per MIL-STD-202 method 208 • Polarity: Indicated by cathode band. • Weight: 0.01 gram approximately Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Non-repetitive peak reverse voltage Repetitive peak reverse voltage Working peak reverse voltage RMS voltage DC blocking voltage Forward continuous current Average rectified output current Peak forward surge current @ t=1ms t=1s Repetitive peak forward current Power dissipation Thermal resistance, Junction to ambient Operating and storage temperature range Symbol VRM VRRM VRWM VRMS VR IFM IO IFSM IFRM PD RθJA TJ;TSTG Type 250 250 250 141 250 400 200 2.5 0.5 625 500 250 -65 ~ +150 Units V mA A mA mW ℃/W ℃ Ordering Information Device BAS21SH-0-T1-G Package SOD-123 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel,7” reel Product rank, zero for no rank products Product name BAS21H CYStek Product Specification Spec. No. : C335SH Issued Date : 2011.05.10 Revised Date : 2015.05.27 Page No. : 2/2 CYStech Electronics Corp. Electrical Characteristics @ TA=25℃ unless otherwise specified Parameters Symbol Forward voltage VF Reverse current Junction Capacitance IR CJ Reverse recovery time trr Conditions IF=100mA IF=200mA VR=200V VR=0V, f=1MHz IF=IR=30mA, Irr=0.1×IR, RL=100Ω Min Typ. Unit V - Max 1 1.25 100 5 - - - - 50 ns nA pF Typical Characteristics Reverse Leakage Current vs Reverse Voltage Forward Current vs Forward Voltage 100 150°C Pulse width=300μs Reverse Leakage Current---IR(μA) Instantaneous Forward Current---IF(mA) 1000 100 150°C 125°C 10 100°C 1 75°C 25°C 0.1 10 125℃ 100℃ 1 75℃ 0.1 25℃ 0.01 0.001 0 0.3 0.6 0.9 Forward Voltage---VF(V) 1.2 1.5 0 50 150 200 250 Power Derating Curve Junction Capacitance vs Reverse Voltage 600 10 Tj=25℃, f=1.0MHz PD, Power Dissipation(mW) Junction Capacitance---C J(pF) 100 Reverse Voltage---VR(V) 1 500 400 300 200 100 0 0.1 0.1 1 10 Reverse Voltage---VR (V) BAS21H 100 0 25 50 75 100 125 150 175 TA, Ambient Temperature(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335SH Issued Date : 2011.05.10 Revised Date : 2015.05.27 Page No. : 3/3 Reel Dimension Carrier Tape Dimension BAS21H CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335SH Issued Date : 2011.05.10 Revised Date : 2015.05.27 Page No. : 4/4 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BAS21H CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335SH Issued Date : 2011.05.10 Revised Date : 2015.05.27 Page No. : 5/5 SOD-123 Dimension Marking: T3 2-Lead SOD-123 Plastic Surface Mounted Package CYStek Package Code: SH Inches Min. Max. 0.102 0.110 0.059 0.067 0.041 0.049 DIM A B C Millimeters Min. Max. 2.600 2.800 1.500 1.700 1.050 1.250 Style: Pin 1.Cathode 2.Anode DIM D E Inches Min. Max. 0.018 0.026 0.140 0.152 Millimeters Min. Max. 0.450 0.650 3.550 3.850 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAS21H CYStek Product Specification