MDL914S2

CYStech Electronics Corp.
Spec. No. : C303S2
Issued Date : 2003.12.11
Revised Date : 2014.01.21
Page No. : 1/6
High –speed switching diode
MDL914S2
Description
The MDL914S2 is a high-speed switching diode fabricated in planar technology, and encapsulated in
the small SOD-323 plastic SMD package.
Symbol
Outline
SOD-323
MDL914S2
-
+
Features
• Small plastic SMD package
• High switching speed: max. 4ns
• Reverse voltage: max. 100V
• Peak forward surge current: max. 500mA.
Applications
• High-speed switching in thick and thin-film circuits.
Ordering Information
Device
MDL914S2-0-T1-G
Package
SOD-323
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
MDL914S2
CYStek Product Specification
Spec. No. : C303S2
Issued Date : 2003.12.11
Revised Date : 2014.01.21
Page No. : 2/6
CYStech Electronics Corp.
Absolute Maximum Ratings @TA=25℃
Parameters
Symbol
VR
IF
IFRM
Reverse voltage
Forward current
Repetitive peak forward current
@t=1μs
@t=1ms
@t=1s
Non-repetitive peak forward current ;
square wave, Tj=25°C prior to surge
Junction Temperature
Storage Temperature
IFSM
Tj
Tstg
Min
-65
Max
100
250
500
4
1
0.5
150
+150
Unit
V
mA
mA
A
°C
°C
Electrical Characteristics @ TA=25℃ unless otherwise specified
Parameters
Symbol
Reverse breakdown voltage
VR
Forward voltage
VF
Reverse leakage current
IR
Diode capacitance
CD
Reverse recovery time
trr
Conditions
Min
IR=100μA
100
IF=1mA
IF=10mA
IF=50mA
IF=150mA
VR=20V
VR=100V
VR=0V, f=1MHz
when switched from IF=10mA
to IR=10mA,RL=100Ω,
measured at IR=1mA
Typ.
Max
Unit
-
-
715
855
1
1.25
30
1
1.5
V
mV
mV
V
V
nA
μA
pF
-
4
ns
-
Thermal Characteristics
Symbol
Parameter
Conditions
Ptot, Ta=25℃
Derate above 25℃
Rth, j-a
Total device dissipation on FR-4 board
Note 1
Thermal resistance from junction to ambient
Note 1
Max
200
1.57
625
Unit
mW
mW/℃
℃/W
Note 1: Device mounted on an FR-4 PCB.
MDL914S2
CYStek Product Specification
Spec. No. : C303S2
Issued Date : 2003.12.11
Revised Date : 2014.01.21
Page No. : 3/6
CYStech Electronics Corp.
Characteristic Curves
Forward Current vs Forward Voltage
Reverse Leakage Current vs Reverse Voltage
100
Reverse Leakage Current---IR( μA)
Forward Current---I F(mA)
100
T a=8 5℃
10
T a= 2 5℃
1
T a=- 40℃
0.1
10
T a= 150℃
1
T a= 125 ℃
Ta=85℃
0.1
Ta=55℃
0.01
T a= 25℃
0.001
0.2
0.4
0.6
0.8
1
1.2
Forward Voltage---VF(V)
0
10
20
30
40
50
Reverse Voltage---VR(V)
Capacitance vs Reverse Voltage
Diode Capacitance ---C D(pF)
0.68
f=1MHz
Ta=25℃
0.64
0.6
0.56
0.52
0
0.2
0.4
0.6
0.8
Reverse Voltage---VR (V)
MDL914S2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C303S2
Issued Date : 2003.12.11
Revised Date : 2014.01.21
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
MDL914S2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C303S2
Issued Date : 2003.12.11
Revised Date : 2014.01.21
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
MDL914S2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C303S2
Issued Date : 2003.12.11
Revised Date : 2014.01.21
Page No. : 6/6
SOD-323 Dimension
Marking:
K
A
55DH
2
1
Style: Pin 1.Cathode 2.Anode
B
D
2-Lead SOD-323 Plastic Surface
Mounted Package,
CYStek Package Code: S2
J
H
E
C
*: Typical
Inches
Min.
Max.
0.0630 0.0709
0.0453 0.0531
0.0315 0.0394
0.0098 0.0157
DIM
A
B
C
D
Millimeters
Min.
Max.
1.60
1.80
1.15
1.35
0.80
1.00
0.25
0.40
DIM
E
H
J
K
Inches
Min.
Max.
0.0060 REF
0.0000 0.0040
0.0035 0.0070
0.0906 0.1063
Millimeters
Min.
Max.
0.15 REF
0.00
0.10
0.089
0.177
2.30
2.70
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MDL914S2
CYStek Product Specification