CYStech Electronics Corp. Spec. No. : C303S2 Issued Date : 2003.12.11 Revised Date : 2014.01.21 Page No. : 1/6 High –speed switching diode MDL914S2 Description The MDL914S2 is a high-speed switching diode fabricated in planar technology, and encapsulated in the small SOD-323 plastic SMD package. Symbol Outline SOD-323 MDL914S2 - + Features • Small plastic SMD package • High switching speed: max. 4ns • Reverse voltage: max. 100V • Peak forward surge current: max. 500mA. Applications • High-speed switching in thick and thin-film circuits. Ordering Information Device MDL914S2-0-T1-G Package SOD-323 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name MDL914S2 CYStek Product Specification Spec. No. : C303S2 Issued Date : 2003.12.11 Revised Date : 2014.01.21 Page No. : 2/6 CYStech Electronics Corp. Absolute Maximum Ratings @TA=25℃ Parameters Symbol VR IF IFRM Reverse voltage Forward current Repetitive peak forward current @t=1μs @t=1ms @t=1s Non-repetitive peak forward current ; square wave, Tj=25°C prior to surge Junction Temperature Storage Temperature IFSM Tj Tstg Min -65 Max 100 250 500 4 1 0.5 150 +150 Unit V mA mA A °C °C Electrical Characteristics @ TA=25℃ unless otherwise specified Parameters Symbol Reverse breakdown voltage VR Forward voltage VF Reverse leakage current IR Diode capacitance CD Reverse recovery time trr Conditions Min IR=100μA 100 IF=1mA IF=10mA IF=50mA IF=150mA VR=20V VR=100V VR=0V, f=1MHz when switched from IF=10mA to IR=10mA,RL=100Ω, measured at IR=1mA Typ. Max Unit - - 715 855 1 1.25 30 1 1.5 V mV mV V V nA μA pF - 4 ns - Thermal Characteristics Symbol Parameter Conditions Ptot, Ta=25℃ Derate above 25℃ Rth, j-a Total device dissipation on FR-4 board Note 1 Thermal resistance from junction to ambient Note 1 Max 200 1.57 625 Unit mW mW/℃ ℃/W Note 1: Device mounted on an FR-4 PCB. MDL914S2 CYStek Product Specification Spec. No. : C303S2 Issued Date : 2003.12.11 Revised Date : 2014.01.21 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Forward Current vs Forward Voltage Reverse Leakage Current vs Reverse Voltage 100 Reverse Leakage Current---IR( μA) Forward Current---I F(mA) 100 T a=8 5℃ 10 T a= 2 5℃ 1 T a=- 40℃ 0.1 10 T a= 150℃ 1 T a= 125 ℃ Ta=85℃ 0.1 Ta=55℃ 0.01 T a= 25℃ 0.001 0.2 0.4 0.6 0.8 1 1.2 Forward Voltage---VF(V) 0 10 20 30 40 50 Reverse Voltage---VR(V) Capacitance vs Reverse Voltage Diode Capacitance ---C D(pF) 0.68 f=1MHz Ta=25℃ 0.64 0.6 0.56 0.52 0 0.2 0.4 0.6 0.8 Reverse Voltage---VR (V) MDL914S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303S2 Issued Date : 2003.12.11 Revised Date : 2014.01.21 Page No. : 4/6 Reel Dimension Carrier Tape Dimension MDL914S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303S2 Issued Date : 2003.12.11 Revised Date : 2014.01.21 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MDL914S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C303S2 Issued Date : 2003.12.11 Revised Date : 2014.01.21 Page No. : 6/6 SOD-323 Dimension Marking: K A 55DH 2 1 Style: Pin 1.Cathode 2.Anode B D 2-Lead SOD-323 Plastic Surface Mounted Package, CYStek Package Code: S2 J H E C *: Typical Inches Min. Max. 0.0630 0.0709 0.0453 0.0531 0.0315 0.0394 0.0098 0.0157 DIM A B C D Millimeters Min. Max. 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 DIM E H J K Inches Min. Max. 0.0060 REF 0.0000 0.0040 0.0035 0.0070 0.0906 0.1063 Millimeters Min. Max. 0.15 REF 0.00 0.10 0.089 0.177 2.30 2.70 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MDL914S2 CYStek Product Specification