CSOD0540SH

CYStech Electronics Corp.
Spec. No. : C291SH
Issued Date : 2009.12.22
Revised Date : 2015.06.18
Page No. : 1/6
0.5A surface mount Schottky diode
CSOD0540SH
Features
 High current capability, low forward voltage drop
 High surge current capability
 Guardring for over voltage protection
 Low power loss, high efficiency
 Ultra high-speed switching
 Low profile surface mounted package in order to minimize board space
 Pb-free package
Mechanical data
Case : Molded plastic, JEDEC SOD-123.
Epoxy : UL94-V0 rated flame retardant
Terminals : Plated terminals, solderable per MIL-STD-202 method 208
Polarity : Indicated by cathode band
Mounting position : Any
Weight : approx. 0.009 gram
Symbol
Outline
CSOD0540SH
2 (Anode)
SOD-123
Ordering Information
Device
CSOD0540-0-T1-G
Package
SOD-123
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
CSOD0540SH
CYStek Product Specification
Spec. No. : C291SH
Issued Date : 2009.12.22
Revised Date : 2015.06.18
Page No. : 2/6
CYStech Electronics Corp.
Absolute Maximum Ratings (TA=25℃, unless otherwise noted)
Parameters
Repetitive peak reverse voltage
RMS voltage
Continuous reverse voltage
Conditions
Forward rectified current
Symbol Min
Single phase half wave,
60Hz @TJ=25°C
8.3ms single half sine-wave
superimposed on rated load
(JEDEC method)
Forward surge current
Thermal resistance
Junction to Ambient
Storage temperature range
Operating junction temperature range
Typ
Max
Units
VRRM
40
V
VRMS
28
V
VR
40
V
IO
0.5
IF(AV)
1
IFSM
15
RJA
A
A
C/W
250
Tstg
-65
175
C
Tj
-55
125
C
Characteristics (TA=25C)
Characteristic
Symbol
VR
Forward Voltage
Reverse Leakage Current
Junction Capacitance
CSOD0540SH
VF 1
VF 2
IR 1
IR 2
IR 3
CJ
Condition
IR=600μA
IF=100mA
IF=500mA
VR=20V
VR=40V
VR=40V, TA=75C
VR=4V, f=1MHz
Min.
Typ
Max.
Unit
40
-
-
V
-
18.3
370
500
100
500
10
-
mV
μA
μA
mA
pF
CYStek Product Specification
Spec. No. : C291SH
Issued Date : 2009.12.22
Revised Date : 2015.06.18
Page No. : 3/6
CYStech Electronics Corp.
Typical Characteristics
Maximum Non-Repetitive Forward Surge Current
Forward Current Derating Curve
15
Peak Forward Surge Current---IFSM (A)
Average Forward Current---Io(A)
0.6
0.5
0.4
0.3
0.2
resistive or inductive load
0.1
Tj=25℃, 8.3ms Single Half Sine
Wave, JEDEC method
12
9
6
3
0
0
0
25
50
75
100
125
150
1
175
Ambient Temperature---TA(℃)
100
Number of Cycles at 60Hz
Forward Current vs Forward Voltage
Junction Capacitance vs Reverse Voltage
1000
100
Tj=125℃
Junction Capacitance---C J (pF)
Instantaneous Forward Current---IF(mA)
10
100
Tj=75℃
Tj=25℃
10
Pulse width=300μs,
1% Duty cycle
Tj=25℃, f=1.0MHz
10
1
0
0.2
0.4
Forward Voltage---VF(V)
0.6
0.1
1
10
Reverse Voltage---VR(V)
Reverse Leakage Current vs Reverse Voltage
Reverse Leakage Current---IR(μA)
10000
1000
Tj=75℃
100
Tj=25℃
10
0
20
40
60
80
100
120
140
Percent of Rated Peak Reverse Voltage---(%)
CSOD0540SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C291SH
Issued Date : 2009.12.22
Revised Date : 2015.06.18
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
CSOD0540SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C291SH
Issued Date : 2009.12.22
Revised Date : 2015.06.18
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6 minutes max.
6C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
CSOD0540SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C291SH
Issued Date : 2009.12.22
Revised Date : 2015.06.18
Page No. : 6/6
SOD-123 Dimension
Marking:
04
2-Lead SOD-123 Plastic
Surface Mounted Package
CYStek Package Code: SH
Inches
Min.
Max.
0.102
0.110
0.059
0.067
0.041
0.049
DIM
A
B
C
Millimeters
Min.
Max.
2.600
2.800
1.500
1.700
1.050
1.250
Style: Pin 1.Cathode 2.Anode
DIM
D
E
Inches
Min.
Max.
0.018
0.026
0.140
0.152
Millimeters
Min.
Max.
0.450
0.650
3.550
3.850
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
 Lead: Pure tin plated
 Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
 CYStek reserves the right to make changes to its products without notice.
 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSOD0540SH
CYStek Product Specification