SB3150

CYStech Electronics Corp.
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2014.12.04
Page No. : 1/6
3.0Amp Schottky Barrier Rectifiers
Reverse Voltage 150V and 200V
Forward Current 3A
SB3150 and SB3200
Features
Outline
 Low forward voltage drop
 High current capability
 High reliability
 High surge current capability
 Epitaxial construction
DO-201AD
Mechanical Data
 Case : JEDEC DO-201AD molded plastic body
 Epoxy : UL94V-0 rate flame retardant
 Terminals: Plated axial leads, solderable per MIL-STD-202, method 208 guaranteed
 Polarity: Color band denotes cathode end.
 Mounting Position : Any.
 Weight: 1.10 grams
Ordering Information
Device
SB3150- 0-TC-G
SB3200- 0-TC-G
Package
DO-201AD
(Pb-free lead plating and halogen-free package)
Shipping
1200 pcs / Tape & Box
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, TC : 1200 pcs / tape & box
Product rank, zero for no rank products
Product name
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2014.12.04
Page No. : 2/6
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%)
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
1
Maximum instantaneous forward voltage at 3A
Maximum average forward rectified current
Peak forward surge current @8.3ms single half sine
wave superimposed on rated load (JEDEC method)
TA=25°C
Maximum DC reverse current at
1
rated DC blocking voltage
TA=100°C
Typical junction capacitance
Symbol
VRRM
VRMS
VDC
VF
IF(AV)
IFSM
IR
Type
SB3150
150
105
150
SB3200
200
140
200
Units
0.89
3
V
V
V
V
A
80
A
0.5
10
mA
CJ
250
pF
Typical thermal resistance
RJA
20
℃/W
Operating junction temperature range
Storage temperature range
TJ
TSTG
-55 ~ +150
-55 ~ +150
℃
℃
Note: 1.Pulse test: pulse width≤300μs, duty cycle≤2%
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2014.12.04
Page No. : 3/6
Characteristic Curves
Forward Current vs Forward Voltage
3.5
100
Instantaneous Forward Current---IF(A)
Average Forward Current---I F(AV)(A)
Forward Current Derating Curve
3
2.5
2
1.5
1
0.5
0
10
1
0.1
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.01
0
20
40
60
80
100
120
140
160
0.1
0.3
Maximum Non-Repetitive Forward Surge Current
Peak Forward Surge Current---IFSM(A)
100
Tj=25℃, 8.3ms Single
Half Sine Wave
JEDEC method
80
60
40
20
0
1
10
100
R e v e r s e L e a k a g e RC( m
u rAr )e n t - - - I
Ambient Temperature---TA(℃)
0.5
0.7
0.9
1.1
Forward Voltage---VF(V)
Reverse
1.3
1.5
Leakage Current vs Reverse Vol
100
10
1
Tj=75℃
0.1
Tj=25℃
0.01
0
20
40
60
80
100
120
140
P e r c e n t o f R a tReedv ePres ae k V o l t a g e - - - ( % )
Number of Cycles at 60Hz
Junction Capacitance vs Reverse Voltage
Junction Capacitance---C J (pF)
700
600
500
400
300
200
100
0
0.01
0.1
1
10
100
Reverse Voltage---VR(V)
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2014.12.04
Page No. : 4/6
Taping Dimension
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2014.12.04
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak
temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6C/second max.
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2014.12.04
Page No. : 6/6
DO-201AD Dimension
DO-201AD Molded Plastic Package
CYStek Package Code: LD
Inches
Min.
Max.
0.048 0.052
1.000
0.285
0.375
DIM
A
B
C
Millimeters
Min.
Max.
1.20
1.30
25.40
7.20
9.50
DIM
D
E
Inches
Min.
Max.
1.000
0.190 0.220
Millimeters
Min.
Max.
25.40
4.80
5.60
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
 Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
 Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
 CYStek reserves the right to make changes to its products without notice.
 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SB3150 and SB3200
CYStek Product Specification