SK520SB

CYStech Electronics Corp.
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2014.04.30
Page No. : 1/7
5.0Amp. Surface Mount Schottky Barrier Diodes
SK520SB thru SK5100SB
Features
• For surface mounted applications.
• For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
• Low leakage current
• High surge capability
• Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
• Case: Molded plastic, SMB/JEDEC DO-214AA.
• Terminals: Solder plated, solderable per MIL-STD-750 method 2026
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight: 0.0878 gram
Ordering Information
Device
SK5X0SB - 0-T6-G
Package
SMB
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T6 : 3000 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
SK520SB-SK5100SB
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2014.04.30
Page No. : 2/7
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous
forward voltage, IF=5A (Note 1)
Average forward rectified current
Peak forward surge current @8.3ms
single half sine wave superimposed
on rated load (JEDEC method)
Maximum DC reverse current
VR=VRRM,TA=25℃(Note)
VR=VRRM,TA=125℃(Note)
Maximum thermal resistance,
Junction to Lead
Diode junction capacitance @
f=1MHz and applied 4VDC reverse
voltage
Storage temperature
Operating temperature
VRRM
VRMS
VR
SK
520
20
14
20
SK
530
30
21
30
SK
540
40
28
40
Type
SK
550
50
35
50
VF
0.55
0.55
0.55
0.7
Symbol
SK
560
60
42
60
SK
580
80
56
80
SK
5100
100
70
100
Units
0.7
0.85
0.85
V
V
V
V
IO
5
A
IFSM
150
A
IR
0.5
50
mA
mA
Rth,JL
12 (typ)
℃/W
CJ
380(typ)
pF
Tstg
TJ
-55 ~ +150
℃
℃
-55 ~ +125
-55 ~ +150
Notes : Pulse test, pulse width=300μsec, 2% duty cycle
Recommended Footprint
SK520SB-SK5100SB
CYStek Product Specification
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2014.04.30
Page No. : 3/7
CYStech Electronics Corp.
Typical Characteristics
Forward Current Derating Curve
Maximum Non-Repetitive Forward Surge Current
160
5
Peak Forward Surge Current---IFSM(A)
Average Forward Current---Io(A)
6
SK550-SK5100
4
3
2
SK520-SK540
1
140
Tj=25℃, 8.3ms Single Half
Sine Wave
JEDEC method
120
100
80
60
40
20
0
0
0
50
100
150
1
200
10
Ambient Temperature---TA(℃)
Junction Capacitance vs Reverse Voltage
Forward Current vs Forward Voltage
1400
100
Junction Capacitance---C J(pF)
SK520-SK540
Forward Current---IF(A)
100
Number of Cycles at 60Hz
10
SK550-SK560
1
SK580-SK5100
0.1
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.01
0.1
0.3
0.5
0.7
0.9
1.1
Forward Voltage---VF(V)
1.3
1.5
1200
1000
800
600
400
200
0
0.01
0.1
1
10
100
Reverse Voltage---VR (V)
Reverse Leakage Current vs Reverse Voltage
Reverse Leakage Current---I R (mA)
100
10
Tj=75℃
1
0.1
Tj=25℃
0.01
0
20
40
60
80
100 120 140
Percent of Rated Peak Reverse Voltage---(%)
SK520SB-SK5100SB
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2014.04.30
Page No. : 4/7
Taping Reel Dimension
SK520SB-SK5100SB
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2014.04.30
Page No. : 5/7
Recommended Wave Soldering Profile
SK520SB-SK5100SB
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2014.04.30
Page No. : 6/7
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak
temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK520SB-SK5100SB
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C337SB
Issued Date : 2005.12.07
Revised Date :2014.04.30
Page No. : 7/7
DO-214AA/SMB Dimension
Marking Code :
SK520SB
SS52
SK530SB
SS53
SK540SB
SS54
SK550SB
SS55
SK560SB
SS56
SK580SB
SS58
SK5100SB
S510
DO-214AA/SMB Plastic
Surface Mounted Package
CYStek Package Code : SB
*:Typical
Inches
Min.
Max.
0.076
0.082
0.137
0.147
0.167
0.187
0.078
0.103
DIM
A
B
C
D
Millimeters
Min.
Max.
1.93
2.08
3.48
3.73
4.25
4.75
1.99
2.61
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.004
0.008
0.035
0.056
0.207
0.215
Millimeters
Min.
Max.
0.15
0.31
0.10
0.20
0.90
1.41
5.26
5.46
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK520SB-SK5100SB
CYStek Product Specification