1N4148WSH

CYStech Electronics Corp.
Spec. No. : C456SH-A
Issued Date : 2008.03.10
Revised Date :2013.10.31
Page No. : 1/6
400mW SOD-123 Plastic Encapsulated Diodes
1N4148WSH
Features:
● Fast switching speed
● Surface mount package suitable for automatic insertion
● For general purpose switching applications
● High conductance
Mechanical Data
• Case : SOD-123 , molded plastic
• Terminals : Solderable per MIL-STD-750 method 2026
• Polarity : Cathode indicated by polarity band.
• Flammability rating : UL94 V-0
• Package weight : approx. 0.01 gram/unit
• Mounting position : Any
Symbol
Outline
SOD-123
Ordering Information
Device
1N4148WSH-0-T1-G
Package
SOD-123
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
1N4148WSH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C456SH-A
Issued Date : 2008.03.10
Revised Date :2013.10.31
Page No. : 2/6
Maximum Ratings(TA=25℃, unless otherwise noted)
Characteristics
Non-Repetitive Peak Reverse Voltage
Repetitive Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current
Average Forward Rectified Current
Peak Forward Surge Current
@ tp=1.0μs
@ tp=1.0 s
Symbol
VRM
VRRM
VR
VRMS
IFM
Value
100
100
100
70
500
Unit
V
V
V
V
mA
IO
250
mA
4.0
2.0
400
125
-65 to +150
IFSM
Power Dissipation
Junction Temperature
Storage Temperature Range
PD
Tj
Tstg
A
mW
°C
°C
Maximum Thermal Resistance(TA=25℃)
Parameter
Junction to Ambient Resistance
Test Conditions
Symbol
Rth,JA
Value
315
Unit
°C/W
Electrical Characteristics (TA=25°C, unless otherwise noted)
Parameter
Forward Voltage
Reverse Current
Reverse Breakdown Voltage
Diode Capacitance
Reverse Recovery Time
Conditions
IF=5mA
IF=10mA
IF=100mA
IF=150mA
VR=20V
VR=100V
IR=10μA
VR=0, f=1MHz
IF=IR=10mA,IRR=0.1×IR, RL=100Ω
Symbol
VF
IR
V(BR)
CT
trr
Min
0.62
100
-
Typ
-
Max
0.72
0.855
1.0
1.25
25
2.5
4
4
Unit
V
nA
μA
V
pF
ns
Recommended Soldering Footprint
1N4148WSH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C456SH-A
Issued Date : 2008.03.10
Revised Date :2013.10.31
Page No. : 3/6
Typical Characteristics
1N4148WSH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C456SH-A
Issued Date : 2008.03.10
Revised Date :2013.10.31
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
1N4148WSH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C456SH-A
Issued Date : 2008.03.10
Revised Date :2013.10.31
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak
temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
1N4148WSH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C456SH-A
Issued Date : 2008.03.10
Revised Date :2013.10.31
Page No. : 6/6
SOD-123 Dimension
Marking:
T4
Style: Pin 1.Cathode 2.Anode
2-Lead SOD-123 Plastic
Surface Mounted Package
CYStek Package Code: SH
*: Typical
Inches
Min.
Max.
0.102
0.110
0.059
0.067
0.041
0.049
0.018
0.026
DIM
A
B
C
D
Millimeters
Min.
Max.
2.600
2.800
1.500
1.700
1.050
1.250
0.450
0.650
DIM
E
Inches
Min.
Max.
0.140
0.152
Millimeters
Min.
Max.
3.550
3.850
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
1N4148WSH
CYStek Product Specification