CYStech Electronics Corp. Spec. No. : C456SH-A Issued Date : 2008.03.10 Revised Date :2013.10.31 Page No. : 1/6 400mW SOD-123 Plastic Encapsulated Diodes 1N4148WSH Features: ● Fast switching speed ● Surface mount package suitable for automatic insertion ● For general purpose switching applications ● High conductance Mechanical Data • Case : SOD-123 , molded plastic • Terminals : Solderable per MIL-STD-750 method 2026 • Polarity : Cathode indicated by polarity band. • Flammability rating : UL94 V-0 • Package weight : approx. 0.01 gram/unit • Mounting position : Any Symbol Outline SOD-123 Ordering Information Device 1N4148WSH-0-T1-G Package SOD-123 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name 1N4148WSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C456SH-A Issued Date : 2008.03.10 Revised Date :2013.10.31 Page No. : 2/6 Maximum Ratings(TA=25℃, unless otherwise noted) Characteristics Non-Repetitive Peak Reverse Voltage Repetitive Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current Average Forward Rectified Current Peak Forward Surge Current @ tp=1.0μs @ tp=1.0 s Symbol VRM VRRM VR VRMS IFM Value 100 100 100 70 500 Unit V V V V mA IO 250 mA 4.0 2.0 400 125 -65 to +150 IFSM Power Dissipation Junction Temperature Storage Temperature Range PD Tj Tstg A mW °C °C Maximum Thermal Resistance(TA=25℃) Parameter Junction to Ambient Resistance Test Conditions Symbol Rth,JA Value 315 Unit °C/W Electrical Characteristics (TA=25°C, unless otherwise noted) Parameter Forward Voltage Reverse Current Reverse Breakdown Voltage Diode Capacitance Reverse Recovery Time Conditions IF=5mA IF=10mA IF=100mA IF=150mA VR=20V VR=100V IR=10μA VR=0, f=1MHz IF=IR=10mA,IRR=0.1×IR, RL=100Ω Symbol VF IR V(BR) CT trr Min 0.62 100 - Typ - Max 0.72 0.855 1.0 1.25 25 2.5 4 4 Unit V nA μA V pF ns Recommended Soldering Footprint 1N4148WSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C456SH-A Issued Date : 2008.03.10 Revised Date :2013.10.31 Page No. : 3/6 Typical Characteristics 1N4148WSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C456SH-A Issued Date : 2008.03.10 Revised Date :2013.10.31 Page No. : 4/6 Reel Dimension Carrier Tape Dimension 1N4148WSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C456SH-A Issued Date : 2008.03.10 Revised Date :2013.10.31 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. 1N4148WSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C456SH-A Issued Date : 2008.03.10 Revised Date :2013.10.31 Page No. : 6/6 SOD-123 Dimension Marking: T4 Style: Pin 1.Cathode 2.Anode 2-Lead SOD-123 Plastic Surface Mounted Package CYStek Package Code: SH *: Typical Inches Min. Max. 0.102 0.110 0.059 0.067 0.041 0.049 0.018 0.026 DIM A B C D Millimeters Min. Max. 2.600 2.800 1.500 1.700 1.050 1.250 0.450 0.650 DIM E Inches Min. Max. 0.140 0.152 Millimeters Min. Max. 3.550 3.850 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. 1N4148WSH CYStek Product Specification