ES1G

CYStech Electronics Corp.
Spec. No. : C773SA
Issued Date : 2009.08.05
Revised Date :2014.09.24
Page No. : 1/6
Super Fast Surface Mount Rectifiers
Reverse Voltage 50V to 1000V Forward Current 1.0A
ES1A thru ES1M
Features
Outline
 For surface mounted application
 Low profile package
 Built-in stain relief, ideal for automatic placement
 Easy pick and place
 Super fast recovery time for high efficiency
 Glass passivated junction chip
 High temperature soldering: 250°C/10 seconds at terminals
 Plastic material used carries UL flammability classification 94V-0
DO-214AC (SMA)
Mechanical Data
 Case: SMA/DO-214AC molded plastic
 Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
 Polarity: Indicated by cathode band
 Weight: 0.064 gram, 0.002 ounce
Ordering Information
Device
ES1A-0-T4-G
ES1B-0-T4-G
ES1C-0-T4-G
ES1D-0-T4-G
ES1F-0-T4-G
ES1G-0-T4-G
ES1J-0-T4-G
ES1K-0-T4-G
ES1M-0-T4-G
Package
Shipping
SMA
(Pb-free lead plating and halogen-free
package)
7500 pcs / Tape & Reel
Marking
ES1A
ES1B
ES1C
ES1D
ES1F
ES1G
ES1J
ES1K
ES1M
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T4 : 7500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
ES1A thru ES1M
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C773SA
Issued Date : 2009.08.05
Revised Date :2014.09.24
Page No. : 2/6
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified.
capacitive load, derate current by 20%. )
Parameter
Symbol
Single phase, half wave, 60Hz, resistive or inductive load. For
Type
Units
ES1A ES1B ES1C ES1D ES1F ES1G ES1J ES1K ES1M
50
100
150
200
300
400
600
800 1000
V
35
70
105
140
210
280
420
700
V
560
50
100
150
200
300
400
600
800 1000
V
Maximum repetitive peak reverse voltage VRRM
Maximum RMS voltage
VRMS
Maximum DC blocking voltage
VR
Maximum instantaneous
VF
0.95
forward voltage, IF=1A
Maximum average forward rectified
IF(AV)
current, see Fig. 1
Peak forward surge current @8.3ms single
half sine wave superimposed on rated load IFSM
(JEDEC method)
Maximum DC reverse current
VR=VRRM,TA=25℃
IR
VR=VRRM,TA=100℃
Maximum reverse recovery time (Note 1)
trr
Typical junction capacitance @ f=1MHz
CJ
10
and applied 4V reverse voltage
RθJA
Typical thermal resistance (Note 2)
RθJC
TA=25°C(Note 2)
Power dissipation
PD
TC=25°C
Storage temperature range
TSTG
Operating junction temperature range
TJ
Note: 1.Reverse recovery test conditions : IF=0.5A, IR=1A, IRR=0.25A
2.P.C.B. mounted on 0.2”×0.2”(5.0mm×5.0mm) copper pad area.
1.3
1.7
V
1
A
30
A
5
100
μA
35
ns
8
85
40
1.5
3.1
-55 ~ +150
-55 ~ +150
pF
°C/W
W
℃
℃
Recommended soldering footprint
ES1A thru ES1M
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C773SA
Issued Date : 2009.08.05
Revised Date :2014.09.24
Page No. : 3/6
Characteristic Curves
ES1A thru ES1M
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C773SA
Issued Date : 2009.08.05
Revised Date :2014.09.24
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
ES1A thru ES1M
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C773SA
Issued Date : 2009.08.05
Revised Date :2014.09.24
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak
temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6C/second max.
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
ES1A thru ES1M
CYStek Product Specification
Spec. No. : C773SA
Issued Date : 2009.08.05
Revised Date :2014.09.24
Page No. : 6/6
CYStech Electronics Corp.
SMA/DO-214AC Dimension
Device Name
□□□□
Marking :
Device
ES1A
Code
ES1A
ES1B
ES1B
ES1C
ES1C
Device
Code
ES1D
ES1D
ES1F
ES1F
ES1G
ES1G
Device
Code
ES1J
ES1J
ES1K
ES1K
ES1M
ES1M
YM
Date Code
SMA/DO-214AC Plastic
Surface Mounted Package
CYStek Package Code : SA
Date Code : Year Code + Month Code
Year Code :
Year
2009 2010 2011 2012
Code
9
A
B
C
2013
D
2014
E
2015
F
Month Code :
Month
Jan
Code
1
May
5
Jun
6
Jul
7
Feb
2
Mar
3
Inches
Min.
Max.
0.052
0.062
0.098
0.114
0.154
0.181
0.067
0.091
DIM
A
B
C
D
Apr
4
Millimeters
Min.
Max.
1.32
1.60
2.50
2.90
3.90
4.60
1.70
2.30
2016
G
Aug
8
DIM
E
F
G
H
2017
H
Sep
9
2018
J
Oct
O
2019
K
Nov
N
2020
0
2021
1
Dec
D
Inches
Min.
Max.
0.006
0.012
0.002
0.008
0.030
0.060
0.188
0.208
Millimeters
Min.
Max.
0.15
0.31
0.05
0.20
0.76
1.52
4.80
5.28
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
 Lead : Pure tin plated.
 Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
 CYStek reserves the right to make changes to its products without notice.
 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
ES1A thru ES1M
CYStek Product Specification