SK16SA

CYStech Electronics Corp.
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 1/6
1.0Amp. Surface Mount Schottky Barrier Diodes
SK12SA thru SK1BSA
Features
 For surface mounted applications.
 For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications.
 Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0.
 Low leakage current.
 High surge capability.
 High temperature soldering: 250C/10 seconds at terminals.
 Exceeds environmental standards of MIL-S-19500/228.
Mechanical Data
 Case: Molded plastic, JEDEC DO-214AC/SMA.
 Terminals: Solder plated, solderable per MIL-STD-750 method 2026.
 Polarity: Indicated by cathode band.
 Mounting position: Any.
 Weight: 0.064 gram, 0.002 ounce.
Ordering Information
Device
SK12SA-0-T4-G
SK13SA-0-T4-G
SK14SA-0-T4-G
SK15SA-0-T4-G
SK16SA-0-T4-G
SK18SA-0-T4-G
SK1BSA-0-T4-G
Package
Shipping
SMA
(Pb-free lead plating and halogen-free
package)
7500 pcs / Tape & Reel
Marking
SK12
SK13
SK14
SK15
SK16
SK18
SK1B
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T4 : 7500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 2/6
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
Voltage @ IF=1A (Note 1)
Maximum average forward
rectified current @ TL=100°C
Peak forward surge current @
8.3ms, single half sine-wave
superimposed on rated load
(JEDEC method)
Maximum DC reverse current at
Rated DC blocking
TJ=25°C
voltage
TJ=100°C
Typical thermal resistance,
junction to lead
Typical thermal resistance,
junction to case
Power
TA=25°C
Dissipation
TC=25°C
Typical diode junction
capacitance @ f=1MHz and
applied 4V reverse voltage
Storage temperature
Operating temperature
Symbol
VRRM
VRMS
VR
SK12
20
14
20
VF
SK13 SK14
30
40
21
28
30
40
Type
SK15
50
35
50
0.5
SK16 SK18
60
80
42
56
60
80
0.7
SK1B
100
70
100
0.85
Units
V
V
V
V
IO
1
A
IFSM
30
A
IR
0.5
10
mA
R th, JA
85
°C/W
Rth, JC
18
°C/W
PD
1.5
7
W
CJ
120
pF
Tstg
TJ
-55 ~ +150
-55 ~ +125
°C
°C
Recommended soldering footprint
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 3/6
Characteristic Curves
SK12-SK14
SK16
SK18-SK1B
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6 minutes max.
6C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.09.24
Page No. : 6/6
SMA/DO-214AC Dimension
Marking :
SK12SA SK13SA SK14SA SK15SA
SK12
SK13
SK14
SK15
SK16SA SK18SA SK1BSA
SK16
SK18
SK1B
SMA/DO-214AC Plastic
Surface Mounted Package
CYStek Package Code : SA
*:Typical
Inches
Min.
Max.
0.052
0.062
0.098
0.114
0.154
0.181
0.067
0.091
DIM
A
B
C
D
Millimeters
Min.
Max.
1.32
1.60
2.50
2.90
3.90
4.60
1.70
2.30
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.002
0.008
0.030
0.060
0.188
0.208
Millimeters
Min.
Max.
0.15
0.31
0.05
0.20
0.76
1.52
4.80
5.28
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
 Lead : Pure tin plated.
 Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
 CYStek reserves the right to make changes to its products without notice.
 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK12SA thru SK1BSA
CYStek Product Specification