SK3BSA

CYStech Electronics Corp.
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date : 2014.10.03
Page No. : 1/6
3.0Amp. Surface Mount Schottky Barrier Diodes
SK3XSA Series
Features
 For surface mounted applications.
 For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
 Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
 Low leakage current
 High surge capability
 High temperature soldering: 250C/10 seconds at terminals
 Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
 Case: SMA/DO-214AC molded plastic.
 Terminals: Solder plated, solderable per MIL-STD-750 method 2026
 Polarity: Indicated by cathode band.
 Packaging: 12mm tape per EIA STD RS-481.
 Weight: approx. 0.064 gram, 0.002 ounce
Ordering Information
Device
SK32SA-0-T4-G
SK34SA-0-T4-G
SK36SA-0-T4-G
SK38SA-0-T4-G
SK3BSA-0-T4-G
Package
Shipping
SMA
(Pb-free lead plating and halogen-free
package)
7500 pcs / Tape & Reel
Marking
SK32
SK34
SK36
SK38
SK3B
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T4 : 7500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
SK3XSA
CYStek Product Specification
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date : 2014.10.03
Page No. : 2/6
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified. )
Parameter
Symbol
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage,
IF=3A (Note 1)
Average forward rectified current
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
method)
Maximum DC reverse current
VR=VRRM,TA=25℃(Note 1)
VR=VRRM,TA=125℃(Note 1)
Maximum thermal resistance, Junction to
ambient(Note 2)
VRRM
VRMS
VR
SK32
20
14
20
VF
0.5
Typical thermal resistance, junction to case
Power Dissipation
TA=25°C
TC=25°C
Diode junction capacitance @
f=1MHz and applied 4V reverse voltage
Storage temperature
Operating temperature
SK34
40
28
40
Type
SK36
60
42
60
0.5
0.75
SK38
80
56
80
SK3B
100
70
100
0.85
0.85
Units
V
V
V
V
IO
3
A
IFSM
80
A
IR
0.5
10
Rth,JA
65 (typ)
℃/W
Rth, JC
14
°C/W
PD
mA
mA
1.5
W
7
CJ
200 (typ)
pF
Tstg
TJ
-55 ~ +150
-55 ~ +125
℃
℃
Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle
2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area.
Recommended soldering footprint
SK3XSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date : 2014.10.03
Page No. : 3/6
Characteristic Curves
SK32-SK34
---
SK36-SK3B
SK32-SK34
SK36
SK38-SK3B
SK3XSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date : 2014.10.03
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
SK3XSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date : 2014.10.03
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6 minutes max.
6C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK3XSA
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date : 2014.10.03
Page No. : 6/6
SMA Dimension
Marking :
Device SK32
Code SK32
SK34
SK34
SK36
SK36
SK38
SK38
Device SK3B
Code
SK3B
SMA/DO-214AC Plastic
Surface Mounted Package
CYStek Package Code : SA
*:Typical
Inches
Min.
Max.
0.052
0.062
0.098
0.114
0.154
0.181
0.067
0.091
DIM
A
B
C
D
Millimeters
Min.
Max.
1.32
1.60
2.50
2.90
3.90
4.60
1.70
2.30
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.002
0.008
0.030
0.060
0.188
0.208
Millimeters
Min.
Max.
0.15
0.31
0.05
0.20
0.76
1.52
4.80
5.28
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
 Lead : Pure tin plated.
 Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
 CYStek reserves the right to make changes to its products without notice.
 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK3XSA
CYStek Product Specification