CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.07.16 Page No. : 1/6 2.0Amp. Surface Mount Schottky Barrier Diodes SK2XSA Series Features For surface mounted applications. For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 Low leakage current High surge capability High temperature soldering: 250C/10 seconds at terminals Exceeds environmental standards of MIL-S-19500/228 Mechanical Data Case: SMA/DO-214AC molded plastic. Terminals: Solder plated, solderable per MIL-STD-750 method 2026 Polarity: Indicated by cathode band. Packaging: 12mm tape per EIA STD RS-481. Weight: 0.064 gram, 0.002 ounce Ordering Information Device SK24SA-0-T4-G SK26SA-0-T4-G SK28SA-0-T4-G SK2BSA-0-T4-G SK2CSA-0-T4-G SK2DSA-0-T4-G Package Shipping SMA (Pb-free lead plating and halogen-free package) 7500 pcs / Tape & Reel Marking SK24 SK26 SK28 SK2B SK2C SK2D Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T4 : 7500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name SK2XSA CYStek Product Specification Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.07.16 Page No. : 2/6 CYStech Electronics Corp. Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. ) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=2A (Note 1) Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TA=25℃(Note 1) VR=VRRM,TA=100℃(Note 1) Maximum thermal resistance, Junction to ambient(Note 2) Maximum thermal resistance, Junction to case TA=25°C (Note 2) Power dissipation TC=25°C Diode junction capacitance @ f=1MHz and applied 4V reverse voltage Storage temperature Operating temperature Symbol VRRM VRMS VR VF Type Units SK24 SK26 SK28 SK2B SK2C SK2D 40 60 80 100 150 200 V 28 42 56 70 105 140 V 40 60 80 100 150 200 V 0.7 0.7 0.85 0.85 0.9 0.9 V IO 2 A IFSM 50 A IR 0.5 50 mA mA RθJA 80 RθJC 32 1.3 3.1 PD ℃/W W CJ 110 (typ) pF Tstg TJ -65 ~ +150 ℃ ℃ -65 ~ +150 -65 ~ +175 Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle 2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area. Recommended soldering footprint SK2XSA CYStek Product Specification Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.07.16 Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics FIG.2-MAXIMUM NON-REPETITIVE SURGE CURRENT 2.5 ─ : 40V - - : 60~200V 2.0 1.5 1.0 0.375” (9.5mm) Lead Length Resistive or Inductive Load 0.5 0 0 20 40 60 80 100 120 PEAK FORWARD SURGE CURRENT, A AVERAGE FORWARD RECTIFIED CURRENT, A FIG. 1-FORWARD CURRENT DERATING CURVE 6060 5050 4040 3030 2020 1010 00 140 160 180 1 FIG.3- TYPICAL REVERSE CHARACTERISTICS FIG. 4- TYPICAL FORWARD CHARACTERISTICS 1E5 10 40-60V TJ=125°C FORWARD CURRENT, A REVERSE CURRENT, uA 1E4 100 TJ=75°C 10 1 1.0 80-100V 0.1 150-200V TA=25°C 0.1 ─ : VRRM =40V - - :VRRM=60~200V TJ=25°C 0.01 0.01 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE, % SK2XSA 100 NO. OF CYCLES at 60Hz LEAD TEMPERATURE, °C 1000 10 0.2 0.4 0.6 0.8 1.0 1.2 FORWARD VOLTAGE, V CYStek Product Specification CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.07.16 Page No. : 4/6 Reel Dimension Carrier Tape Dimension SK2XSA CYStek Product Specification CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.07.16 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 265 +0/-5 C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 240 +0/-5 C 217C 60-150 seconds 265 +0/-5 C 10-30 seconds 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. SK2XSA CYStek Product Specification CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.07.16 Page No. : 6/6 SMA/DO-214AC Dimension Marking : Device SK24SA Code SK24 SK26SA SK26 SK28SA SK28 Device Code SK2CSA SK2C SK2CSA SK2C SK2BSA SK2B SMA/DO-214AC Plastic Surface Mounted Package CYStek Package Code : SA *:Typical Inches Min. Max. 0.055 0.062 0.098 0.114 0.157 0.181 0.078 0.096 DIM A B C D Millimeters Min. Max. 1.40 1.60 2.50 2.90 4.00 4.60 2.00 2.44 DIM E F G H Inches Min. Max. 0.006 0.012 0.002 0.008 0.030 0.060 0.188 0.208 Millimeters Min. Max. 0.152 0.305 0.051 0.203 0.76 1.52 4.80 5.28 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : Lead : Pure tin plated. Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SK2XSA CYStek Product Specification