CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 1/6 0.5A surface mount Schottky diode RB0540C2 Features • High current capability, low forward voltage drop • High surge current capability • Guardring for over voltage protection • Low power loss, high efficiency • Ultra high-speed switching • Low profile surface mounted package in order to minimize board space Mechanical data •Case : Molded plastic, SC-79/SOD523. •Epoxy : UL94-V0 rated flame retardant •Terminals : Plated terminals, solderable per MIL-STD-750 method 2026. •Polarity : Indicated by cathode band. •Mounting position : Any. Symbol Outline RB0540C2 Ordering Information Device RB0540C2-0-T5-G Package SOD-523 (Pb-free lead plating and halogen-free package) Shipping 8000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T5 : 8000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name RB0540C2 CYStek Product Specification Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 2/6 CYStech Electronics Corp. Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Repetitive peak reverse voltage RMS voltage Continuous reverse voltage Forward rectified current Conditions Symbol Min Single phase half wave, 60Hz @TJ=25°C Total Device Dissipation 8.3ms single half sine-wave superimposed on rated load (JEDEC method) TA=25°C (Note) Thermal resistance Junction to Ambient Forward surge current (Note) Storage temperature range Operating junction temperature range Typ Max Units VRRM 40 V VRMS 28 V VR 40 V IO 0.5 IF(AV) 1 IFSM 15 A PD 200 mW RθJA 625 °C/W A Tstg -65 175 °C Tj -55 125 °C Note : When device mounted on FR-5 PCB with minimum pad. Characteristics (TA=25°C) Characteristic Forward Voltage Reverse Leakage Current Capacitance Between Terminals RB0540C2 Symbol Condition VR IR=600μA VF 1 VF 2 IR 1 IR 2 IR 3 CT IF=100mA IF=500mA VR=20V VR=40V VR=40V, TA=75°C VR=4V, f=1MHz Min. Typ Max. Unit 40 18.3 - V - 370 500 100 500 10 - mV μA μA mA pF CYStek Product Specification Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Maximum Non-Repetitive Forward Surge Current Forward Current Derating Curve 15 Peak Forward Surge Current---IFSM (A) Average Forward Current---Io(A) 0.6 0.5 0.4 0.3 0.2 resistive or inductive load 0.1 Tj=25℃, 8.3ms Single Half Sine Wave, JEDEC method 12 9 6 3 0 0 0 25 50 75 100 125 150 1 175 Ambient Temperature---TA(℃) 100 Number of Cycles at 60Hz Forward Current vs Forward Voltage Junction Capacitance vs Reverse Voltage 1000 100 Tj=125℃ Junction Capacitance---C J (pF) Instantaneous Forward Current---IF(mA) 10 100 Tj=75℃ Tj=25℃ 10 Pulse width=300μs, 1% Duty cycle Tj=25℃, f=1.0MHz 10 1 0 0.2 0.4 Forward Voltage---VF(V) 0.6 0.1 1 10 Reverse Voltage---VR(V) Reverse Leakage Current vs Reverse Voltage Reverse Leakage Current---I R(μA) 10000 1000 Tj=75℃ 100 Tj=25℃ 10 0 RB0540C2 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 4/6 Reel Dimension Carrier Tape Dimension RB0540C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. RB0540C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 6/6 SOD-523 Dimension Marking Code : 1 1 2 C5 2 Style : Pin 1. Cathode 2. Anode 2-lead SOD-523 Plastic Package CYStek Package Code : C2 *: Typical Millimeters Min. Max. 0.510 0.770 0.500 0.700 0.250 0.350 0.080 0.150 0.750 0.850 DIM A A1 b c D Inches Min. Max. 0.020 0.031 0.020 0.028 0.010 0.014 0.003 0.006 0.030 0.033 DIM Min. E E1 E2 L θ Millimeters Min. Max. 1.100 1.300 1.500 1.700 0.200 REF 0.010 0.070 7° REF Inches Min. Max. 0.043 0.051 0.059 0.067 0.008 REF 0.001 0.003 7° REF Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. RB0540C2 CYStek Product Specification