CYStech Electronics Corp. Spec. No. : C211A2 Issued Date : 2012.11.07 Revised Date : 2015.07.03 Page No. : 1/6 1A Snubber Damping Rectifier QJ-2L Features High current capability Smoothly soft reverse recovery time (trr) Low profile surface mounted package in order to minimize board space Pb-free lead plating and halogen-free package Mechanical data Case : Molded plastic, TO-92-2L. Epoxy : UL94-V0 rated flame retardant Terminals : Plated terminals, solderable per MIL-STD-202 method 208 Polarity : Indicated by cathode band Mounting position : Any Weight : approx. 0.2 gram Symbol Outline QJ-2L TO-92-2L A K QJ-2L CYStek Product Specification Spec. No. : C211A2 Issued Date : 2012.11.07 Revised Date : 2015.07.03 Page No. : 2/6 CYStech Electronics Corp. Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Repetitive peak reverse voltage RMS voltage Continuous reverse voltage Conditions Single phase half wave, 60Hz @TJ=25°C 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Forward rectified current Forward surge current Thermal resistance Maximum reverse recovery time Junction to Ambient IF=0.5A, IR=1.0A, IRR=0.25A Storage temperature range Operating junction temperature range Symbol Value Units VRRM 600 V VRMS 420 V VR 600 V IF(AV) 1 A IFSM 10 A RJA 200 C/W trr 3 μs Tstg -55~+150 C Tj -55~+150 C Characteristics (TA=25C, unless otherwise noted) Characteristic Symbol VR Forward Voltage Reverse Leakage Current Junction Capacitance VF 1 VF 2 IR IR CJ Condition IR=100μA IF=100mA IF=500mA VR=540V VR=540V, TA=125C VR=1V, f=1MHz Min. Typ Max. Unit 600 - - V - 6 0.95 1.2 100 10 - V nA μA pF Ordering Information Device QJ-2L-0-BK-G QJ-2L-0-TB-G QJ-2L Package TO-92-2L (Pb-free lead plating and halogen-free package) TO-92-2L (Pb-free lead plating and halogen-free package) Shipping 1000 pcs / bag, 10 bags/box, 10 boxes/carton 2000 pcs / Tape & Box CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211A2 Issued Date : 2012.11.07 Revised Date : 2015.07.03 Page No. : 3/6 Typical Characteristics Power Derating Curve Forward Current vs Forward Voltage 0.7 Instantaneous Forward Current---IF(mA) 1000 Power Dissipation(W) 0.6 0.5 0.4 0.3 0.2 0.1 125℃ 100 25°C 10 75°C Pulse width=300μs, 1% Duty cycle 1 0 0 25 50 75 100 125 150 175 0 200 Ambient Temperature---TA(℃) 0.4 0.6 0.8 1 1.2 1.4 Forward Voltage---VF(V) 1.6 1.8 Junction Capacitance vs Reverse Voltage Reverse Leakage Current vs Reverse Voltage 10 Junction Capacitance---C J(pF) 1000 Reverse Leakage Current---IR(nA) 0.2 Tj=125℃ 100 Tj=75℃ 10 Tj=25℃ Tj=25℃, f=1.0MHz 1 1 0 100 200 300 400 500 Reverse Voltage---VR (V) QJ-2L 600 700 0.1 1 10 100 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211A2 Issued Date : 2012.11.07 Revised Date : 2015.07.03 Page No. : 4/6 TO-92-2L Taping Outline DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - QJ-2L Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211A2 Issued Date : 2012.11.07 Revised Date : 2015.07.03 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 240 +0/-5 C 217C 60-150 seconds 260 +0/-5 C 10-30 seconds 20-40 seconds 6C/second max. 6 minutes max. 6C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. QJ-2L CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211A2 Issued Date : 2012.11.07 Revised Date : 2015.07.03 Page No. : 6/6 TO-92-2L Dimension Marking: Style: Pin 1.Anode 2.Not Connected 3.Cathode 2-Lead TO-92-2L Plastic Surface Mounted Package CYStek Package Code: A2 Millimeters Min. Max. 3.300 3.700 1.100 1.400 0.380 0.550 0.360 0.510 4.400 4.700 3.430 4.300 4.700 DIM A A1 b c D D1 E Inches Min. Max. 0.130 0.146 0.043 0.055 0.015 0.022 0.014 0.020 0.173 0.185 0.135 0.169 0.185 DIM e e1 L L1 Φ h Millimeters Min. Max. 1.270 TYP 2.440 2.640 14.100 14.500 2.000 2.650 1.600 0.000 0.380 Inches Min. Max. 0.050 TYP 0.096 0.104 0.555 0.571 0.079 0.104 0.063 0.000 0.015 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: Lead: Pure tin plated. Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. QJ-2L CYStek Product Specification