ERmet ZDplus Application Note Version 1.0 ERmet ZDplus Application Note Version 2.2 www.erni.com Katalog D 074518 Ausgabe 09/13 3, 03/05 www.erni.com 1 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 The ERmet ZDplus connector is an enhancement of the ERmet ZD family. This high-speed differential Hard Metric connector system enables data rates of 20 Gbit/s and more. The ERmet ZDplus is based on the principal mechanical design of the proven ERmet ZD with the same dimensions. To enable higher data rates ERNI Electronics has optimized the signal routing and the pressfit termination of the female connector. To benefit from the maximum performance of the new ERmet ZDplus the usage of backdrilling is recommended. Decreasing via stub length and the related “stub effect” by backdrilling significantly reduces the reflections and the overall BER (Bit Error Rate) of the interconnect. The first product of the ERmet ZD+® family is the 4-pair right angle female connector with pressfit termination. The ERmet ZDplus female connector is mating compatible to the existing ERmet ZD male connector. This means, that existing backplane designs do not need layout changes on the backplane side, if customers want to upgrade their systems. Of course the layout on the daughtercards has to be modified if using the new ERmet ZDplus female parts. Single pair and multi pair spice models available. Also s-parameter and spectraquest models Technical Features • Modules: 2-, 3- and 4-pair versions available. • Mating: Compatible to standard ERmet ZD male connectors, backwards compatible to existing backplane systems • Design: Wafers with individually fully shielded pairs of contacts. • Contacts: Low noise, dual beam, leaf contacts with one ground blade for every pair of signals. • Wafer pitch: 2.5 mm from wafer to wafer. • Pitch between signal pins: 1.5 mm between pairs (within wafer). • Pitch between pairs: 4.5 mm (within wafer). • Ground arrangement: In line with signals at termination and sur- rounding shield. • Multiline Crosstalk: <3% at 100ps rise time, 250 mV swing. • Insertion loss: <3 dB up to 10 GHz. • Differential Impedance: 100 Ω ±5 % • Skew Compensation: max. 3ps differential skew • Power Modules: Closed entry, vertical female backplane modu- les with stamped blades. • Alignment Features: Improved pre-alignment guide and polari- zing features, 4 rigid blades for all modules. • Datarate Options: Female Male Datarate ZD ZD 5+ Gbit/s ZDplus ZD 15+ Gbit/s ZD ZDplus 10+ Gbit/s ZDplus ZDplus 20+ Gbit/s 3 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings ERmet ZD Vertical Male Connectors 4 pair / 10 wafer -0,1 0,05 6,35 0,1 23,4 Date Code ) -0,1 3 ( 1,7 Löcher ø 0.6 0,2 13,4 XXXXXXX ERNI EE-Zone für durchkontaktierte ±0.05 compliant zone for through hol e 10 9 8 7 6 5 4 3 ±0.05 2 5,7 ø 0.6 1 4,5 1,5 a b ab c d cd e f ef g h gh 2,5 9x2.5= 22,5 24,95 0,75 -0,1 Part Numbers Configuration Pin Version Type 4 (4 pairs) / 10 wafers D 973031 Type 4 (4 pairs) / 10 wafers B 973061 4 www.erni.com 09/13 Part Number ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings ERmet ZD Vertical Male Connectors 3 pair / 10 wafer Ident-Nr. Date/Code 18,9 -0,1 0,05 ERNI 973062 3 1,7 compliant zone for through hol e ±0.05 5,7 ø 0.6 -0,1 ±0.05 0,2 Löcher ø 0.6 6,35 0,1 13,4 XXXXXXX EE-Zone für durchkontaktierte 10 9 8 7 6 5 4 3 2 1 1,5 4,5 a b ab c d cd e f ef 2,5 0,75 9x2.5= 22,5 24,95 -0,1 Part Numbers Configuration Pin Version Part Number Type 3 (3 pairs) / 10 wafers D 973027 Type 3 (3 pairs) / 10 wafers B 973062 5 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings ERmet ZDplus Vertical Male Connectors 4 pair / 10 wafer Anforderungsstufe class 6,35 ±0,1 XXXXXXX ERNI RC 2 9 x 2,5 = 22,5 3 -0,1 A EN-Zone für durchkontaktierte Löcher 0.46 ± 0.05 2,5 13,4 ±0,05 23,4 -0,1 Date Code 1,5 compliant zone for through hole 0.46 ± 0.05 DETAIL A MAßSTAB 5 : 1 Leiterplattenoberfläche Tochterkarte Top surface of daughter card 9 8 7 6 5 4 3 2 Messerkontakte sind im Paar symmetrisch angeordnet 1 Male contacts within pairs are arranged symmetriecally 5,7 10 a b GND ab c d GND cd e f GND ef 1,2 Kontaktversionen, Messerkontakte A B 5,3 ±0,1 g h GND gh 3,8 ±0,1 4,5 1,5 Contact Selection Options, Male Contacts 9x 2,5 = 22,5 3 -0,1 2,5 0,75 1,6 +0,2 24,95 -0,1 Leiterplattenkante Backplane edge Bestückungsplan - contact layout a b GND ab c d GND cd e f GND ef g h GND gh A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z 10 9 8 7 6 5 4 3 2 1 Part Number Configuration Pin Version Type 4 (4 pairs) / 10 wafers A 6 www.erni.com 09/13 Part Number 394452 ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings ERmet ZDplus Vertical Male Connectors 3 pair / 10 wafer Anforderungsstufe class 18,9 -0,1 6,35 ±0,1 XXXXXXX ERNI RC 2 9 x 2,5 = 22,5 3 -0,1 A EN-Zone für durchkontaktierte Löcher 0.46 ± 0.05 2,5 13,4 ±0,05 Date Code 1,5 compliant zone for through hole 0.46 ± 0.05 DETAIL A MAßSTAB 5 : 1 Leiterplattenoberfläche Tochterkarte Top surface of daughter card 9 8 6 7 5 4 3 2 1 1,2 5,7 10 Messerkontakte sind im Paar symmetrisch angeordnet Male contacts within pairs are arranged symmetriecally a b GND ab c d GND cd e f GND ef Kontaktversionen, Messerkontakte A B 5,3 ±0,1 3,8 ±0,1 4,5 1,5 Contact Selection Options, Male Contacts 9x 2,5 = 22,5 3 -0,1 2,5 0,75 1,6 +0,2 24,95 -0,1 Leiterplattenkante Backplane edge Bestückungsplan - contact layout a b GND ab c d GND cd e f GND ef A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z 10 9 8 7 6 5 4 3 2 1 Part Number Configuration Pin Version Type 3 (3 pairs) / 10 wafers A Part Number 464514 7 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings ERmet ZDplus Vertical Male Connectors 2 pair / 10 wafer Anforderungsstufe class Date Code 6,35 ±0,1 13,4 ±0,05 15,4 -0,1 XXXXXXX ERNI RC 2 9 x 2,5 = 22,5 Leiterplattenoberfläche Tochterkarte Top surface of daughter card 8 7 6 5 4 3 2 3 -0,1 DETAIL A MAßSTAB 5 : 1 1 4,5 a b GND ab c d GND cd 1,2 5,7 9 1,5 Messerkontakte sind im Paar symmetrisch angeordnet Male contacts within pairs are arranged symmetriecally 1,5 10 A EN-Zone für durchkontaktierte LöcherØ 0.46 ± 0.05 compliant zone for through hole Ø 0.46 ± 0.05 2,5 0,75 Kontaktversionen, Messerkontakte Contact Selection Options, Male Contacts A B 1,6 +0,2 3 -0,1 5,3 ±0,1 3,8 ±0,1 2,5 9x 2,5 = 22,5 24,95 -0,1 Bestückungsplan - contact layout a b GND ab c d GND cd A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z A A Z 10 9 8 7 6 5 4 3 2 1 Leiterplattenkante Backplane edge Part Number Configuration Pin Version Type 2 (2 pairs) / 10 wafers A 8 www.erni.com 09/13 Part Number 464520 ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings Right Angle Female Connectors 4 pair / 10 wafer 22,5 2,5 0,75 h g 1,5 19,4 f e 4,5 d c b a 10 1 EN-Zone für durchkontaktierte Löcher 0.46 ± 0.05 compliant zone for through hole 0.46 ± 0.05 15,7 24,95 -0,1 0,9 1,6 1,1 1,2 27,9 ±0,1 1,2 GND h h g GND g GND f f e GND e GND d d c GND c GND b b a GND a 10,4 Position 17,5 Date Code +0,2 1 18,6 16,7 21,4 -0,1 Oberfläche der Tochterplatine Top surface of daughter card Part Numbers Configuration Part Number Type 4 (4 pairs) / 10 wafers 384312 9 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings Right Angle Female Connectors 3 pair / 15 wafer Part Numbers Configuration Part Number Type 3 (3 pairs) / 15 wafers 384310 10 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings Right Angle Female Connectors 3 pair / 10 wafer 9 x 2,5 = 22,5 2,5 0,75 4,5 1,5 d c 14,9 f e b a 10 1 EN-Zone für durchkontaktierte Löcher 0.46 ± 0.05 compliant zone for through hole 0.46 ± 0.05 1,6 +0,2 14,1 23,4 1 10,4 1,1 1,2 20,2 GND f f e GND e GND d d c GND c GND b b a GND a 1,2 13 0,9 25 max. 12,2 16,9 Oberfläche der Tochterplatine Top surface of daughter card Part Numbers Configuration Part Number Type 3 (3 pairs) / 10 wafers 454530 11 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Dimensional Drawings Right Angle Female Connectors 2 pair / 10 wafer 9 x 2,5 = 22,5 2,5 0,75 4,5 11,35 d c b a 1 1,5 1,6 8,56 Oberfläche der Tochterplatine Top surface of daughter card EN-Zone für durchkontaktierte Löcher Ø 0,46 ± 0,05 compliant zone for through hole Ø 0,46 ± 0,05 18,9 GND d d c GND c GND b b a GND a 1,2 1,1 10,4 0,9 -0,1 1,2 24,95 +0,2 8,65 13,35 1 10 -0,1 Part Numbers Configuration Part Number Type 2 (2 pairs) / 10 wafers 464459 12 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Layout Backplane Layout 4 Pair ERmet ZD Male Connector 13 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Layout Backplane Layout 4 Pair ERmet ZDplus 14 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Layout Daughtercard Layout 4 Pair ERmet ZDplus Female Connector Daughtercard Layout 3 Pair ERmet ZDplus Female Connector 15 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Layout Daughtercard Layout 2 Pair ERmet ZDplus Female Connector Trace Routing 16 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Schichtaufbau im metallisierten Loch für EN-Kontakt Plated Through-Holes for Pressfit Terminals All pressfit terminals of the ERmet ZDplus modules share the same plated through-hole requirements. These pressfit terminals have been used successfully with reflowed tin-lead, plated tin-lead, immersion tin, organic coatings over bare copper and immersion gold hole plating regimes. The hole recommendations and press in force information shown in this catalog are for reflowed tin-lead and plated tin-lead. Additional test data for other hole plating regimes are available through customer service. Metal plating of plated-through hole for EN-contact Bohrungsdurchmesser des Loches Durchmesser des metallisierten Loches Diameter of finished plated-through hole 0,55 ±0,02 Diameter of drilled hole 0,46 ±0,05 min. 0,05 Restringbreite Restring width max. 10 µm Sn 1) min. 25 µm Cu 1) Backdrilling Werden andere Oberflächentechniken, wie z.B. NiAu, chem. Sn oder Cu blank eingesetzt, sind die angegebenen Maße für Bohrungsdurchmesser, Durchmesser des metallisierten Loches, Restringbreite und die Mindestschichtdicke von Cu einzuhalten. Ein mögliches Überschreiten der oberen Toleranz von Maß "Durchmesser des metallisierten Loches" wird durch eine entsprechende Cu-Schichtdicke vermieden. For other platings, such as NiAu, chem. Sn or blanc Cu the recommended dimensions have to be respected for the diameter of drilled hole, diameter of plated-through hole, rest ring width and min. thickness of Cu plating. To keep the max. tolerance for the "Diameter of finished plated-through hole" the according thickness of the Cu-plating has to be used. für Einpresszone ERmet ZDplus for press-fit zone ERmet ZDplus Stubbing Effect Top connection Bottom connection The bottom connection is to prefer, because it don’t cause so much reflection. 17 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 High Frequency Simulation in Board Interface Simulation Setup Simulation study with traces in upper and lower layer. Two Ground Pins Cross section without insulator Description Ports Input Signal Signal rise time: 50 ps 18 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 High Frequency Simulation in Board Interface Results for Traces in Upper Layer Impedance NEXT of neighbored signal pairs 19 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 High Frequency Simulation in Board Interface FEXT of neighbored signal pairs Results for Traces in Lower Layer Impedance 20 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 High Frequency Simulation in Board Interface NEXT of neighbored signal pairs FEXT of neighbored signal pairs 21 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Measurement Results Introduction In this abstract several results of ERNI ERmet ZDplus were presented, based on S-Parameter measurements with ZProbe. Measurement Equipment: Agilent ENA E5071C with Cascade Microtech ZProbes (GSGSG) Calibration and de-embedding were performed to isolate the connector. Frequency Range: Sweep points: IF Bandwidth: 300kHz...20GHz 3001 1kHz Device Under Test: ZDplus testboard V6 (20.12.2012) 22 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Measurement Results Return and Insertion Loss 23 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Measurement Results Crosstalk 24 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Measurement Results Intra-Pair Skew 25 www.erni.com 09/13 ERmet ZDplus - Application Note Version 2.2 Guiding System Layouts Alignment pin kit with base plate Alignment pin kit without base plate Alignment guide bush kit Layout of daughter card Backplanelayout 4,3 0,03 15,4 7 0,1 10,5 0,2 10,5 component side 0,05 8,5 daughtercard 5,5 0,1 14 2,5 +0,05 0,2 backplane 0,05 0,03 -0,2 4,3 Backplane 3 Backplanelayout daughtercard 3,1 0,03 Ordering Information Configuration PCB Thickness Electrical Contact Guiding pin kit without base plate 2.5 - 6.0 mm Yes 214361 Guiding pin kit without base plate 6.0 - 8.0 mm Yes 214362 Guiding pin kit with base plate 2.5 - 6.0 mm Yes 214363 Guiding pin kit with base plate 6.0 - 8.0 mm Yes 214364 Guiding pin kit without base plate 2.5 - 6.0 mm No 144370 Guiding pin kit without base plate 6.0 - 8.0 mm No 144371 Guiding pin kit with base plate 2.5 - 6.0 mm No 144131 Guiding pin kit with base plate 6.0 - 8.0 mm No 144132 Guid bush kit 1.5 - 3.0 mm Yes 234675 Guid bush kit 3.0 - 4.5 mm Yes 164307 Guid bush kit 1.5 - 3.0 mm No 144127 Guid bush kit 3.0 - 4.5 mm No 144128 26 www.erni.com 09/13 Part Number Member www.erni.com Katalog D 074518 Ausgabe 3, 03/05 www.erni.com 09/13 27 ERNI Electronics GmbH & Co. KG Seestrasse 9 73099 Adelberg/Germany Tel +49 7166 50-0 Fax +49 7166 50-282 [email protected] Europe ERNI Electronics, Inc. 2201 Westwood Ave Richmond, VA 23230/USA Tel +1 804 228-4100 Fax +1 804 228-4099 [email protected] North America Canada ERNI Asia Holding Pte Ltd. Blk 4008 Ang Mo Kio Avenue 10 #04-01/02 Techplace I Singapore 569625 Tel +65 6 555 5885 Fax +65 6 555 5995 [email protected] Asia New Zealand South America Australia Africa Japan Mexico www.erni.com © ERNI Electronics GmbH & Co. KG 2013 • Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is reserved. ERNI®, MicroStac®, MicroSpeed®, MiniBridge®, MaxiBridge®, ERmet®, ERmet ZD®, ERbic® and ERNIPRESS® are trademarks (registered or applied for in various countries) of ERNI Electronics GmbH & Co. KG. AdvancedTCA®, CompactPCI® and CompactPCI Express® are trademarks of PCI Industrial Computer Manufacturers Group. 28 Katalog D 074518 Ausgabe 09/13 3, 03/05 www.erni.com