HSP062-2 2-line ESD protection for high speed lines Features ■ Flow-through routing to keep signal integrity ■ Ultralarge bandwidth: 4.6 GHz ■ Ultralow capacitance: 0.6 pF ■ Low leakage current: 100 nA at 25 °C ■ Extended operating junction temperature range: -40 °C to 150 °C ■ RoHS compliant Benefits ■ High ESD robustness of the equipment ■ Suitable for high density boards HSP062-2P6 SOT 666 HSP062-2M6 µQFN-6L package Figure 1. Functional schematic (top view) I/O1 1 6 NC I/O1 1 6 NC I/O2 2 5 NC I/O2 2 5 NC GND 3 4 VBUS GND 3 4 VBUS Complies with following standards ■ ■ MIL-STD 883G Method 3015-7 Class 3B: – 8 kV IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) µQFN 6 leads SOT-666 Applications Description The HSP062-2 series is designed to protect against electrostatic discharge on sub micron technology circuits driving: The HSP062-2 is a 2-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. ■ HDMI 1.3 and 1.4 ■ Digital Video Interface ■ Display Port The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps. ■ USB 3.0 ■ Serial ATA ■ Ethernet ■ HMI February 2012 The HSP062-2P6 is housed in a SOT-666, while the HSP062-2M6 is packaged in µQFN-6L (1.45 x 1.0 mm) with a 500 µm pitch. Doc ID 022778 Rev 1 1/11 www.st.com 11 Characteristics HSP062-2 1 Characteristics Table 1. Absolute maximum ratings Tamb = 25 °C Symbol Parameter Value IEC 61000-4-2 contact discharge 8 IEC 61000-4-2 air discharge 15 Unit VPP Peak pulse voltage Ipp Repetitive peak pulse current (8/20 µs) 3 A Tj Operating junction temperature range -40 to +150 °C Storage temperature range -65 to +150 °C 260 °C Tstg kV TL Maximum lead temperature for soldering during 10 s Table 2. Electrical characteristics Tamb = 25 °C Symbol Test conditions Min. Typ. Max. Unit VBR Breakdown voltage IR = 1 mA IRM Leakage current VRM = 3 V VCL Clamping voltage IEC 61000-4-2, +8 kV contact (IPP = 30 A), measured at 30 ns 18 Capacitance (input/output to ground) VI/O = 0 V, F = 200 to 3000 MHz, VOSC = 30 mV 0.6 0.9 pF Capacitance variation (input/output to ground) VI/O = 0 V F = 200 to 3000 MHz, VOSC = 30 mV 0.09 0.17 pF Cut-off frequency -3 dB 4.6 CI/O - GND ΔCI/O - GND fC 2/11 Parameter Doc ID 022778 Rev 1 6 V 100 nA V GHz HSP062-2 Figure 2. Characteristics Leakage current versus junction temperature (typical values) Figure 3. S21 attenuation measurement dB 10.00 0.00 VR = V RM = 3 V IR (nA) -3.00 4.6 GHz @ -3dB 1.00 -6.00 -9.00 0.10 -12.00 F(Hz) Tj (°C) 0.01 25 Figure 4. 50 75 100 125 150 Eye diagram - HDMI mask at 3.4 Gbps per channel(1) (HSP062-2M6) -15.00 300.0k Figure 5. 1.0M 3.0M IO1 10.0M 30.0M 100.0M300.0M 1.0G IO2 3.0G Eye diagram - HDMI mask at 3.4 Gbps per channel(1) (HSP062-2P6) 250 mV/div 250 mV/div 49 ps/div 49 ps/div 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 10V/Div 10V/Div 100ns/Div Doc ID 022778 Rev 1 100ns/Div 3/11 Ordering information scheme 2 HSP062-2 Ordering information scheme Figure 8. Ordering information scheme HSP 06 2 - 2 x6 High speed line protection Breakdown Voltage Version Number of lines Package P6 = SOT-666 M6 = µQFN-6L 4/11 Doc ID 022778 Rev 1 HSP062-2 3 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. SOT-666 dimensions Dimensions b1 Ref. L1 Millimeters Min. L3 Typ. Max. Inches Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 b D E1 A L2 E A3 0.27 0.34 0.007 0.011 0.013 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 e L3 Figure 9. Footprint recommendations dimensions in mm (inches) 0.10 0.004 Figure 10. Marking 0.50 (0.019) 0.62 2.60 (0.024) (0.01) U 0.99 (0.039) 0.30 (0.012) Doc ID 022778 Rev 1 5/11 Package information HSP062-2 Table 4. Micro QFN 1.45x1.00 6L dimensions Dimensions 1 2 Ref. L k b e A A1 D N E 1 2 Figure 11. Footprint recommendations dimensions in mm (inches) 0.50 [0.020] Typ. Max. Min. Typ. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 D 1.45 0.057 E 1.00 0.039 e 0.50 0.020 K 0.20 L 0.30 Max. 0.008 0.35 0.40 0.012 0.014 0.016 Figure 12. Marking 0.25 [0.010] 0.30 [0.012] 6/11 Inches Min. 0.65 [0.026] Note: Millimeters 1.60 [0.063] S Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Doc ID 022778 Rev 1 HSP062-2 Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 13. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 14. Recommended stencil window position 7 µm 7 µm 620 µm 650 µm 15 µm 236 µm 15 µm Footprint 250 µm Stencil window Footprint Doc ID 022778 Rev 1 7/11 Recommendation on PCB assembly 4.2 4.3 4.4 8/11 HSP062-2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Doc ID 022778 Rev 1 HSP062-2 4.5 Recommendation on PCB assembly Reflow profile Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 022778 Rev 1 9/11 Ordering information 5 HSP062-2 Ordering information Table 5. Ordering information Order code Marking Package Weight Base qty Delivery mode HSP062-2P6 U SOT-666 2.85 mg 3000 Tape and reel (7”) HSP062-2M6 (1) µQFN-6L 2.3 mg 3000 Tape and reel (7”) S 1. The marking can be rotated by multiple of 90° to differentiate assembly location 6 Revision history Table 6. 10/11 Document revision history Date Revision 07-Feb-2012 1 Changes Initial release. Doc ID 022778 Rev 1 HSP062-2 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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