EMIF02-SPK01M6 2-line IPAD™, EMI filter and ESD protection for speaker Features Pin 1 ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering ■ Very low PCB space consumption: 1.0 mm x 1.45 mm ■ Pitch 0.5 mm ■ Very thin package: 0.6 mm max ■ High efficiency in ESD suppression ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging ■ Lead-free package Micro QFN 6 leads 1.45 mm x 1.00 mm (bottom view) Figure 1. Complies with following standards ■ IEC 61000-4-2 level 4, input pins – 15 kV (air discharge) – 8 kV (contact discharge) ■ IEC 61000-4-2 level 1, output pins – 2 kV (air discharge) – 2 kV (contact discharge) ■ MILSTD883 Class 3B ■ SPKR in 1 6 SPKR out GND 2 5 GND SPKL in 3 4 SPKL out Figure 2. Application Pin configuration (top view) Basic cell configuration Low-pass filter Mobile telephones Input Output Description The EMIF02-SPK01M6 is a 2-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. GND GND GND This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV. TM: IPAD is a trademark of STMicroelectronics September 2009 Doc ID 15845 Rev 2 1/11 www.st.com 11 Characteristics EMIF02-SPK01M6 1 Characteristics Table 1. Absolute ratings (limiting values at Tamb = 25 °C unless otherwise specified) Symbol VPP Tj Parameter Value ESD discharge IEC 61000-4-2 air discharge on input pins Air discharge Contact discharge ESD discharge IEC 61000-4-2 contact discharge on output pins Air discharge Contact discharge MILSTD883 Class 3B Unit 15 8 kV 2 2 8 Junction temperature 125 °C Top Operating temperature range -30 to +85 °C Tstg Storage temperature range -55 to +150 °C Figure 3. Electrical characteristics (definitions) I IPP Symbol VBR VCL IRM VRM IPP IR Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Peak pulse current Breakdown current = = = = = = VCL VBR VRM IR IRM IRM IR VRM VBR VCL V IPP Table 2. Electrical characterisitcs (Tamb = 25 °C) Symbol Test conditions Min. Typ. 6 8 Max. Unit VBR IR = 1 mA IRM VRM = 3 V per line RI/O Tolerance ± 20% 10 Ω Cline VR= 0, F = 1 MHz, VOSC = 30 mV, ±30% 220 pF 2/11 V 500 Doc ID 15845 Rev 2 nA EMIF02-SPK01M6 Figure 4. Characteristics Attenuation measurement 0.00 S21 (dB) -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 F (Hz) -35.00 300.0k Figure 5. 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M ESD response to IEC 61000-4-2 Figure 6. +15 kV air discharge on SPK R line 1.0G 3.0G ESD response to IEC 61000-4-2 +15 kV air discharge on SPK L line SPKL IN SPKR IN vi = 10 V/d SPKL OUT SPKR OUT Figure 7. vi = 10 V/d vo = 10 V/d vo = 10 V/d 100 ns/d 100 ns/d ESD response to IEC 61000-4-2 Figure 8. - 15 kV air discharge on SPK R line ESD response to IEC 61000-4-2 - 15 kV air discharge on SPK Lline vi = 10 V/d vi = 10 V/d SPKL IN SPKR IN vo = 10 V/d vo = 10 V/d SPKL OUT SPKR OUT 100 ns/d Doc ID 15845 Rev 2 100 ns/d 3/11 Ordering information scheme 2 EMIF02-SPK01M6 Ordering information scheme Figure 9. Ordering information scheme EMIF EMI filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads 4/11 Doc ID 15845 Rev 2 yy - xxx zz Mx EMIF02-SPK01M6 3 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. Micro QFN 1.45 x 1.00 6L dimensions Dimensions D N Ref. Millimeters Inches E 1 Min. Typ. Max. Min. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 2 A A1 1 2 L k Typ. D 1.45 0.057 E 1.00 0.039 e 0.50 0.020 Max. b e Figure 10. Footprint in mm [inches] 0.50 [0.020] K 0.20 L 0.30 0.008 0.35 0.40 0.012 0.014 0.016 Figure 11. Marking Dot : Pi n 1 Identification K = Marking 0.25 [0.010] 0.60 [0.023] 0.30 1.60 [0.012] [0.063] K Doc ID 15845 Rev 2 5/11 Package information EMIF02-SPK01M6 Figure 12. Tape and reel specification Dot identifying pin 1 location φ 1.5 ±0.1 3.5 ±0.03 1.65 8.0 ±0.3 0.75 4.00 ±0.1 1.75 ±0.1 2.0 ±0.05 K K K 1.20 4.00 User direction of unreeling Note: 6/11 Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Doc ID 15845 Rev 2 EMIF02-SPK01M6 Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil Opening Dimensions: L (Length), W (Width), T (Thickness). Figure 13. Stencil opening dimensions L T b) W General Design Rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 14. Recommended stencil window position 7 µm 7 µm 620 µm 650 µm 15 µm 236 µm 15 µm Footprint 250 µm Stencil window Footprint Doc ID 15845 Rev 2 7/11 Recommendation on PCB assembly 4.2 4.3 4.4 8/11 EMIF02-SPK01M6 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Doc ID 15845 Rev 2 EMIF02-SPK01M6 4.5 Recommendation on PCB assembly Reflow profile Figure 15. ST ECOPACK recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 15845 Rev 2 9/11 Ordering information 5 EMIF02-SPK01M6 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-SPK01M6 K(1) Micro QFN 2.2 mg 3000 Tape and reel (7”) 1. The marking can be rotated by 90° to diferentiate assembly location 6 Revision history Table 5. 10/11 Document revision history Date Revision Changes 11-Sep-2009 1 Initial release 21-Sep-2009 2 Updated Figure 3. 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