SD4933MR 50 V moisture resistant DMOS transistor for ISM applications Datasheet - preliminary data Features • Improved ruggedness V(BR)DSS > 200 V • Excellent thermal stability • 20:1 all phases load mismatch capability • POUT = 300 W min. with 24 dB gain @ 30 MHz • In compliance with the 2002/95/EEC European directive • Moisture resistant package specifically designed to operate under extreme environments M177MR Epoxy sealed Description Figure 1. Pin connection 4 The SD4933MR is an N-channel MOS field-effect RF power transistor. It is intended for use in 50 V ISM applications up to 100 MHz. 1 The SD4933MR benefits from the latest generation of environmentally designed packaging, ruggedized against cyclic high moisture operating and severe storage conditions. 5 3 2 1. Drain 3. Gate 2. Source 4. Source 5. Source Table 1. Device summary Order code Marking Base qty. Package Packaging SD4933MR SD4933MR(1) 25 pcs M177MR Plastic tray 1. For more details please refer to Chapter 8: Marking, packing and shipping specifications.. May 2013 DocID023664 Rev 2 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/20 www.st.com Contents SD4933MR Contents 1 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Typical performance (30 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.1 Test circuit (30 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 VGS/GFS sorts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 Marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 16 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2/20 DocID023664 Rev 2 SD4933MR Electrical data 1 Electrical data 1.1 Maximum ratings (TCASE = 25 °C) Table 2. Absolute maximum ratings Symbol Value Unit Drain source voltage 200 V Drain-gate voltage (RGS = 1 MΩ) 200 V Gate-source voltage ±20 V Drain current 40 A Power dissipation 648 W EAS Avalanche energy Single pulse (ID = 56 A - 800 µH coil) 1200 mJ TJ Max. operating junction temperature 200 °C -65 to +150 °C Value Unit 0.27 °C/W V(BR)DSS VDGR VGS ID PDISS TSTG 1.2 Parameter Storage temperature Thermal data Table 3. Thermal data Symbol RthJC Parameter Junction - case thermal resistance DocID023664 Rev 2 3/20 20 Electrical characteristics 2 SD4933MR Electrical characteristics (TCASE = 25 oC) 2.1 Static Table 4. Static Symbol 2.2 Test conditions Min Typ 200 240 Max Unit V(BR)DSS VGS = 0 V IDS = 100 mA IDSS VGS = 0 V VDS = 100 V 2 mA IGSS VGS = 20 V VDS = 0 V 1 µA VTH ID = 250 mA 2.5 4.0 V VDS(ON) VGS = 10 V ID = 20 A 3.5 4.0 V GFS VDS = 10 V ID = 5 A CISS VGS = 0 V VDS = 50 V COSS VGS = 0 V CRSS VGS = 0 V 1.5 5 V 8 S f = 1 MHz 1000 pF VDS = 50 V f = 1 MHz 400 pF VDS = 50 V f = 1 MHz 16 pF Dynamic Table 5. Dynamic Symbol Test conditions Min Max Unit - W POUT VDD = 50 V IDQ = 250 mA f = 30 MHz 300 GPS VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz 20 24 - dB hD VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz 50 58 - % 10:1 20:1 - VSWR VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz Load mismatch All phase angles 4/20 Typ DocID023664 Rev 2 SD4933MR 3 Impedance data Impedance data Figure 2. Impedance data ' ='/ 7\SLFDO'UDLQ /RDG,PSHGDQFH 7\SLFDO,QSXW ,PSHG DQFH * =,1 6 $09 Table 6. Impedance values Zin Zdl 1.6 - j 5.0 3.3 + j 1.0 DocID023664 Rev 2 5/20 20 Typical performance 4 SD4933MR Typical performance Figure 3. Capacitance vs. drain voltage Figure 4. Drain current vs. drain-source voltage 35 1200 30 1000 25 800 Cgs Cgd Ids (A) Capacitance (pF) 1400 Cds 600 20 15 400 10 200 5 0 0 0 10 20 30 40 50 0 AM09243V1 Figure 5. Drain current vs. drain-source voltage at different temperatures 40 35 25°C 30 80°C -20°C Ids (A) 25 20 15 10 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Vgs (V) AM09245V1 6/20 2 4 6 8 10 Vds (V) Drain-source voltage (V) DocID023664 Rev 2 AM09244V1 SD4933MR Typical performance Figure 6. Transient thermal impedance Single -repetitive pulse Thermal Impedance - ZTH J-C (°C / W) 0.30 single pulse 10% 20% 0.25 30% 40% 0.20 50% 60% 0.15 0.10 0.05 0.00 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Rectangular power pulse Width (sec) AM09280V2 DocID023664 Rev 2 7/20 20 Typical performance SD4933MR Figure 7. Transient thermal impedance model 'LVVLSDWHG3RZHU:DWWV 5 5 5 2KP & & & ) 5 5 5 2KP & & & ) 5 5 5 2KP & & & ) 5 5 5 2KP & & & ) $09 8/20 DocID023664 Rev 2 SD4933MR 5 Typical performance (30 MHz) Typical performance (30 MHz) 80 26 70 24 60 22 50 20 40 30 18 Pgain Figure 9. Output power vs. input power Pout (W) 28 Efficiency (%) Power gain (dB) Figure 8. Gain and efficiency vs. output power at Vdd = 50 V, Idq = 250 mA, freq = 30 MHz Efficiency 20 16 14 0 50 100 150 200 250 300 350 400 450 400 350 300 250 200 150 100 50 0 10 450 0.0 50 V 40 V 0.5 1.0 1.5 2.0 2.5 Output Power (W) AM09248V2 3.5 AM09246V1 Figure 10. Output power vs. supply voltage Figure 11. Output power vs. gate voltage 400 500 Pin = 2.8W 350 400 300 Pout (W) Pout (W) 3.0 Pin (W) 250 200 150 Pin = 2.8W 300 200 100 Pin = 1.4W 0 100 25 30 35 40 45 50 -3 -2 -1 0 1 2 3 4 Vgs (V) Vdd (V) AM09247V1 DocID023664 Rev 2 AM09248V1 9/20 20 Typical performance (30 MHz) 5.1 SD4933MR Test circuit (30 MHz) Figure 12. 30 MHz test circuit schematic Table 7. Transmission line dimensions 10/20 Dim. Inch mm A 0.532 13.51 B 0.250 6.35 C 0.181 4.59 D 0.383 9.37 E 0.351 8.91 F 0.633 16.08 G 0.477 12.12 H 0.438 11.12 J 0.200 5.08 K 0.164 4.16 L 0.174 4.42 M 0.817 20.75 N 0.350 8.89 P 0.779 19.79 R 0.639 16.23 DocID023664 Rev 2 SD4933MR Typical performance (30 MHz) Table 7. Transmission line dimensions (continued) Dim. Inch mm S 0.165 4.19 T 1.017 25.84 U 0.375 9.52 V 0.456 11.58 W 0.325 8.24 X 0.650 16.50 Table 8. 30 MHz test circuit component list Component Description C1,C9 0.01 μF / 500 V surface mount ceramic chip capacitor C2, C3 750 pF ATC 700B surface mount ceramic chip capacitor C4 300 pF ATC 700B surface mount ceramic chip capacitor C5,C10,C11,C14,C16 10000 pF ATC 200B surface mount ceramic chip capacitor C6 510 pF ATC 700B surface mount ceramic chip capacitor C7 300 pF ATC 700B surface mount ceramic chip capacitor C8 175-680 pF type 46 standard trimmer capacitor C12 47 μF / 63 V aluminum electrolytic radial lead capacitor C13 1200 pF ATC 700B surface mount ceramic chip capacitor C15 100 μF / 63 V aluminum electrolytic radial lead capacitor R1,R3 1 K OHM 1 W surface mount chip resistor R2 560 OHM 2 W wire-wound axils lead resistor T1 HF 2-30 MHz surface mount 9:1 transformer T2 RG - 142B/U 50 OHM coaxial cable OD = 0.165[4.18] L 15”[381.00] covered with 15”[381.00] tinned copper tubular brand 13/65” [5.1] width L1 1 3/4 turn air-wound 16 AWG ID = 0.219 [5.56] poly-coated magnet wire L2 1 3/4 turn air-wound 12 AWG ID = 0.250 [6.34] bus bar wire RFC1,RFC2 3 turns 14 AWG wire through ferrite toroid FB1 Surface mount EMI shield bead FB2 Toroid PCB ULTRALAM 2000. 0.030” THK, εr = 2.55, 2 Oz ED CU both sides DocID023664 Rev 2 11/20 20 Circuit layout 6 SD4933MR Circuit layout Figure 13. Test fixture component layout SD 4933 Figure 14. Test circuit photomasters 4 12/20 DocID023664 Rev 2 SD4933MR 7 VGS/GFS sorts VGS/GFS sorts Table 9. VGS/GFS sorts Marking VGS(min) VGS(max) GFS(min) GFS(max) A1 1.50 1.75 5 6 A2 1.50 1.75 6 7 A3 1.50 1.75 7 8 A4 1.50 1.75 8 9 A5 1.50 1.75 9 10 A6 1.50 1.75 10 11 A7 1.50 1.75 11 12 A8 1.50 1.75 12 13 A9 1.50 1.75 13 14 B1 1.75 2.00 5 6 B2 1.75 2.00 6 7 B3 1.75 2.00 7 8 B4 1.75 2.00 8 9 B5 1.75 2.00 9 10 B6 1.75 2.00 10 11 B7 1.75 2.00 11 12 B8 1.75 2.00 12 13 B9 1.75 2.00 13 14 C1 2.00 2.25 5 6 C2 2.00 2.25 6 7 C3 2.00 2.25 7 8 C4 2.00 2.25 8 9 C5 2.00 2.25 9 10 C6 2.00 2.25 10 11 C7 2.00 2.25 11 12 C8 2.00 2.25 12 13 C9 2.00 2.25 13 14 D1 2.25 2.50 5 6 D2 2.25 2.50 6 7 D3 2.25 2.50 7 8 D4 2.25 2.50 8 9 D5 2.25 2.50 9 10 DocID023664 Rev 2 13/20 20 VGS/GFS sorts SD4933MR Table 9. VGS/GFS sorts (continued) 14/20 Marking VGS(min) VGS(max) GFS(min) GFS(max) D6 2.25 2.50 10 11 D7 2.25 2.50 11 12 D8 2.25 2.50 12 13 D9 2.25 2.50 13 14 E1 2.50 2.75 5 6 E2 2.50 2.75 6 7 E3 2.50 2.75 7 8 E4 2.50 2.75 8 9 E5 2.50 2.75 9 10 E6 2.50 2.75 10 11 E7 2.50 2.75 11 12 E8 2.50 2.75 12 13 E9 2.50 2.75 13 14 F1 2.75 3.00 5 6 F2 2.75 3.00 6 7 F3 2.75 3.00 7 8 F4 2.75 3.00 8 9 F5 2.75 3.00 9 10 F6 2.75 3.00 10 11 F7 2.75 3.00 11 12 F8 2.75 3.00 12 13 F9 2.75 3.00 13 14 G1 3.00 3.25 5 6 G2 3.00 3.25 6 7 G3 3.00 3.25 7 8 G4 3.00 3.25 8 9 G5 3.00 3.25 9 10 G6 3.00 3.25 10 11 G7 3.00 3.25 11 12 G8 3.00 3.25 12 13 G9 3.00 3.25 13 14 H1 3.25 3.50 5 6 H2 3.25 3.50 6 7 H3 3.25 3.50 7 8 H4 3.25 3.50 8 9 DocID023664 Rev 2 SD4933MR VGS/GFS sorts Table 9. VGS/GFS sorts (continued) Marking VGS(min) VGS(max) GFS(min) GFS(max) H5 3.25 3.50 9 10 H6 3.25 3.50 10 11 H7 3.25 3.50 11 12 H8 3.25 3.50 12 13 H9 3.25 3.50 13 14 I1 3.50 3.75 5 6 I2 3.50 3.75 6 7 I3 3.50 3.75 7 8 I4 3.50 3.75 8 9 I5 3.50 3.75 9 10 I6 3.50 3.75 10 11 I7 3.50 3.75 11 12 I8 3.50 3.75 12 13 I9 3.50 3.75 13 14 J1 3.75 4.00 5 6 J2 3.75 4.00 6 7 J3 3.75 4.00 7 8 J4 3.75 4.00 8 9 J5 3.75 4.00 9 10 J6 3.75 4.00 10 11 J7 3.75 4.00 11 12 J8 3.75 4.00 12 13 J9 3.75 4.00 13 14 DocID023664 Rev 2 15/20 20 Marking, packing and shipping specifications 8 SD4933MR Marking, packing and shipping specifications Table 10. Packing and shipping specifications Order code Packaging Pcs per tray Dry pack humidity VGS and GFS code Lot code SD4933MR Plastic tray 25 < 10 % Not mixed Not mixed Figure 15. Marking layout AM14751V1 Table 11. 16/20 Marking specifications Symbol Description X VGS and GFS sort CZ Assembly plant xxx Last 3 digits of diffusion lot VY Diffusion plant MAR Country of origin CZ Test and finishing plant y Assembly year yy Assembly week DocID023664 Rev 2 SD4933MR 9 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 12. M177MR mechanical data mm Dim. Min. Typ. Max. A 5.72 5.97 B 6.73 6.99 C 21.84 22.10 D 28.70 28.96 E 13.34 14.10 F 0.08 0.18 G 2.49 2.74 H 3.81 4.32 I 7.87 J 27.43 28.45 K 15.88 16.13 DocID023664 Rev 2 17/20 20 Package mechanical data SD4933MR Figure 16. M177MR drawing 8410505_A 18/20 DocID023664 Rev 2 SD4933MR 10 Revision history Revision history Table 13. Document revision history Date Revision Changes 13-Sep-2012 1 Initial release. 22-May-2013 2 Modified: IGSS value in Table 4: Static DocID023664 Rev 2 19/20 20 SD4933MR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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