VISHAY SI3433

Si3433
New Product
Vishay Siliconix
P-Channel 1.8-V (G-S) MOSFET
PRODUCT SUMMARY
VDS (V)
- 20
rDS(on) (W)
ID (A)
0.042 @ VGS = - 4.5 V
- 5.6
0.057 @ VGS = - 2.5 V
- 4.8
0.080 @ VGS = - 1.8 V
- 4.1
(4) S
TSOP-6
Top View
1
6
(3) G
3 mm
2
5
3
4
(1, 2, 5, 6) D
2.85 mm
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
- 20
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
V
- 5.6
- 4.3
- 4.1
- 3.1
ID
TA = 85_C
Pulsed Drain Current
IDM
Continuous Diode Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 85_C
Operating Junction and Storage Temperature Range
PD
A
- 20
- 1.7
- 0.9
2.0
1.1
1.0
0.6
TJ, Tstg
W
_C
- 55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 5 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
45
62.5
90
110
25
30
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71160
S-00624—Rev. A, 03-Apr-00
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2-1
Si3433
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = - 250 mA
- 0.45
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Diode Forward
VDS = 0 V, VGS = "8 V
Voltagea
"100
VDS = - 16 V, VGS = 0 V
-1
VDS = - 16 V, VGS = 0 V, TJ = 85_C
-5
VDS = - 5 V, VGS = - 4.5 V
nA
mA
- 20
A
VGS = - 4.5 V, ID = - 5.6 A
0.025
0.042
VGS = - 2.5 V, ID = - 4.8 A
0.048
0.057
VGS = - 1.8 V, ID = - 1 A
0.066
0.080
gfs
VDS = - 5 V, ID = - 5.6 A
16
VSD
IS = - 1.7 A, VGS = 0 V
- 0.7
- 1.2
11.5
17
rDS(on)
Forward Transconductancea
V
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
1.7
Turn-On Delay Time
td(on)
18
tr
25
50
80
160
45
90
30
50
Rise Time
Turn-Off Delay Time
VDS = - 10 V, VGS = - 4.5 V, ID = - 5.6 A
VDD = - 10 V, RL = 10 W
ID ^ - 1 A, VGEN = - 4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
3
IF = - 1.7 A, di/dt = 100 A/ms
nC
36
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
20
20
VGS = 5 thru 2.5 V
TC = - 55_C
16
12
I D - Drain Current (A)
I D - Drain Current (A)
16
2V
8
1.5 V
4
25_C
12
125_C
8
4
1V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VDS - Drain-to-Source Voltage (V)
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2-2
3.5
4.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VGS - Gate-to-Source Voltage (V)
Document Number: 71160
S-00624—Rev. A, 03-Apr-00
Si3433
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
2500
0.15
0.12
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
VGS = 1.8 V
0.09
VGS = 2.5 V
0.06
2000
Ciss
1500
1000
VGS = 4.5 V
0.03
500
0.00
0
0
4
8
12
16
20
Coss
Crss
0
4
ID - Drain Current (A)
12
16
20
VDS - Drain-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Junction Temperature
5
1.6
VDS = 10 V
ID = 5.6 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
8
4
3
2
1
VGS = 4.5 V
ID = 5.6 A
1.4
1.2
1.0
0.8
0
0
3
6
9
0.6
- 50
12
- 25
0
Qg - Total Gate Charge (nC)
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.15
20
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
TJ = 150_C
10
0.12
ID = 5.6 A
0.09
0.06
0.03
TJ = 25_C
1
0.0
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 71160
S-00624—Rev. A, 03-Apr-00
1.2
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
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Si3433
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
30
24
ID = 250 mA
0.2
Power (W)
V GS(th) Variance (V)
0.3
0.1
18
TA = 25_C
12
0.0
6
- 0.1
- 0.2
- 50
- 25
0
25
50
75
100
125
150
0
10 -2
10 -1
TJ - Temperature (_C)
1
10
100
600
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 360_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
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2-4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
Document Number: 71160
S-00624—Rev. A, 03-Apr-00