VISHAY SI4403DY

Si4403DY
New Product
Vishay Siliconix
P-Channel 1.8-V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
–20
rDS(on) (W)
ID (A)
0.017 @ VGS = –4.5 V
–9
0.023 @ VGS = –2.5 V
–7
0.032 @ VGS = –1.8 V
–6
D TrenchFETr Power MOSFETS
APPLICATIONS
D Load Switch
– Game Stations
– Notebooks
– Desktops
S
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
Top View
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
–20
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
V
–6.5
–9
ID
TA = 70_C
Pulsed Drain Current
–7
–5.0
IDM
continuous Source Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 70_C
Operating Junction and Storage Temperature Range
PD
A
–30
–2.1
–1.3
2.5
1.35
1.6
0.87
TJ, Tstg
W
_C
–55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
38
50
71
92
19
25
Unit
_C/W
C/W
Notes
a
Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71683
S-04393—Rev. A, 13-Aug-01
www.vishay.com
1
Si4403DY
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = –250 mA
–0.45
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward
VDS = 0 V, VGS = "8 V
Diode Forward Voltagea
"100
VDS = –16 V, VGS = 0 V
–1
VDS = –16 V, VGS = 0 V, TJ = 70_C
–10
VDS –5 V, VGS = –4.5 V
rDS(on)
Transconductancea
V
20
nA
m
mA
A
VGS = –4.5 V, ID = –7.4 A
0.014
0.017
VGS = –2.5 V, ID = –6.3 A
0.018
0.023
VGS = –1.8 V, ID = –5.5 A
0.024
0.032
gfs
VDS = –15 V, ID = –7.4 A
28
VSD
IS = –1.3 A, VGS = 0 V
–0.64
–1.1
30.5
50
W
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
VDS = –10 V, VGS = –5 V, ID = –7.4 A
5.3
nC
Gate-Drain Charge
Qgd
3.8
Turn-On Delay Time
td(on)
30
50
tr
30
50
110
200
65
110
45
80
Rise Time
Turn-Off Delay Time
VDD = –10 V, RL = 15 W
ID ^ –1 A, VGEN = –4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = –1.3 A, di/dt = 100 A/ms
ns
Notes
a
Pulse test; pulse width v 300 ms, duty cycle v 2%.
b
Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
30
30
VGS = 5 thru 2 V
24
I D – Drain Current (A)
I D – Drain Current (A)
24
18
1.5 V
12
6
18
12
TC = 125_C
6
25_C
0–1V
0
0
2
4
6
VDS – Drain-to-Source Voltage (V)
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2
8
0
0.0
0.5
–55_C
1.0
1.5
2.0
VGS – Gate-to-Source Voltage (V)
Document Number: 71683
S-04393—Rev. A, 13-Aug-01
Si4403DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
5000
0.060
4000
C – Capacitance (pF)
r DS(on) – On-Resistance ( W )
On-Resistance vs. Drain Current
0.075
0.045
VGS = 1.8 V
0.030
VGS = 2.5 V
Ciss
3000
2000
Coss
1000
0.015
VGS = 4.5 V
0.000
Crss
0
0
6
12
18
24
30
0
4
ID – Drain Current (A)
Gate Charge
16
20
On-Resistance vs. Junction Temperature
1.6
VDS = 10 V
ID = 7.4 A
r DS(on) – On-Resistance (W)
(Normalized)
V GS – Gate-to-Source Voltage (V)
12
VDS – Drain-to-Source Voltage (V)
5
4
3
2
1
VGS = 4.5 V
ID = 7.4 A
1.4
1.2
1.0
0.8
0
0
7
14
21
28
0.6
–50
35
–25
0
Qg – Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.075
r DS(on) – On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
1
0.0
25
TJ – Junction Temperature (_C)
30
I S – Source Current (A)
8
0.060
ID = 7.4 A
0.045
0.030
0.015
0.000
0.2
0.4
0.6
0.8
1.0
VSD – Source-to-Drain Voltage (V)
Document Number: 71683
S-04393—Rev. A, 13-Aug-01
1.2
0
1
2
3
4
5
VGS – Gate-to-Source Voltage (V)
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Si4403DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
40
0.4
32
ID = 250 mA
Power (W)
V GS(th) Variance (V)
0.2
0.0
24
16
–0.2
8
–0.4
–50
–25
0
25
50
75
100
125
150
0
10–2
10–1
TJ – Temperature (_C)
1
10
100
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 71_C/W
0.02
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
10–3
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
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4
10–3
10–2
10–1
Square Wave Pulse Duration (sec)
1
10
Document Number: 71683
S-04393—Rev. A, 13-Aug-01