VISHAY SI4866DY

Si4866DY
New Product
Vishay Siliconix
N-Channel Reduced Qg, Fast Switching MOSFET
FEATURES
D
D
D
D
PRODUCT SUMMARY
VDS (V)
12
rDS(on) (W)
ID (A)
0.0055 @ VGS = 4.5 V
17
0.008 @ VGS = 2.5 V
14
TrenchFETr Power MOSFETS
PWM Optimized for High Efficiency
Low Output Voltage
100% RG Tested
APPLICATIONS
D Synchronous Rectifier
D Point-of-Load Synchronous Buck Converter
D
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
S
Top View
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
12
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
11
14
8
A
"50
IDM
Continuous Source Current (Diode Conduction)a
V
17
ID
2.7
1.40
3.0
1.6
2.0
1.0
TJ, Tstg
Unit
W
_C
-55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction
Junction-to-Ambient
to Ambient (MOSFET)a
Maximum Junction-to-Foot (Drain)
Symbol
t v 10 sec
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
34
41
67
80
15
19
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71699
S-03662—Rev. B, 14-Apr-03
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1
Si4866DY
New Product
Vishay Siliconix
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
VGS(th)
VDS = VGS, ID = 250 mA
0.6
IGSS
VDS = 0 V, VGS = "8 V
"100
VDS = 9.6 V, VGS = 0 V
1
VDS = 9.6 V, VGS = 0 V, TJ = 70_C
5
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS w 5 V, VGS = 4.5 V
rDS(on)
Forward Transconductancea
Diode Forward Voltagea
V
nA
mA
40
A
VGS = 4.5 V, ID = 17
0.0045
0.0055
VGS = 2.5 V, ID = 14
0.0065
0.008
gfs
VDS = 6 V, ID = 17
80
VSD
IS = 2.7 A, VGS = 0 V
0.70
1.1
21
30
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
RG
Turn-On Delay Time
nC
4.6
3.5
2.3
3.9
td(on)
28
42
tr
32
48
82
123
35
53
60
90
Rise Time
Turn-Off Delay Time
VDS = 6 V, VGS = 4.5 V, ID = 17 A
1.5
VDD = 6 V, RL = 6 W
ID ^ 1 A, VGEN = 4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = 2.7 A, di/dt = 100 A/ms
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
50
50
VGS = 10 thru 2.5 V
40
2V
I D - Drain Current (A)
I D - Drain Current (A)
40
30
20
10
30
20
TC = 125_C
10
25_C
-55_C
1.5 V
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
VGS - Gate-to-Source Voltage (V)
Document Number: 71699
S-03662—Rev. B, 14-Apr-03
Si4866DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
4000
0.012
3200
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
On-Resistance vs. Drain Current
0.015
0.009
VGS = 2.5 V
0.006
VGS = 4.5 V
Ciss
2400
Coss
1600
0.003
Crss
800
0.000
0
0
10
20
30
40
50
0
2
Gate Charge
8
10
12
On-Resistance vs. Junction Temperature
6
1.6
VDS = 6 V
ID = 17 A
5
r DS(on) - On-Resistance ( W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
6
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
4
3
2
1
0
0
5
10
15
20
25
VGS = 4.5 V
ID = 17 A
1.4
1.2
1.0
0.8
0.6
-50
30
-25
0
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.040
r DS(on) - On-Resistance ( W )
50
TJ = 150_C
10
TJ = 25_C
0.032
0.024
0.016
ID = 17 A
0.008
0.000
1
0.00
25
TJ - Junction Temperature (_C)
Qg - Total Gate Charge (nC)
I S - Source Current (A)
4
0.2
0.4
0.6
0.8
VSD - Source-to-Drain Voltage (V)
Document Number: 71699
S-03662—Rev. B, 14-Apr-03
1.0
1.2
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
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Si4866DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Single Pulse Power
Threshold Voltage
0.4
200
ID = 250 mA
160
Power (W)
V GS(th) Variance (V)
0.2
-0.0
120
-0.2
80
-0.4
40
-0.6
-50
0
-25
0
25
50
75
100
125
150
0.001
0.01
0.1
1
10
Time (sec)
TJ - Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 67_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 - 4
10 - 3
10 - 2
10 - 1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Duty Cycle = 0.5
Normalized Effective Transient
Thermal Impedance
1
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 - 4
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4
10 - 3
10 - 2
10 - 1
Square Wave Pulse Duration (sec)
1
10
Document Number: 71699
S-03662—Rev. B, 14-Apr-03