TAOS Inc. is now ams AG The technical content of this TAOS datasheet is still valid. Contact information: Headquarters: ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten, Austria Tel: +43 (0) 3136 500 0 e-Mail: [email protected] Please visit our website at www.ams.com TMD2772 DIGITAL ALS and PROXIMITY MODULE r r TAOS147E − DECEMBER 2012 Features PACKAGE MODULE−8 (TOP VIEW) D Ambient Light Sensing, Proximity Detection, and IR LED in a Single Module TMD2771 Series D Ambient Light Sensing (ALS) − Approximates Human Eye Response − Programmable Analog Gain and Integration Time − 8,000,000:1 Dynamic Range − Very High Sensitivity — Ideally Suited for Operation Behind Dark Glass Reduced Proximity Count Variation * Programmable Offset * Saturation Indicator * Current Sink Driver for IR LED 16,000:1 Dynamic Range Maskable ALS and Proximity Interrupt − Programmable Upper and Lower Thresholds with Persistence Filter Power Management − Low Power 2.2 mA Sleep State with UserSelectable Sleep-After-Interrupt Mode − 90 mA Wait State with Programmable Wait Time from 2.7 ms to > 8 seconds I2C Fast Mode Compatible Interface − Data Rates up to 400 kbit/s − Input Voltage Levels Compatible with VDD or 1.8-V Bus 3.94 mm 2.36 mm 1.35 mm Package D D D D SCL 2 7 INT GND 3 6 LDR LEDA 4 5 LEDK Package Drawing is Not to Scale Applications D D D D D D Display Backlight Control Cell Phone Touch Screen Disable Mechanical Switch Replacement Industrial Process Control Medical Diagnostics Printer Paper Alignment am lc s on A te G nt st il − − − − − 8 SDA lv D Proximity Detection VDD 1 al id D Register Set- and Pin-Compatible with the Description D D D D D D Monitors, and PMP (Portable Media Players) Medical and Industrial Instrumentation White Goods Toys Industrial/Commercial Lighting Digital Signage Printers ca * New or improved feature End Products and Market Segments D Mobile Handsets, Tablets, Laptops, HDTVs, Te ch ni The TMD2772 family of devices provides digital ambient light sensing (ALS), a complete proximity detection system, and digital interface logic in a single 8-pin surface mount module. The devices are register-set and pin-compatible with the TMD2771 family of devices and include new and improved ALS and proximity detection features. The ALS enhancements include a reduced-gain mode that extends the operating range in sunlight. Proximity detection includes improved signal-to-noise performance and more accurate factory calibration. A proximity offset register allows compensation for optical system crosstalk between the IR LED and the sensor. To prevent false proximity data measurement readings, a proximity saturation indicator bit signals that the internal analog circuitry has reached saturation. The TMD2772 ALS is based on the TAOS patented dual-diode technology that enables accurate results and approximates human eye response to light intensity under a variety of lighting conditions. The proximity detection system includes an LED driver and an IR LED, which are factory trimmed to eliminate the need for end-equipment calibration due to component variations. The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r Texas Advanced Optoelectronic Solutions Inc. 1001 Klein Road S Suite 300 S Plano, TX 75074 S (972) r 673-0759 www.taosinc.com 1 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Functional Block Diagram VDD Interrupt IR LED Constant Current Sink Prox Control Prox Integration Prox ADC INT Upper Limit Prox Data Lower Limit SCL Upper Limit CH0 ADC CH0 Data LEDK ALS Control Lower Limit Channel 0 CH1 Data SDA am lc s on A te G nt st il CH1 ADC lv Wait Control I2C Interface LEDA al id LDR Channel 1 GND Detailed Description The light-to-digital device provides on-chip photodiodes, integrating amplifiers, ADCs, accumulators, clocks, buffers, comparators, a state machine, and an I2C interface. Each device combines one photodiode (CH0), which is responsive to both visible and infrared light, and a second photodiode (CH1), which is responsive primarily to infrared light. Two integrating ADCs simultaneously convert the amplified photodiode currents to a digital value providing up to 16-bits of resolution. Upon completion of the conversion cycle, the conversion result is transferred to the Ch0 and Ch1 data registers. This digital output can be read by a microprocessor where the luminance (ambient light level in lux) is derived using an empirical formula to approximate the human eye response. ni ca A fully integrated proximity detection solution is provided with an 850-nm IR LED, LED driver circuit, and proximity detection engine. An internal LED driver pin (LDR) is externally connected to the LED cathode (LEDK) to provide a controlled LED sink current. This is accomplished with a proprietary current calibration technique that accounts for all variances in silicon, optics, package, and most important, IR LED output power. This eliminates or greatly reduces the need for factory calibration that is required for most discrete proximity sensor solutions. The device is factory calibrated to achieve a proximity count reading at a specified distance with a specific number of pulses. In use, the number of proximity LED pulses can be programmed from 1 to 255 pulses, which allows different proximity distances to be achieved. Each pulse has a 16 μs period with a 7.2 μs on time. ch Communication with the device is accomplished through a fast (up to 400 kHz), two-wire I2C serial bus for easy connection to a microcontroller or embedded controller. The digital output of the device is inherently more immune to noise when compared to an analog photodiode interface. Te The device provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value is exceeded, the interrupt pin is asserted and remains asserted until cleared by the controlling firmware. The interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a light intensity or proximity value. An interrupt is generated when the value of an ALS or proximity conversion exceeds either an upper or lower threshold. In addition, a programmable interrupt persistence feature allows the user to determine how many consecutive exceeded thresholds are necessary to trigger an interrupt. Interrupt thresholds and persistence settings are configured independently for both ALS and proximity. Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 2 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Terminal Functions TERMINAL NAME NO. TYPE DESCRIPTION GND 3 Power supply ground. All voltages are referenced to GND. INT 7 O Interrupt — open drain (active low). LDR 6 O LED driver input for proximity IR LED, constant current source LED driver. LEDA 4 LEDK 5 SCL 2 I SDA 8 I/O VDD 1 LED anode. I2C serial clock input terminal — clock signal for I2C serial data. I2C serial data I/O terminal — serial data I/O for I2C . lv Supply voltage. Available Options ADDRESS 0x39 PACKAGE − LEADS Module−8 TMD27723 0x39 Module−8 0x29 Module−8 0x29 Module−8 INTERFACE DESCRIPTION ORDERING NUMBER am lc s on A te G nt st il DEVICE TMD27721 TMD27725† † al id LED cathode. Connect to LDR pin when using internal LED driver circuit. TMD27727† I2C Vbus = VDD Interface I2C TMD27721 Vbus = 1.8 V Interface TMD27723 I2C Vbus = VDD Interface I2C TMD27725 Vbus = 1.8 V Interface TMD27727 Contact TAOS for availability. Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 V Digital I/O Voltage (except LDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V Max LEDA Voltage (TA=0 to 70C, 4.4V otherwise. Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.8 V Max LDR Voltage (TA=0 to 70C, 4.4V otherwise. Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.8 V Output terminal current (except LDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1 mA to 20 mA Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 85°C ESD tolerance, human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ca † NOTES: 1. All voltages are with respect to GND. ni 2. Maximum 4.8V DC over 7 years lifetime. Maximum 5.0V spikes with up to 250s cumulative duration over 7 years lifetime. Maximum 5.5V spikes with up to 10s (=1000* 10ms) cumulative duration over 7 years lifetime. 3. Maximum voltage with LDR = off. ch Recommended Operating Conditions NOM MAX Supply voltage, VDD 2.2 3 3.6 V −3 3 % LED Supply Voltage (Max shown for TA=0 to 70C, 4.4V otherwise) 2.5 4.8 V −30 85 °C Te MIN Supply voltage accuracy, VDD total error including transients Operating free-air temperature, TA (Note 2) UNIT NOTE 2: While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated only at 25°C unless otherwise noted. The LUMENOLOGY Company Copyright www.taosinc.com 2012, TAOS Inc. 3 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Operating Characteristics, VDD = 3 V, TA = 25 C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Active — LDR pulse off VOL INT SDA output low voltage INT, I LEAK Leakage current, SDA, SCL, INT pins Sleep state — no I2C activity Leakage current, LDR pin VIH SCL SDA input high voltage SCL, VIL SCL SDA input low voltage SCL, UNIT μA 2.2 4 3 mA sink current 0 0.4 6 mA sink current 0 0.6 −5 5 μA 5 μA −5 TMD27721 0.7 VDD V 1.25 TMD27723 V 0.3 VDD TMD27721 V 0.54 TMD27723 lv I LEAK 250 al id Supply current MAX 195 90 Wait state IDD TYP PARAMETER Dark ADC count value am lc s on A te G nt st il ALS Characteristics, VDD = 3 V, TA = 25 C, AGAIN = 16 , AEN = 1 (unless otherwise noted) (Notes 1 ,2, 3) TEST CONDITIONS Ee = 0, AGAIN = 120×, ATIME = 0xDB (100 ms) ADC integration time step size CHANNEL MIN TYP MAX CH0 0 1 5 CH1 0 1 5 2.58 2.73 ATIME = 0xFF ADC number of integration steps ADC counts per step ADC count value ADC count value ms steps 0 1024 counts 0 65535 counts μW/cm2, CH0 μW/cm2, CH0 λp = 850 nm, Ee = 61.7 ATIME = 0xF6 (27 ms) (Note 3) 4000 5000 4000 5000 CH1 CH1 λp = 625 nm, ATIME = 0xF6 (27 ms) (Note 2) λp = 850 nm, ATIME = 0xF6 (27 ms) (Note 3) 6000 950 6000 0.152 0.19 0.228 0.43 0.58 0.73 λp = 625 nm, ATIME = 0xF6 (27 ms) (Note 2) CH0 107.2 CH1 20.4 λp = 850 nm, ATIME = 0xF6 (27 ms) (Note 3) CH0 81.5 CH1 47.3 7.2 8.0 8.8 AGAIN = 16× and AGL = 0 14 4 14.4 16 0 16.0 17 17.6 6 ni counts/ (μW/ cm2) 0.16 AGAIN = 8× and AGL = 0 AGAIN = 120× and AGL = 0 counts 2900 AGAIN = 1× and AGL = 1 Gain scaling, relative to 1× gain setting 2.9 256 ATIME = 0xC0 ca Irradiance responsivity counts ATIME = 0xFF λp = 625 nm, Ee = 46.8 ATIME = 0xF6 (27 ms) (Note 2) ADC count value ratio: CH1/CH0 Re 1 UNIT 108 120 × 132 Te ch NOTES: 1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Red 625 nm and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production. 2. The 625 nm irradiance Ee is supplied by an AlInGaP light-emitting diode with the following typical characteristics: peak wavelength λp = 625 nm and spectral halfwidth Δλ½ = 20 nm. 3. The 850 nm irradiance Ee is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength λp = 850 nm and spectral halfwidth Δλ½ = 42 nm. Copyright 4 The LUMENOLOGY 2012, TAOS Inc. www.taosinc.com Company TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Proximity Characteristics, VDD = VLEDA = 3 V, TA = 25C, PEN = 1 (unless otherwise noted) PARAMETER Supply current MIN LED On TYP MAX 3 LED On, PDRIVE = 0 100 LED On, PDRIVE = 1 50 LED On, PDRIVE = 2 25 ILEDA LEDA current (Note 1) PTIME ADC conversion steps PTIME ADC conversion time PTIME = 0xFF ( = 1 conversion step) 2.58 PTIME ADC counts per step PTIME = 0xFF ( = 1 conversion step) 0 PPULSE LED pulses (Note 5) LED On LED pulse width PPULSE = 1, PDRIVE = 0 LED pulse period PPULSE = 2, PDRIVE = 0 Proximity response, no target (offset) PPULSE = 8, PDRIVE = 0, PGAIN = 4×, (Note 2) Prox count, 100-mm target (Note 3) 73 mm × 83 mm, 90% reflective Kodak Gray Card, PGAIN = 4×, PPULSE = 8, PDRIVE = 0, PTIME = 0xFF (Note 4) LED On, PDRIVE = 3 UNIT mA mA 12.5 1 2.73 2.9 ms counts 255 pulses 7.3 μs 16.0 μs 100 counts am lc s on A te G nt st il 450 steps 1023 lv 0 256 al id IDD TEST CONDITIONS 520 590 counts NOTES: 1. Value is factory-adjusted to meet the Prox count specification. Considerable variation (relative to the typical value) is possible after adjustment. 2. Proximity offset varies with power supply characteristics and noise. 3. ILEDA is factory calibrated to achieve this specification. Offset and crosstalk directly sum with this value and is system dependent. 4. No glass or aperture above the module. Tested value is the average of 5 consecutive readings. 5. These parameters are ensured by design and characterization and are not 100% tested. 6. Proximity test was done using the following circuit. See the Application Information: Hardware section for recommended application circuit. VDD VDD 4 1 TMD2772 1 mF 3 6 ca GND 5 LEDA LEDK LDR 1 mF 22 mF IR LED Characteristics, VDD = 3 V, TA = 25C PARAMETER TEST CONDITIONS MIN Forward Voltage VR Reverse Voltage IR = 10 μA 5 PO Radiant Power IF = 20 mA 4.5 Δλ TR IF = 20 mA TYP MAX 1.4 1.5 UNIT V V mW Peak Wavelength IF = 20 mA 850 Spectral Radiation Bandwidth IF = 20 mA 40 Optical Rise Time IF = 100 mA, TW = 125 ns, duty cycle = 25% 20 40 ns Optical Fall Time IF = 100 mA, TW = 125 ns, duty cycle = 25% 20 40 ns Te TF ch λp ni VF The LUMENOLOGY r Company nm nm Copyright E 2012, TAOS Inc. r r www.taosinc.com 5 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Wait Characteristics, VDD = 3 V, TA = 25C, WEN = 1 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Wait steps TYP 1 Wait time WTIME = 0xFF (= 1 wait step) 2.73 MAX UNIT 256 steps 2.9 ms AC Electrical Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted) (I2C TEST CONDITIONS MIN UNIT 400 kHz Clock frequency t(BUF) Bus free time between start and stop condition 1.3 t(HDSTA) Hold time after (repeated) start condition. After this period, the first clock is generated. 0.6 t(SUSTA) Repeated start condition setup time 0.6 t(SUSTO) Stop condition setup time 0.6 μs t(HDDAT) Data hold time 0 μs t(SUDAT) Data setup time 100 ns t(LOW) SCL clock low period 1.3 μs t(HIGH) SCL clock high period 0.6 μs tF Clock/data fall time tR Clock/data rise time Ci Input pin capacitance μs μs μs am lc s on A te G nt st il lv 0 MAX f(SCL) 300 ns 300 ns 10 pF Specified by design and characterization; not production tested. Te ch ni ca † only) TYP al id PARAMETER† Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 6 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 PARAMETER MEASUREMENT INFORMATION t(LOW) t(R) t(F) VIH SCL VIL t(HDSTA) t(BUF) t(HIGH) t(SUSTA) t(HDDAT) t(SUSTO) t(SUDAT) al id VIH SDA VIL P Stop Condition S S Start Condition P am lc s on A te G nt st il lv Figure 1. Timing Diagrams TYPICAL CHARACTERISTICS NORMALIZED RESPONSIVITY vs. ANGULAR DISPLACEMENT SPECTRAL RESPONSIVITY 100% 1 Normalized Response (%) 0.6 0.4 0.2 Ch 1 ni 0 300 400 500 600 700 800 80% Green LED Both Axes 70% 60% 50% 40% 30% 20% ca Normalized Responsivity 0.8 90% Ch 0 10% 0% 900 1000 1100 λ − Wavelength − nm 0 15 30 45 60 Angle of incident light (degrees) 75 90 Figure 3 Te ch Figure 2 -90 -75 -60 -45 -30 -15 The LUMENOLOGY Company Copyright www.taosinc.com 2012, TAOS Inc. 7 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 TYPICAL CHARACTERISTICS TYPICAL LDR CURRENT vs. VOLTAGE 110% PDRIVE = 00 LDR Current — mA 120 100 80 PDRIVE = 01 60 40 20 PDRIVE = 11 0 0.5 1 106% 104% 0C 102% 100% 50C 25C 75C 98% 96% am lc s on A te G nt st il PDRIVE = 10 108% al id 140 lv IDD — Active Current Normalized @ 3 V, 25C 160 0 NORMALIZED IDD vs. VDD and TEMPERATURE 1.5 2 2.5 3 94% 92% 2.7 2.8 2.9 LDR Voltage − V 3 3.1 3.2 3.3 VDD — V Figure 5 Te ch ni ca Figure 4 Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 8 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 PRINCIPLES OF OPERATION System State Machine An internal state machine provides system control of the ALS, proximity detection, and power management features of the device. At power up, an internal power-on-reset initializes the device and puts it in a low-power Sleep state. al id When a start condition is detected on the I2C bus, the device transitions to the Idle state where it checks the Enable register (0x00) PON bit. If PON is disabled, the device will return to the Sleep state to save power. Otherwise, the device will remain in the Idle state until a proximity or ALS function is enabled. Once enabled, the device will execute the Prox, Wait, and ALS states in sequence as indicated in Figure 5. Upon completion and return to Idle, the device will automatically begin a new prox−wait−ALS cycle as long as PON and either PEN or AEN remain enabled. am lc s on A te G nt st il lv If the Prox or ALS function generates an interrupt and the Sleep-After-Interrupt (SAI) feature is enabled, the device will transition to the Sleep state and remain in a low-power mode until an I2C command is received. See the Interrupts section for additional information. Sleep I2C Start !PON Idle INT & SAI INT & SAI PEN !PEN & !WEN & AEN !WEN & !AEN Prox ca !WEN & AEN ni WEN !PEN & WEN & AEN !AEN ALS Wait AEN Figure 6. Simplified State Diagram ch Photodiodes Conventional ALS detectors respond strongly to infrared light, which the human eye does not see. This can lead to significant error when the infrared content of the ambient light is high (such as with incandescent lighting). Te This problem is overcome through the use of two photodiodes. The Channel 0 photodiode, referred to as the CH0 channel, is sensitive to both visible and infrared light, while the Channel 1 photodiode, referred to as CH1, is sensitive primarily to infrared light. Two integrating ADCs convert the photodiode currents to digital outputs. The ADC digital outputs from the two channels are used in a formula to obtain a value that approximates the human eye response in units of lux. The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 9 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 ALS Operation ATIME(r 1) 2.73 ms to 699 ms CH0 ALS CH0 Data C0DATAH(r0x15), C0DATA(r0x14) ALS Control CH1 Data C1DATAH(r0x17), C1DATA(r0x16) am lc s on A te G nt st il CH1 ADC lv CH0 al id The ALS engine contains ALS gain control (AGAIN) and two integrating analog-to-digital converters (ADC), one for the CH0 and one for the CH1 photodiodes. The ALS integration time (ATIME) impacts both the resolution and the sensitivity of the ALS reading. Integration of both channels occurs simultaneously and upon completion of the conversion cycle, the results are transferred to the data registers (C0DATA and C1DATA). This data is also referred to as channel count. The transfers are double-buffered to ensure data integrity. CH1 AGAIN(r0x0F, b1:0) 1, 8, 16, 120 Gain Figure 7. ALS Operation The registers for programming the integration and wait times are a 2’s compliment values. The actual time can be calculated as follows: ATIME = 256 − Integration Time / 2.73 ms Inversely, the time can be calculated from the register value as follows: Integration Time = 2.73 ms × (256 − ATIME) In order to reject 50/60-Hz ripple strongly present in fluorescent lighting, the integration time needs to be programmed in multiples of 10 / 8.3 ms or the half cycle time. Both frequencies can be rejected with a programmed value of 50 ms (ATIME = 0xED) or multiples of 50 ms (i.e. 100, 150, 200, 400, 600). The registers for programming the AGAIN hold a two-bit value representing a gain of 1×, 8×, 16×, or 120×. The gain, in terms of amount of gain, will be represented by the value AGAINx, i.e. AGAINx = 1, 8, 16, or 120. With the AGL bit set, the gains will be lowered to 1/6, 8/6, 16/6, and 20×, allowing for up to 60k lux. ca Lux Equation ch ni The lux calculation is a function of CH0 channel count (C0DATA), CH1 channel count (C1DATA), ALS gain (AGAINx), and ALS integration time in milliseconds (ATIME_ms). If an aperture, glass/plastic, or a light pipe attenuates the light equally across the spectrum (300 nm to 1100 nm), then a scaling factor referred to as glass attenuation (GA) can be used to compensate for attenuation. For a device in open air with no aperture or glass/plastic above the device, GA = 1. If it is not spectrally flat, then a custom lux equation with new coefficients should be generated. (See TAOS application note). Te Counts per Lux (CPL) needs to be calculated only when ATIME or AGAIN is changed, otherwise it remains a constant. The first segment of the equation (Lux1) covers fluorescent and incandescent light. The second segment (Lux2) covers dimmed incandescent light. The final lux is the maximum of Lux1, Lux2, or 0. CPL = (ATIME_ms × AGAINx) / 20 Lux1 = (C0DATA − 1.75 × C1DATA) / CPL Lux2 = (0.63 × C0DATA − 1.00 × C1DATA) / CPL Lux = MAX(Lux1, Lux2, 0) Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 10 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Proximity Detection Proximity detection is accomplished by measuring the amount of IR energy, from the internal IR LED, reflected off an object to determine its distance. The internal proximity IR LED is driven by the integrated proximity LED current driver as shown in Figure 8. IR LED PDL(r0x0D,b0) PPULSE(r0x0E) PDRIVE(r0x0F, b7:6) LEDK PGAIN(r0x0F, b3:2) POFFSET(r0x1E) PTIME(r0x02) Prox LED Current Driver LDR PVALID(r0x13, b1) PSAT(r0x13, b6) Prox Control Prox Data PDATAH(r0x019) PDATAL(r0x018) am lc s on A te G nt st il Prox ADC lv Prox Integration PDIODE(r0x0F, b5:4) Object al id LEDA CH1 CH0 Background Energy Figure 8. Proximity Detection The LED current driver, output on the LDR terminal, provides a regulated current sink that eliminates the need for an external current limiting resistor. The combination of proximity LED drive strength (PDRIVE) and proximity drive level (PDL) determine the drive current. PDRIVE sets the drive current to 116 mA, 58 mA, 29 mA, or 14.5 mA when PDL is not asserted. However, when PDL is asserted, the drive current is reduced by a factor of 9. Referring to the Detailed State Machine figure, the LED current driver pulses the IR LED as shown in Figure 9 during the Prox Accum state. Figure 9 also illustrates that the LED On pulse has a fixed width of 7.3 μs and period of 16.0 μs. So, in addition to setting the proximity drive current, 1 to 255 proximity pulses (PPULSE) can be programmed. When deciding on the number of proximity pulses, keep in mind that the signal increases proportionally to PPULSE, while noise increases by the square root of PPULSE. ni ca Reflected IR LED + Background Energy LED On Background Energy LED Off 7.3 ms Te ch 16.0 ms The LUMENOLOGY r Company IR LED Pulses Figure 9. Proximity LED Current Driver Waveform Copyright E 2012, TAOS Inc. r r www.taosinc.com 11 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Figure 8 illustrates light rays emitting from the internal IR LED, reflecting off an object, and being absorbed by the CH0 and CH1 photodiodes. The proximity diode selector (PDIODE) determines which of the two photodiodes is used for a given proximity measurement. Note that neither photodiode is selected when the device first powers up, so PDIODE must be set for proximity detection to work. al id Referring again to Figure 9, the reflected IR LED and the background energy is integrated during the LED On time, then during the LED Off time, the integrated background energy is subtracted from the LED On time energy, leaving the IR LED energy to accumulate from pulse to pulse. The proximity gain (PGAIN) determines the integration rate, which can be programmed to 1×, 2×, 4×, or 8× gain. At power up, PGAIN defaults to 1× gain, which is recommended for most applications. For reference, PGAIN equal to 8× is comparable to the TMD2771’s 1× gain setting. During LED On time integration, the proximity saturation bit in the Status register (0x13) will be set if the integrator saturates. This condition can occur if the proximity gain is set too high for the lighting conditions, such as in the presence of bright sunlight. Once asserted, PSAT will remain set until a special function proximity interrupt clear command is received from the host (see command register). am lc s on A te G nt st il lv After the programmed number of proximity pulses have been generated, the proximity ADC converts and scales the proximity measurement to a 16-bit value, then stores the result in two 8-bit proximity data (PDATAx) registers. ADC scaling is controlled by the proximity ADC conversion time (PTIME) which is programmable from 1 to 256 2.73-ms time units. However, depending on the application, scaling the proximity data will equally scale any accumulated noise. Therefore, in general, it is recommended to leave PTIME at the default value of one 2.73-ms ADC conversion time (0xFF). In many practical proximity applications, a number of optical system and environmental conditions can produce an offset in the proximity measurement result. To counter these effects, a proximity offset (POFFSET) is provided which allows the proximity data to be shifted positive or negative. Additional information on the use of the proximity offset feature is provided in available TAOS application notes. Once the first proximity cycle has completed, the proximity valid (PVALID) bit in the Status register will be set and remain set until the proximity detection function is disabled (PEN). Te ch ni ca For additional information on using the proximity detection function behind glass and for optical system design guidance, please see available TAOS application notes. Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 12 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Interrupts The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for light intensity or proximity values outside of a user-defined range. While the interrupt function is always enabled and its status is available in the status register (0x13), the output of the interrupt state can be enabled using the proximity interrupt enable (PIEN) or ALS interrupt enable (AIEN) fields in the enable register (0x00). al id Four 16-bit interrupt threshold registers allow the user to set limits below and above a desired light level and proximity range. An interrupt can be generated when the ALS CH0 data (C0DATA) falls outside of the desired light level range, as determined by the values in the ALS interrupt low threshold registers (AILTx) and ALS interrupt high threshold registers (AIHTx). Likewise, an out-of-range proximity interrupt can be generated when the proximity data (PDATA) falls below the proximity interrupt low threshold (PILTx) or exceeds the proximity interrupt high threshold (PIHTx). lv It is important to note that the thresholds are evaluated in sequence, first the low threshold, then the high threshold. As a result, if the low threshold is set above the high threshold, the high threshold is ignored and only the low threshold is evaluated. am lc s on A te G nt st il To further control when an interrupt occurs, the device provides a persistence filter. The persistence filter allows the user to specify the number of consecutive out-of-range ALS or proximity occurrences before an interrupt is generated. The persistence filter register (0x0C) allows the user to set the ALS persistence filter (APERS) and the proximity persistence filter (PPERS) values. See the persistence filter register for details on the persistence filter values. Once the persistence filter generates an interrupt, it will continue until a special function interrupt clear command is received (see command register). Prox Integration Prox ADC PIHTH(r0x0B), PIHTL(r0x0A) PPERS(r0x0C, b7:4) Upper Limit Prox Persistence Prox Data Lower Limit PILTH(r09), PILTL(r08) CH1 AIHTH(r07), AIHTL(r06) Upper Limit ALS Persistence CH0 Data ca CH0 ADC APERS(r0x0C, b3:0) Lower Limit AILTH(r05), AILTL(r04) Figure 10. Programmable Interrupt Te ch ni CH0 The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 13 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 System State Machine Timing The system state machine shown in Figure 5 provides an overview of the states and state transitions that provide system control of the device. This section highlights the programmable features, which affect the state machine cycle time, and provides details to determine system level timing. al id When the proximity detection feature is enabled (PEN), the state machine transitions through the Prox Init, Prox Accum, Prox Wait, and Prox ADC states. The Prox Init and Prox Wait times are a fixed 2.73 ms, whereas the Prox Accum time is determined by the number of proximity LED pulses (PPULSE) and the Prox ADC time is determined by the integration time (PTIME). The formulas to determine the Prox Accum and Prox ADC times are given in the associated boxes in Figure 10. If an interrupt is generated as a result of the proximity cycle, it will be asserted at the end of the Prox ADC state and transition to the Sleep state if SAI is enabled. lv When the power management feature is enabled (WEN), the state machine will transition in turn to the Wait state. The wait time is determined by WLONG, which extends normal operation by 12× when asserted, and WTIME. The formula to determine the wait time is given in the box associated with the Wait state in Figure 9. am lc s on A te G nt st il When the ALS feature is enabled (AEN), the state machine will transition through the ALS Init and ALS ADC states. The ALS Init state takes 2.73 ms, while the ALS ADC time is dependent on the integration time (ATIME). The formula to determine ALS ADC time is given in the associated box in Figure 9. If an interrupt is generated as a result of the ALS cycle, it will be asserted at the end of the ALS ADC state and transition to the Sleep state if SAI is enabled. Prox Time: 2.73 ms Sleep Prox Init !PON PEN I2C Start INT & SAI PPULSE: 0 ~ 255 pulses Time: 16.0 μs/pulse Range: 0 ~ 4.1 ms Time: 2.73 ms Prox Accum ALS Idle INT & SAI ALS ADC !WEN & !AEN Prox Wait !AEN !PEN & !WEN & AEN !PEN & WEN & AEN ca ALS Init ch Time: 2.73 ms !WEN & AEN Prox ADC ni PTIME: 1 ~ 256 steps Time: 2.73 ms/step Range: 2.73 ms ~ 699 ms ATIME: 1 ~ 256 steps Time: 2.73 ms/step Range: 2.73 ms ~ 699 ms AEN WEN Wait Time: Range: WTIME: 1 ~ 256 steps WLONG = 0 WLONG = 1 2.73 ms/step 32.8 ms/step 2.73 ms ~ 699 ms 32.8 ms ~ 8.39s Te Note: PON, PEN, WEN, AEN, and SAI are fields in the Enable register (0x00). Copyright E 2012, TAOS Inc. Figure 11. Detailed State Diagram The LUMENOLOGY r Company r r 14 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Power Management Power consumption can be managed with the Wait state, because the Wait state typically consumes only 90 μA of IDD current. An example of the power management feature is given below. With the assumptions provided in the example, average IDD is estimated to be 176 μA. Table 1. Power Management PROGRAMMABLE PARAMETER PROGRAMMED VALUE DURATION PPULSE 0x04 0.064 ms Prox Init 2.73 ms Prox Accum Prox Accum − LED On 0.029 ms (Note 1) Prox Accum − LED OFF 0.035 ms (Note 2) 2.73 ms Prox ADC ALS Init ALS ADC 0xFF WTIME 0xEE WLONG 0 103 mA 0.195 mA 0.195 mA 2.73 ms 0.195 mA 49 2 ms 49.2 0 090 mA 0.090 am lc s on A te G nt st il Wait PTIME 0.195 mA lv Prox Wait TYPICAL CURRENT al id SYSTEM STATE MACHINE STATE ATIME 0xEE 2.73 ms 0.195 mA 49.2 ms 0195 mA NOTES: 1. Prox Accum − LED On time = 7.3 μs per pulse × 4 pulses = 29.3μs = 0.029 ms 2. Prox Accum − LED Off time = 8.7 μs per pulse × 4 pulses = 34.7μs = 0.035 ms Average IDD Current = ((0.029 × 103) + (0.035 x 0.195) + (2.73 × 0.195) + (49.2 × 0.090) + (49.2 × 0.195) + (2.73 × 0.195 × 3)) / 109 176 μA Keeping with the same programmed values as the example, Table 2 shows how the average IDD current is affected by the Wait state time, which is determined by WEN, WTIME, and WLONG. Note that the worst-case current occurs when the Wait state is not enabled. Table 2. Average IDD Current 0 1 1 1 WLONG WAIT STATE AVERAGE IDD CURRENT n/a n/a 0 ms 245 μA 0xFF 0 2.73 ms 238 μA 0xEE 0 49.2 ms 175 μA 0x00 0 699 ms 102 μA 0x00 1 8389 ms 91 μA Te ch ni 1 WTIME ca WEN The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 15 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 I2C Protocol Interface and control are accomplished through an I2C serial compatible interface (standard or fast mode) to a set of registers that provide access to device control functions and output data. The devices support the 7-bit I2C addressing protocol. al id The I2C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 13). During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the register address from the previous command will be used for data access. Likewise, if the MSB of the command is not set, the device will write a series of bytes at the address stored in the last valid command with a register address. The command byte contains either control information or a 5-bit register address. The control commands can also be used to clear interrupts. ... Acknowledge (0) Not Acknowledged (1) Stop Condition Read (1) Start Condition Repeated Start Condition Write (0) Continuation of protocol Master-to-Slave Slave-to-Master 1 am lc s on A te G nt st il A N P R S Sr W lv The I2C bus protocol was developed by Philips (now NXP). For a complete description of the I2C protocol, please review the NXP I2C design specification at http://www.i2c−bus.org/references/. 7 S 1 Slave Address W 1 8 A 1 Command Code 8 A 1 Data Byte A 8 1 1 ... P I2C Write Protocol 1 7 S 1 Slave Address R 1 8 A 1 Data A Data 1 ... A P I2C Read Protocol 1 S Slave Address W 1 8 1 1 7 1 1 Command Code A Sr Slave Address R A ca 7 A 8 1 Data A 8 Data 1 A 1 ... P I2C Read Protocol — Combined Format Figure 12. I2C Protocols Te ch ni 1 Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 16 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E− DECEMBER 2012 Register Set The device is controlled and monitored by data registers and a command register accessed through the serial interface. These registers provide for a variety of control functions and can be read to determine results of the ADC conversions. The register set is summarized in Table 1. Table 3. Register Address ADDRESS RESISTER NAME R/W −− COMMAND W REGISTER FUNCTION 0x00 ENABLE R/W Enables states and interrupts 0x01 ATIME R/W ALS time 0x02 PTIME R/W Proximity time 0x03 WTIME R/W Wait time 0x04 AILTL R/W ALS interrupt low threshold low byte 0x05 AILTH R/W ALS interrupt low threshold high byte 0x06 AIHTL R/W ALS interrupt high threshold low byte 0x07 AIHTH R/W ALS interrupt high threshold high byte 0x08 PILTL R/W Proximity interrupt low threshold low byte 0x00 RESET VALUE 0x00 al id Specifies register address 0x00 0xFF 0xFF 0xFF lv 0x00 0x00 am lc s on A te G nt st il 0x00 0x00 0x09 PILTH R/W Proximity interrupt low threshold high byte 0x00 0x0A PIHTL R/W Proximity interrupt high threshold low byte 0x00 0x0B PIHTH R/W Proximity interrupt high threshold high byte 0x00 0x0C PERS R/W Interrupt persistence filters 0x00 0x0D CONFIG R/W Configuration 0x00 0x0E PPULSE R/W Proximity pulse count 0x00 0x0F CONTROL R/W Control register 0x00 0x11 REVISION R Die revision number 0x12 ID R Device ID 0x13 STATUS R Device status 0x00 0x14 C0DATA R CH0 ADC low data register 0x00 0x15 C0DATAH R CH0 ADC high data register 0x00 0x16 C1DATA R CH1 ADC low data register 0x00 0x17 C1DATAH R CH1 ADC high data register 0x00 0x18 PDATAL R Proximity ADC low data register 0x00 Proximity ADC high data register 0x00 Proximity offset register 0x00 PDATAH R POFFSET R/W ID ni ca 0x19 0x1E Rev Num. Te ch The mechanics of accessing a specific register depends on the specific protocol used. See the section on I2C protocols on the previous pages. In general, the COMMAND register is written first to specify the specific control/status register for following read/write operations. The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 17 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Command Register The command registers specifies the address of the target register for future write and read operations. Table 4. Command Register COMMAND FIELD BITS COMMAND 7 TYPE 6:5 4 3 TYPE 2 1 0 Reset 0x00 ADD DESCRIPTION Select Command Register. Must write as 1 when addressing COMMAND register. Selects type of transaction to follow in subsequent data transfers: FIELD VALUE DESCRIPTION 00 Repeated byte protocol transaction 01 Auto-increment protocol transaction 10 Reserved — Do not use 11 Special function — See description below lv COMMAND 5 al id 6 am lc s on A te G nt st il 7 Transaction type 00 will repeatedly read the same register with each data access. Transaction type 01 will provide an auto-increment function to read successive register bytes. ADD 4:0 Address field/special function field. Depending on the transaction type, see above, this field either specifies a special function command or selects the specific control-status-register for following write and read transactions. The field values listed below apply only to special function commands: FIELD VALUE DESCRIPTION 00000 Normal — no action 00101 Proximity interrupt clear 00110 ALS interrupt clear 00111 Proximity and ALS interrupt clear other Reserved — Do not write Te ch ni ca ALS/Proximity Interrupt Clear clears any pending ALS/Proximity interrupt. This special function is self clearing. Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 18 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Enable Register (0x00) The ENABLE register is used to power the device on/off, enable functions, and interrupts. Table 5. Enable Register 6 5 4 3 2 1 0 Reserved SAI PIEN Resv AIEN WEN PEN AEN PON Reset 0x00 al id ENABLE 7 BITS DESCRIPTION Reserved 7 Reserved. Write as 0. SAI 6 Sleep after interrupt. When asserted, the device will power down at the end of a proximity or ALS cycle if an interrupt has been generated. PIEN 5 Proximity interrupt mask. When asserted, permits proximity interrupts to be generated. AIEN 4 ALS interrupt mask. When asserted, permits ALS interrupts to be generated. WEN 3 Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the wait timer. PEN 2 Proximity enable. This bit activates the proximity function. Writing a 1 enables proximity. Writing a 0 disables proximity. AEN 1 PON 0 am lc s on A te G nt st il lv FIELD ALS Enable. This bit actives the two channel ADC. Writing a 1 activates the ALS. Writing a 0 disables the ALS. Te ch ni ca Power ON. This bit activates the internal oscillator to permit the timers and ADC channels to operate. Writing a 1 activates the oscillator. Writing a 0 disables the oscillator. The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 19 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 ALS Time Register (0x01) The ALS time register controls the internal integration time of the ALS channel ADCs in 2.73 ms increments. Upon power up, the ALS time register is set to 0xFF. Table 6. ALS Integration Time Register 7:0 DESCRIPTION VALUE INTEG_CYCLES TIME 0xFF 1 2.73 ms 0xF6 10 27.3 ms 0xDB 37 101 ms 0xC0 64 175 ms 0x00 256 699 ms MAX COUNT al id BITS 1024 10240 37888 65535 65535 lv FIELD ATIME Proximity Time Register (0x02) am lc s on A te G nt st il The proximity time register controls the integration time of the proximity ADC in 2.73 ms increments. Upon power up, the proximity time register is set to 0xFF. It is recommended that this register be programmed to a value of 0xFF (1 integration cycle). Table 7. Proximity Integration Time Control Register FIELD BITS PTIME 7:0 DESCRIPTION VALUE INTEG_CYCLES TIME MAX COUNT 0xFF 1 2.73 ms 1023 Wait Time Register (0x03) Wait time is set 2.73 ms increments unless the WLONG bit is asserted in which case the wait times are 12× longer. WTIME is programmed as a 2’s complement number. Upon power up, the wait time register is set to 0xFF. Table 8. Wait Time Register WTIME 7:0 DESCRIPTION REGISTER VALUE WAIT TIME TIME (WLONG = 0) TIME (WLONG = 1) 0xFF 1 2.73 ms 0.033 sec 0xB6 74 202 ms 2.4 sec 0x00 256 699 ms 8.4 sec ca BITS ni FIELD Te ch NOTE: The Proximity Wait Time Register should be configured before PEN and/or AEN is/are asserted. Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 20 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 ALS Interrupt Threshold Registers (0x04 − 0x07) The ALS interrupt threshold registers provides the values to be used as the high and low trigger points for the comparison function for interrupt generation. If C0DATA crosses below the low threshold specified, or above the higher threshold, an interrupt is asserted on the interrupt pin. Table 9. ALS Interrupt Threshold Registers BITS 0x04 7:0 ALS low threshold lower byte DESCRIPTION AILTH 0x05 7:0 ALS low threshold upper byte AIHTL 0x06 7:0 ALS high threshold lower byte AIHTH 0x07 7:0 ALS high threshold upper byte al id ADDRESS AILTL lv REGISTER Proximity Interrupt Threshold Registers (0x08 − 0x0B) am lc s on A te G nt st il The proximity interrupt threshold registers provide the values to be used as the high and low trigger points for the comparison function for interrupt generation. If the value generated by proximity channel crosses below the lower threshold specified, or above the higher threshold, an interrupt is signaled to the host processor. Table 10. Proximity Interrupt Threshold Registers ADDRESS BITS PILTL 0x08 7:0 Proximity low threshold lower byte DESCRIPTION PILTH 0x09 7:0 Proximity low threshold upper byte PIHTL 0x0A 7:0 Proximity high threshold lower byte PIHTH 0x0B 7:0 Proximity high threshold upper byte Te ch ni ca REGISTER The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 21 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Persistence Filter Register (0x0C) The persistence filter register controls the interrupt capabilities of the device. Configurable filtering is provided to allow interrupts to be generated after every ADC cycle or if the ADC cycle has produced a result that is outside of the values specified by threshold register for some specified amount of time. Separate filtering is provided for proximity and ALS functions. ALS interrupts are generated using C0DATA. 6 PERS 5 4 3 PPERS BITS 7:4 3:0 0 Reset 0x00 APERS DESCRIPTION Proximity interrupt persistence filter. Controls rate of proximity interrupt to the host processor. FIELD VALUE MEANING 0000 −−− 0001 1 INTERRUPT PERSISTENCE FUNCTION Every proximity cycle generates an interrupt 1 proximity value out of range 0010 2 2 consecutive proximity values out of range ... ... ... 1111 15 15 consecutive proximity values out of range ALS Interrupt persistence filter. Controls rate of ALS interrupt to the host processor. FIELD VALUE MEANING 0000 Every 0001 1 1 value outside of threshold range 0010 2 2 consecutive values out of range INTERRUPT PERSISTENCE FUNCTION Every ALS cycle generates an interrupt 0011 3 3 consecutive values out of range 0100 5 5 consecutive values out of range 0101 10 10 consecutive values out of range 0110 15 15 consecutive values out of range 0111 20 20 consecutive values out of range 1000 25 25 consecutive values out of range 1001 30 30 consecutive values out of range 1010 35 35 consecutive values out of range 1011 40 40 consecutive values out of range 1100 45 45 consecutive values out of range 1101 50 50 consecutive values out of range 1110 55 55 consecutive values out of range 1111 60 60 consecutive values out of range Te ch ni ca APERS 1 am lc s on A te G nt st il FIELD PPERS 2 lv 7 al id Table 11. Persistence Filter Register Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 22 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Configuration Register (0x0D) The configuration register sets the proximity LED drive level, wait long time, and ALS gain level. Table 12. Configuration Register 6 5 CONFIG 4 3 Reserved 2 1 0 AGL WLONG PDL Reset 0x00 al id 7 FIELD BITS Reserved 7:3 DESCRIPTION AGL 2 ALS gain level. When asserted, the 1× and 8× ALS gain (AGAIN) modes are scaled by 0.16. Otherwise, AGAIN is scaled by 1. Do not use with AGAIN greater than 8×. WLONG 1 Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the WTIME register. PDL 0 Proximity drive level. When asserted, the proximity LDR drive current is reduced by 9. am lc s on A te G nt st il lv Reserved. Write as 0. Proximity Pulse Count Register (0x0E) The proximity pulse count register sets the number of proximity pulses that the LDR pin will generate during the Prox Accum state. The pulses are generated at a 62.5-kHz rate. Table 13. Proximity Pulse Count Register 7 PPULSE 6 5 4 3 2 1 PPULSE BITS 7:0 Reset 0x00 DESCRIPTION Proximity Pulse Count. Specifies the number of proximity pulses to be generated. Te ch ni ca FIELD PPULSE 0 The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 23 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Control Register (0x0F) The Control register provides eight bits of miscellaneous control to the analog block. These bits typically control functions such as gain settings and/or diode selection. Table 14. Control Register 6 FIELD BITS 7:6 3:2 1:0 AGAIN DESCRIPTION LED STRENGTH — PDL = 0 Reset 0x00 LED STRENGTH — PDL = 1 00 100 mA 11.1 mA 01 50 mA 5.6 mA 10 25 mA 2.8 mA 11 12.5 mA 1.4 mA Proximity Diode Selector. DIODE SELECTION 00 Proximity uses neither diode 01 Proximity uses the CH0 diode 10 Proximity uses the CH1 diode 11 Reserved — Do not write Proximity Gain. FIELD VALUE AGAIN 0 PGAIN FIELD VALUE PGAIN 1 am lc s on A te G nt st il 5:4 2 Proximity LED Drive Strength. FIELD VALUE PDIODE 3 ResvPDIODE PDRIVE PDRIVE ((Note 1)) 4 lv CONTROL 5 al id 7 PROXIMITY GAIN VALUE 00 1× gain 01 2× gain 10 4× gain 11 8× gain ALS Gain. FIELD VALUE ALS GAIN VALUE 00 1× gain 01 8× gain 10 16× gain ca 120× gain 11 Te ch ni NOTE 1: LED STRENGTH values (italic) are nominal operating values. Specifications can be found in the Proximity Characteristics table. Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 24 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 Revision Register (0x11) The Revision register shows the silicon revision number. It is a read-only register and shows the revision level of the silicon used internally. Table 15. Revision Register 6 REVISION 5 4 3 2 Reserved 1 0 Reset Rev Num DIE_REV al id 7 BITS 7:4 Reserved DESCRIPTION Bits read as 0 DIE_REV 3:0 Die revision number Die revision number lv FIELD Reserved ID Register (0x12) am lc s on A te G nt st il The ID Register provides the value for the part number. The ID register is a read-only register. Table 16. ID Register 7 6 ID 5 4 3 2 1 0 ID FIELD BITS ID 7:0 Reset ID DESCRIPTION 0x30 = TMD27721 Part number identification 0x39 = TMD27723 Status Register (0x13) The Status Register provides the internal status of the device. This register is read only. Table 17. Status Register 7 Reserved BIT Reserved 7 PSAT PINT PSAT PINT Resv AINT 3 2 Reserved 1 0 PVALID AVALID Reset 0x00 DESCRIPTION Reserved. Bit reads as 0. 6 Proximity Saturation. Indicates that the proximity measurement saturated. 5 Proximity Interrupt. Indicates that the device is asserting a proximity interrupt. 4 ALS Interrupt. Indicates that the device is asserting an ALS interrupt. ch AINT 4 ni FIELD 5 ca STATUS 6 3:2 PVALID 1 Proximity Valid. Indicates that the proximity channel has completed an integration cycle after PEN has been asserted. 0 ALS Valid. Indicates that the ALS channels have completed an integration cycle after AEN has been asserted. Te Reserved AVALID Reserved. Bits read as 0. The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 25 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 ADC Channel Data Registers (0x14 − 0x17) ALS data is stored as two 16-bit values. To ensure the data is read correctly, a two-byte read I2C transaction should be used with auto increment protocol bits set in the command register. With this operation, when the lower byte register is read, the upper eight bits are stored in a shadow register, which is read by a subsequent read to the upper byte. The upper register will read the correct value even if additional ADC integration cycles end between the reading of the lower and upper registers. ADDRESS BITS C0DATA 0x14 7:0 ALS CH0 data low byte DESCRIPTION C0DATAH 0x15 7:0 ALS CH0 data high byte C1DATA 0x16 7:0 ALS CH1 data low byte C1DATAH 0x17 7:0 ALS CH1 data high byte lv REGISTER al id Table 18. ADC Channel Data Registers am lc s on A te G nt st il Proximity Data Registers (0x18 − 0x19) Proximity data is stored as a 16-bit value. To ensure the data is read correctly, a two-byte read I2C transaction should be utilized with auto increment protocol bits set in the command register. With this operation, when the lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent read to the upper byte. The upper register will read the correct value even if the next ADC cycle ends between the reading of the lower and upper registers. Table 19. Proximity Data Registers REGISTER ADDRESS BITS PDATAL 0x18 7:0 Proximity data low byte DESCRIPTION PDATAH 0x19 7:0 Proximity data high byte Proximity Offset Register (0x1E) ni ca The 8-bit proximity offset register provides compensation for proximity offsets caused by device variations, optical crosstalk, and other environmental factors. Proximity offset is a sign-magnitude value where the sign bit, bit 7, determines if the offset is negative (bit 7 = 0) or positive (bit 7 = 1). At power up, the register is set to 0x00. The magnitude of the offset compensation depends on the proximity gain (PGAIN), proximity LED drive strength (PDRIVE), and the number of proximity pulses (PPULSE). Because a number of environmental factors contribute to proximity offset, this register is best suited for use in an adaptive closed-loop control system. See available TAOS application notes for proximity offset register application information. ch Table 20. Proximity Offset Register 7 POFFSET 5 SIGN 4 3 SIGN 7 MAGNITUDE 6:0 Copyright E 2012, TAOS Inc. 2 1 DESCRIPTION Proximity Offset Sign. The offset sign shifts the proximity data negative when equal to 0 and positive when equal to 1. Proximity Offset Magnitude. The offset magnitude shifts the proximity data positive or negative, depending on the proximity offset sign. The actual amount of the shift depends on the proximity gain (PGAIN), proximity LED drive strength (PDRIVE), and the number of proximity pulses (PPULSE). The LUMENOLOGY r Company r r 26 0 Reset 0x00 MAGNITUDE BIT Te FIELD 6 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 APPLICATION INFORMATION: HARDWARE LED Driver Pin with Proximity Detection al id In a proximity sensing system, the included IR LED can be pulsed with more than 100 mA of rapidly switching current, therefore, a few design considerations must be kept in mind to get the best performance. The key goal is to reduce the power supply noise coupled back into the device during the LED pulses. Averaging of multiple proximity samples is recommended to reduce the proximity noise. The first recommendation is to use two power supplies; one for the device VDD and the other for the IR LED. In many systems, there is a quiet analog supply and a noisy digital supply. By connecting the quiet supply to the VDD pin and the noisy supply to the LEDA pin, the key goal can be met. Place a 1-μF low-ESR decoupling capacitor as close as possible to the VDD pin and another at the LEDA pin, and at least 10-μF of bulk capacitance to supply the 100-mA current surge. This may be distributed as two 4.7 μF capacitors. Voltage Regulator LDR RP RP am lc s on A te G nt st il 1 mF C* GND Voltage Regulator LEDK VDD lv VBUS TMD2772 RPI INT SCL LEDA 10 mF SDA 1 mF * Cap Value Per Regulator Manufacturer Recommendation Figure 13. Proximity Sensing Using Separate Power Supplies If it is not possible to provide two separate power supplies, the device can be operated from a single supply. A 22-Ω resistor in series with the VDD supply line and a 1-μF low ESR capacitor effectively filter any power supply noise. The previous capacitor placement considerations apply. VBUS Voltage Regulator 22 W LEDK VDD LDR 1 mF GND TMD2772 RP RP RPI INT SCL LEDA SDA ni ca 10 mF ch 1 mF Figure 14. Proximity Sensing Using Single Power Supply Te VBUS in the above figures refers to the I2C bus voltage which is either VDD or 1.8 V. Be sure to apply the specified I2C bus voltage shown in the Available Options table for the specific device being used. The I2C signals and the Interrupt are open-drain outputs and require pull−up resistors. The pull-up resistor (RP) value is a function of the I2C bus speed, the I2C bus voltage, and the capacitive load. The TAOS EVM running at 400 kbps, uses 1.5-kΩ resistors. A 10-kΩ pull-up resistor (RPI) can be used for the interrupt line. The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 27 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 APPLICATION INFORMATION: HARDWARE PCB Pad Layout 0.60 0.05 0.80 0.05 am lc s on A te G nt st il lv 0.72 0.05 al id Suggested PCB pad layout guidelines for the surface mount module are shown in Figure 15. Flash Gold is recommended surface finish for the landing pads. 0.25 0.05 NOTES: A. All linear dimensions are in mm. B. This drawing is subject to change without notice. Te ch ni ca Figure 15. Suggested Module PCB Layout Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 28 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 PACKAGE INFORMATION MODULE Dual Flat No-Lead TOP VIEW SIDE VIEW al id Detector 1.0 3.94 0.2 2.40 3.73 0.1 lv 0.9 LED 0.58 END VIEW am lc s on A te G nt st il 1.18 2.36 0.2 1.35 0.2 2.10 0.1 BOTTOM VIEW 0.80 ca 0.60 0.25 ch ni 0.72 0.05 Lead Free All linear dimensions are in millimeters. Dimension tolerance is ± 0.05 mm unless otherwise noted. Contacts are copper with NiPdAu plating. This package contains no lead (Pb). This drawing is subject to change without notice. Te NOTES: A. B. C. D. Pb The LUMENOLOGY r Company Figure 16. Module Packaging Configuration Copyright E 2012, TAOS Inc. r r www.taosinc.com 29 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 CARRIER TAPE AND REEL INFORMATION TOP VIEW 8.00 1.75 4.00 1.50 al id 2.00 0.05 B 5.50 0.05 B 1.00 0.05 Unit Orientation A am lc s on A te G nt st il DETAIL A A lv + 0.30 12.00 − 0.10 DETAIL B 6 Max 8 Max 0.29 0.02 2.70 Ao Bo Ko ca All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001. Each reel is 330 millimeters in diameter and contains 2500 parts. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. This drawing is subject to change without notice. ni NOTES: A. B. C. D. E. F. G. 4.30 1.70 Te ch Figure 17. Module Carrier Tape Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 30 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 SOLDERING INFORMATION The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. Table 21. Solder Reflow Profile PARAMETER REFERENCE DEVICE Average temperature gradient in preheating tsoak 2 to 3 minutes Time above 217°C (T1) t1 Max 60 sec Time above 230°C (T2) Time above Tpeak −10°C (T3) Peak temperature in reflow t2 Max 50 sec t3 Max 10 sec lv Soak time 2.5°C/sec 260°C am lc s on A te G nt st il Tpeak Temperature gradient in cooling Max −5°C/sec Not to scale — for reference only T3 T2 t3 t2 tsoak t1 Figure 18. Solder Reflow Profile Graph Te ch Time (sec) ni Temperature (C) T1 ca Tpeak al id The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 31 TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 STORAGE INFORMATION Moisture Sensitivity al id Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions: lv Shelf Life: 12 months Ambient Temperature: < 40°C Relative Humidity: < 90% Floor Life am lc s on A te G nt st il Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region. The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions: Floor Life: 168 hours Ambient Temperature: < 30°C Relative Humidity: < 60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions Te ch ni ca When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours. Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 32 www.taosinc.com TMD2772 DIGITAL ALS and PROXIMITY MODULE TAOS147E − DECEMBER 2012 PRODUCTION DATA — information in this document is current at publication date. Products conform to specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard warranty. Production processing does not necessarily include testing of all parameters. LEAD-FREE (Pb-FREE) and GREEN STATEMENT al id Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). am lc s on A te G nt st il lv Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TAOS has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. NOTICE Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems. TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ca TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK. Te ch ni LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced Optoelectronic Solutions Incorporated. The LUMENOLOGY r Company Copyright E 2012, TAOS Inc. r r www.taosinc.com 33 TMD2772 DIGITAL ALS and PROXIMITY MODULE Te ch ni ca am lc s on A te G nt st il lv al id TAOS147E − DECEMBER 2012 Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company r r 34 www.taosinc.com