Wire Wound Chip Inductors SWI0805FT Series INTRODUCTION The SWI series are wire wound chip inductors widely used in the communication applications such as cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices. The wire wound inductors advance in higher self resonate frequency, better Q factor, and much more stable performance. FEATURES Operating temperature-40 to +85°C for ferrite series. Excellent solderability and resistance to soldering heat. Suitable for reflow soldering. High reliability and easy surface mount assembly. Wide range of inductance values are available for flexible needs. PART NUMBER SWI 0805 F T 1R0 J 1 1 Product Type 2 Chip Dimension Size (inch) mm SWI 0805 2012 Length (L) (inch) mm 2 3 taping 4 5 Width (W) (inch) mm □□ 6 Thickness (T) (inch) mm Terminal (S) (inch) mm L1 (Ref.) mm W1 (Ref.) mm t1 (Ref.) mm 1.20 *0.95~1.2 0.60 (0.080 ± 0.008) (0.050 ± 0.008) (0.048 ± 0.008) (0.016 ± 0.004) 2.00 ± 0.20 1.25 ± 0.20 1.20 ± 0.20 0.40 ± 0.10 3 Material Type F : Ferrite 4 Inductance Value R47 = 0.47uH 5 Tolerance J = ±5% K = ±10% 6 Internal Code 4R7 = 4.7uH 100 = 10uH Wire Wound Chip Inductors SWI0805FT Series 1 Scope This specification applies to fixed inductors of the following types used in electronic equipment : *Ferrite Type : For higher inductance at lower frequency circuit requirement. 2 Construction *Configuration & Dimension : Please refer to the attached figures and tables. *Terminals 3 : Consist of Ag alloy followed by Nickel, then Sn platting for easier soldering. Operating Temperature Range Operating Temperature Range is the scope of ambient temperature at which the inductor can be operated continuously at rated current. *Temp. Range : Ferrite material : -40°C ~ +85°C 4 Ingredient of terminals electrode 3rd Layer Ferrite Type : 2nd Layer 1st Layer : Ag 1st Layer 2nd Layer : Nickel (Ni) Termination 3rd Layer : Tin (Sn) 5 Characteristics Standard Atmospheric Conditions Unless otherwise specified, the standard range of atmospheric conditions for making measurements and tests are as follows: Ambient Temperature : 25°C ± 2°C Relative Humidity : 60% to 70% Air Pressure : 86Kpa to 106Kpa Wire Wound Chip Inductors SWI0805FT Series Temperature Profile 1 Reflow Temperature Profile (Temperature of the mounted parts surface on the printed circuit board) Recommended Peak Temperature : 250℃ Max 250℃ up /within 10secs Max. Reflow temperature : 260°C Gradient of temperature rise : av 1-4℃/sec Preheat : 160-190℃/within 90-120secs 220℃ up /within 30-60secs Composition of solder Sn-3Ag-0.5Cu 2 Dip Temperature Solder bathtub temperature : 260℃ max within 5secs. Preheating temperature : 100～130℃ deposit solder temperature. Composition of solder Sn-3Ag-0.5Cu 3 Soldering iron tip temperature : 350°C max / within 3 seconds. Wire Wound Chip Inductors SWI0805FT Series Part No. Inductance (uH) Tolerance Q2 Min S.R.F.3 Min (MHz) RDC 4 Max (Ω) IDC 5 Max (mA) Marking 1 SWI0805FT R47 □-□□ 0.47 @ 25.2MHz K, J 45 @ 100MHz 375 0.95 500 R47 SWI0805FT R56 □-□□ 0.56 @ 25.2MHz K, J 45 @ 100MHz 340 1.10 450 R56 SWI0805FT R68 □-□□ 0.68 @ 25.2MHz K, J 35 @ 100MHz 188 1.20 400 R68 SWI0805FT R82 □-□□ 0.82 @ 25.2MHz K, J 35 @ 100MHz 215 1.50 300 R82 SWI0805FT 1R0 □-□□ 1.0 @ 25.2MHz K, J 35 @ 50MHz 200 2.13 180 1R0 SWI0805FT 1R2 □-□□ 1.2 @ 7.96MHz K, J 15 @ 7.96MHz 200 2.60 150 1R2 SWI0805FT 1R5 □-□□ 1.5 @ 7.96MHz K, J 15 @ 7.96MHz 200 2.90 130 1R5 SWI0805FT 1R8 □-□□ 1.8 @ 7.96MHz K, J 15 @ 7.96MHz 120 3.00 120 1R8 SWI0805FT 2R2 □-□□ 2.2 @ 7.96MHz K, J 15 @ 7.96MHz 110 3.10 110 2R2 SWI0805FT 2R7 □-□□ 2.7 @ 7.96MHz K, J 15 @ 7.96MHz 100 3.50 100 2R7 SWI0805FT 3R3 □-□□ 3.3 @ 7.96MHz K, J 15 @ 7.96MHz 70 2.30 210 3R3 SWI0805FT 3R9 □-□□ 3.9 @ 7.96MHz K, J 15 @ 7.96MHz 60 2.50 200 3R9 SWI0805FT 4R7 □-□□ 4.7 @ 7.96MHz K, J 15 @ 7.96MHz 50 2.80 180 4R7 SWI0805FT 5R6 □-□□ 5.6 @ 7.96MHz K, J 15 @ 7.96MHz 45 3.00 160 5R6 SWI0805FT 6R8 □-□□ 6.8 @ 7.96MHz K, J 15 @ 7.96MHz 45 3.20 130 6R8 SWI0805FT 8R2 □-□□ 8.2 @ 7.96MHz K, J 15 @ 7.96MHz 40 3.50 120 8R2 SWI0805FT 100 □-□□ 10 @ 2.52MHz K, J 15 @ 2.52MHz 40 5.00 80 100 1. Inductance is measured in HP-4287A RF LCR meter with HP-16193 fixture. 2. Q is measured in HP-4287A RF LCR meter with HP-16193 fixture. 3. SRF is measured in ENA E5071B network analyzer or equivalent. 4. RDC is measured in HP-4338B milliohmeter or equivalent. 5. For 15 °C Rise. Remarks : Unit weight = 0.0084g (for ref.) Wire Wound Chip Inductors SWI0805FT Series L vs Freq Plot 100000 100 4R7 10000 1R2 R82 1000 R47 L (nH) 100 10 1 1 10 100 1000 10000 1000 10000 Freq (MHz) Q vs Freq Plot 120 100 80 Q 60 R82 R47 1R2 40 4R7 100 20 0 1 10 100 Freq (MHz) Wire Wound Chip Inductors SWI0805FT Series ITEM Inductance and Tolerance Quality Factor Electrical Characteristics Mechanical Characteristics Insulation Resistance Dielectric Withstanding Voltage Temperature Coefficient of Inductance (TCL) Component Adhesion (Push Test) Drop Test Thermal Shock Test Solderability Resistance to Soldering Heat Vibration (Random) Cold Temperature Storage Endurance Characteristics High Temperature Storage Moisture Resistance High Temperature with Loaded CONDITION Measuring Frequency : As shown in Product Table Measuring Temperature : +25°C Measured at 100V DC between inductor terminals and center of case. Measured at 500V AC between inductor terminals and center of case for a maximum of 1 minute. Over -40°C to +85°C at frequency specified in Product Table. The component shall be reflow soldered onto a P.C. Board ( 240°C ± 5°C for 20 seconds ). Then a dynometer force gauge shall be applied to any side of the component. The inductor shall be dropped two times on the concrete floor or the vinyl tile from 1M naturally. Each cycle shall consist of 30 minutes at -40°C followed by 30 minutes at +85°C with a 5 minutes transition time between temperature extremes. Test duration is 10 cycles. Dip pads in flux and dip in solder pot containing lead free solder at 240°C ± 5°C for 5 seconds. Dip the components into flux and dip into solder pot containing lead free solder at 260°C ± 5°C for 5 ± 2 seconds. Inductors shall be randomly vibrated at amplitude of 1.5mm and frequency of 10-55Hz : 0.04G/Hz for a minimum of 15 minutes per axis for each of the three axes. Inductors shall be stored at temperature of -40°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored at temperature of 85°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored in the chamber at 45°C at 90-95 R.H. for 1000 hours. Then inductors are to be tested after 2 hours at room temperature. Inductors shall be stored in the chamber at +85°C for 1000 hours with rated current applied. Inductors shall be tested at the beginning of test at 500 hours and 1000 hours. Then inductors are to be tested after 1 hour at room temperature. SPECIFICATION Within Specified Tolerance 1000 mega ohms minimum No damage occurs when the test voltage is applied. +25 to 500 ppm/°C 6 TCL = L1 - L2 x 10 (ppm /°C) L1(T1-T2) 0402 series - 350g 0603 series - 1.0Kg Other series - 0805 ~ 1210 Minimum 1Kg for Ag termination and 2Kg for Mo/Mn termination. Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage A minimum of 80% of the metalized area must be covered with solder. Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage Inductors shall not have a shorted or open winding. Wire Wound Chip Inductors SWI0805FT Series Type Pcs/Reel SWI0805 2,000 Φ 1.50 Chip Cavity Type SWI0805 Insert Pitch T 2.0 1.75 Tape Thickness 3.50 A B F K T W 1.52 2.35 4.00 1.12 0.23 8.00 W B A F Blank Portions Chip Cavity K 4.0 Leader Top Tape Strength The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. Top Tape 0~15° 80mm min. Direction of tape feed 160mm min. Base Tape Recommended Pattern Dimensions (unit : m/m) Type A B C A SWI0805 2.60 0.75 1.30 B C