WIRE WOUND CHIP INDUCTORS SWI SERIES

Wire Wound Chip Inductors
SWI0402CT Series
INTRODUCTION
The SWI series are wire wound chip inductors widely used in the communication applications such as
cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices. The wire
wound inductors advance in higher self resonate frequency, better Q factor, and much more stable
performance. Precious tolerance of 2% is available.
FEATURES
Operating temperature -40 to +125°C for ceramic series.
Excellent solderability and resistance to soldering heat.
Suitable for reflow soldering.
High reliability and easy surface mount assembly.
Wide range of inductance values are available for flexible needs.
PART NUMBER
SWI 0402 C T 10N J 1
1
Product Type
2
Chip Dimension
Size
(inch)
mm
SWI 0402
1005
Length (L)
(inch)
mm
2
3 taping 4
Width (W)
(inch)
mm
5
□□
6
Thickness (T)
(inch)
mm
Terminal (S)
(inch)
mm
(0.039 ± 0.004) (0.022 ± 0.004) (0.020 ± 0.004) (0.008 ± 0.004)
1.00 ± 0.10 0.55 ± 0.10 0.50 ± 0.10 0.20 ± 0.10
L1
(Ref.)
mm
W1
(Ref.)
mm
t1
(Ref.)
mm
0.60
0.48
0.20
3
Material Type
C : Ceramic
4
Inductance Value
1N0 = 1.0nH
5
Tolerance
B = ±0.2nH S = ±0.3nH G = ±2% J = ±5% K = ±10%
6
Internal Code
10N = 10nH
1
R10 = 100nH
Wire Wound Chip Inductors
SWI0402CT Series
1
Scope
This specification applies to fixed inductors of the following types used in electronic
equipment :
*Ceramic Type : For lower inductance with high Q factor at high frequency and
stable circuit requirement.
2
Construction
*Configuration
& Dimension : Please refer to the attached figures and tables.
*Terminals
3
: Consist of Mo/Mn or Ag alloy followed by Nickel, then Au platting
for easier soldering.
Operating Temperature Range
Operating Temperature Range is the scope of ambient temperature at which the inductor can
be operated continuously at rated current.
*Temp. Range : Ceramic material : -40°C ~ +125°C
4
Ingredient of terminals electrode
3rd Layer
Ceramic Type :
2nd Layer
1st Layer : Mo/Mn or Ag
1st Layer
2nd Layer : Nickel (Ni)
Termination
3rd Layer : Gold (Au)
5
Characteristics
Standard Atmospheric Conditions
Unless otherwise specified, the standard range of atmospheric conditions for making
measurements and tests are as follows:
Ambient Temperature : 25°C ± 2°C
Relative Humidity
: 60% to 70%
Air Pressure
: 86Kpa to 106Kpa
2
Wire Wound Chip Inductors
SWI0402CT Series
Temperature Profile
1
Reflow Temperature Profile
(Temperature of the mounted parts surface on the printed circuit board)
Recommended Peak Temperature : 250℃ Max
250℃ up /within 10secs
Max. Reflow temperature : 260°C
Gradient of temperature rise : av 1-4℃/sec
Preheat : 160-190℃/within 90-120secs
220℃ up /within 30-60secs
Composition of solder Sn-3Ag-0.5Cu
2
Dip Temperature
Solder bathtub temperature : 260℃ max
within 5secs.
Preheating temperature : 100~130℃
deposit solder temperature.
Composition of solder Sn-3Ag-0.5Cu
3
Soldering iron tip temperature : 350°C max / within 3 seconds.
3
Wire Wound Chip Inductors
SWI0402CT Series
Q2
Part No.
Inductance
(nH)
1
Tolerance
Min
Typical
@900MHz
S.R.F.3
Min
(MHz)
RDC 4
Max
(Ω)
IDC 5
Max
(mA)
SWI0402CT 1N0 □-□□
1.0 @ 250MHz
B, S
13
26
6000
0.045
1360
SWI0402CT 1N9 □-□□
1.9 @ 250MHz
B, S
16
29
6000
0.070
1040
SWI0402CT 2N0 □-□□
2.0 @ 250MHz
B, S
16
30
6000
0.070
1040
SWI0402CT 2N2 □-□□
2.2 @ 250MHz
B, S
18
32
6000
0.070
960
SWI0402CT2N4 □-□□
2.4 @ 250MHz
B, S
16
35
6000
0.068
790
SWI0402CT 2N7 □-□□
2.7 @ 250MHz
B, S
16
31
6000
0.120
860
SWI0402CT 3N3 □-□□
3.3 @ 250MHz
K, J, B
20
41
6000
0.066
840
SWI0402CT 3N6 □-□□
3.6 @ 250MHz
K, J, B
20
43
6000
0.066
840
SWI0402CT 3N9 □-□□
3.9 @ 250MHz
K, J, B
20
41
5800
0.066
840
SWI0402CT 4N3 □-□□
4.3 @ 250MHz
K, J, B
18
45
6000
0.091
700
SWI0402CT 4N7 □-□□
4.7 @ 250MHz
K, J, B
15
45
4775
0.130
640
SWI0402CT 5N1 □-□□
5.1 @ 250MHz
K, J, B
23
49
5800
0.083
800
SWI0402CT 5N6 □-□□
5.6 @ 250MHz
K, J, B
23
46
5800
0.083
760
SWI0402CT 6N2 □-□□
6.2 @ 250MHz
K, J, B
23
49
5800
0.083
760
SWI0402CT 6N8 □-□□
6.8 @ 250MHz
K, J, B
20
50
4800
0.083
680
SWI0402CT 7N5 □-□□
7.5 @ 250MHz
K, J, B
25
50
5800
0.104
680
SWI0402CT 8N2 □-□□
8.2 @ 250MHz
K, J, B
25
49
4400
0.104
680
SWI0402CT 8N7 □-□□
8.7 @ 250MHz
K, J, B
18
50
4100
0.200
480
SWI0402CT 9N0 □-□□
9.0 @ 250MHz
K, J, B
25
49
4160
0.104
680
SWI0402CT 9N5 □-□□
9.5 @ 250MHz
K, J, B
18
45
4000
0.200
680
SWI0402CT 10N □-□□
10 @ 250MHz
K, J, G
23
47
3900
0.195
480
SWI0402CT 11N □-□□
11 @ 250MHz
K, J, G
26
56
3680
0.120
640
SWI0402CT 12N □-□□
12 @ 250MHz
K, J, G
26
51
3600
0.120
640
SWI0402CT 13N □-□□
13 @ 250MHz
K, J, G
24
54
3450
0.210
560
SWI0402CT 15N □-□□
15 @ 250MHz
K, J, G
26
54
3280
0.172
560
SWI0402CT 16N □-□□
16 @ 250MHz
K, J, G
24
54
3100
0.220
560
SWI0402CT 18N □-□□
18 @ 250MHz
K, J, G
25
52
3100
0.230
520
SWI0402CT 19N □-□□
19 @ 250MHz
K, J, G
26
50
3040
0.202
480
SWI0402CT 20N □-□□
20 @ 250MHz
K, J, G
25
51
3000
0.250
420
SWI0402CT 22N □-□□
22 @ 250MHz
K, J, G
25
52
2800
0.300
400
SWI0402CT 23N □-□□
23 @ 250MHz
K, J, G
26
53
2720
0.214
400
SWI0402CT 24N □-□□
24 @ 250MHz
K, J, G
25
51
2700
0.300
400
SWI0402CT 27N □-□□
27 @ 250MHz
K, J, G
26
48
2480
0.298
400
SWI0402CT 30N □-□□
30 @ 250MHz
K, J, G
25
46
2350
0.300
400
SWI0402CT 33N □-□□
33 @ 250MHz
K, J, G
24
48
2350
0.350
400
4
Wire Wound Chip Inductors
SWI0402CT Series
Q2
Part No.
Inductance
(nH)
1
Tolerance
Min
Typical
@900MHz
S.R.F.3
Min
(MHz)
RDC 4
Max
(Ω)
IDC 5
Max
(mA)
SWI0402CT 36N □-□□
36 @ 250MHz
K, J, G
26
48
2320
0.403
320
SWI0402CT 39N □-□□
39 @ 250MHz
K, J, G
25
45
2100
0.550
320
SWI0402CT 40N □-□□
40 @ 250MHz
K, J, G
26
48
2240
0.438
320
SWI0402CT 43N □-□□
43 @ 250MHz
K, J, G
25
46
2030
0.810
240
SWI0402CT 47N □-□□
47 @ 200MHz
K, J, G
26
46
2100
0.830
210
SWI0402CT 51N □-□□
51 @ 200MHz
K, J
25
40
1750
0.820
210
SWI0402CT 56N □-□□
56 @ 200MHz
K, J
22
42
1760
0.970
200
SWI0402CT 68N □-□□
68 @ 200MHz
K, J
22
36
1620
1.120
180
SWI0402CT 75N □-□□
75 @ 150MHz
K, J
20
34
1550
1.200
160
SWI0402CT 82N □-□□
82 @ 150MHz
K, J
20
33
1500
1.250
150
SWI0402CT 91N □-□□
91 @ 150MHz
K, J
20
30
1350
2.300
120
SWI0402CT R10 □-□□
100 @ 150MHz
K, J
20
30
1300
2.520
120
SWI0402CT R12 □-□□
120 @ 150MHz
K, J
20
29
1100
2.660
110
1. Inductance is measured in HP-4287A RF LCR
meter with HP-16193 fixture.
2. Q is measured in HP-4287A RF LCR meter with
HP-16193 fixture.
3. SRF is measured in ENA E5071B network analyzer
or equivalent.
4. RDC is measured in HP-4338B milliohmeter or
equivalent.
5. For 15 °C Rise.
Remarks :
Unit weight = 0.0008g (for ref.)
Without marking on the top surface of the product.
5
Wire Wound Chip Inductors
SWI0402CT Series
L vs Freq Plot
50
45
40
35
30
L (nH)
27N
25
20
19N
15
12N
10
5N6
5
1N0
0
1
10
100
1000
10000
Freq (MHz)
Q vs Freq Plot
100
90
80
70
50
5N6
27N
12N
19N
40
1N0
60
Q
30
20
10
0
1
10
100
Freq (MHz)
6
1000
10000
Wire Wound Chip Inductors
SWI0402CT Series
ITEM
Inductance and
Tolerance
Quality Factor
Electrical
Characteristics
Mechanical
Characteristics
Insulation
Resistance
Dielectric
Withstanding
Voltage
Temperature
Coefficient of
Inductance (TCL)
Component
Adhesion
(Push Test)
Drop Test
Thermal Shock
Test
Solderability
Resistance to
Soldering Heat
Vibration
(Random)
Cold Temperature
Storage
Endurance
Characteristics
High Temperature
Storage
Moisture
Resistance
High Temperature
with Loaded
CONDITION
Measuring Frequency :
As shown in Product Table
Measuring Temperature :
+25°C
Measured at 100V DC between
inductor terminals and center of case.
Measured at 500V AC between
inductor terminals and center of case
for a maximum of 1 minute.
Over -40°C to +85°C at
frequency specified in Product Table.
The component shall be reflow soldered onto a
P.C. Board ( 240°C ± 5°C for 20 seconds ).
Then a dynometer force gauge shall be applied
to any side of the component.
The inductor shall be dropped two times on the
concrete floor or the vinyl tile from 1M naturally.
Each cycle shall consist of 30 minutes at -40°C
followed by 30 minutes at +85°C with a 5 minutes
transition time between temperature extremes.
Test duration is 10 cycles.
Dip pads in flux and dip in solder pot containing
lead free solder at 240°C ± 5°C for 5 seconds.
Dip the components into flux and dip
into solder pot containing lead free solder
at 260°C ± 5°C for 5 ± 2 seconds.
Inductors shall be randomly vibrated at amplitude
of 1.5mm and frequency of 10-55Hz : 0.04G/Hz
for a minimum of 15 minutes per axis for each of
the three axes.
Inductors shall be stored at temperature
of -40°C ± 2°C for 1000hrs (+48 -0 hrs.)
Then inductors shall be subjected to standard
atmospheric conditions for 1 hour.
After that, measurement shall be made.
Inductors shall be stored at temperature
of 85°C ± 2°C for 1000hrs (+48 -0 hrs.)
Then inductors shall be subjected to standard
atmospheric conditions for 1 hour.
After that, measurement shall be made.
Inductors shall be stored in the chamber at 45°C
at 90-95 R.H. for 1000 hours. Then inductors are
to be tested after 2 hours at room temperature.
Inductors shall be stored in the chamber at +85°C
for 1000 hours with rated current applied.
Inductors shall be tested at the beginning of test at
500 hours and 1000 hours. Then inductors are to
be tested after 1 hour at room temperature.
7
SPECIFICATION
Within Specified Tolerance
1000 mega ohms minimum
No damage occurs when
the test voltage is applied.
+25 to 500 ppm/°C
6
TCL = L1 - L2 x 10 (ppm /°C)
L1(T1-T2)
0402 series - 350g
0603 series - 1.0Kg
Other series - 0805 ~ 1210
Minimum 1Kg for Ag termination
and 2Kg for Mo/Mn termination.
Change In Inductance:
No more than 5%
Change In Q:
No more than 10%
Change In Appearance:
Without distinct damage
A minimum of 80% of the metalized
area must be covered with solder.
Change In Inductance:
No more than 5%
Change In Q:
No more than 10%
Change In Appearance:
Without distinct damage
Inductors shall not have a
shorted or open winding.
Wire Wound Chip Inductors
SWI0402CT Series
Type
Pcs/Reel
SWI0402
10,000
Φ 1.50
Chip
Cavity
Type
SWI0402
T
2.0
1.75
Insert
Pitch
Tape Thickness
3.50
A
B
F
K
T
W
0.74
1.23
2.00
0.60
0.70
8.00
W
B
A
F
Blank
Portions
Chip Cavity
K
4.0
Leader
Top Tape Strength
The top tape requires a peel-off force of 0.2 to 0.7N
in the direction of the arrow as illustrated below.
Top Tape
0~15°
80mm min.
Direction of tape feed
160mm min.
Base Tape
Recommended Pattern
Dimensions (unit : m/m)
Type
A
B
C
A
SWI0402
1.20
0.45
0.65
B
C
8