Wire Wound Chip Inductors SWI1008HQ Series INTRODUCTION The SWI series are wire wound chip inductors widely used in the communication applications such as cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices. The wire wound inductors advance in higher self resonate frequency, better Q factor, and much more stable performance. The HQ type offer higher Q factor and the current handling has also been improved with significantly lower DCR value. Precious tolerance of 2% is available. FEATURES Operating temperature -40 to +125°C for ceramic series. Excellent solderability and resistance to soldering heat. Suitable for reflow soldering. High reliability and easy surface mount assembly. Wide range of inductance values are available for flexible needs. PART NUMBER SWI 1008 HQ 1 1 Product Type 2 Chip Dimension Size (inch) mm SWI 1008 2520 2 Length (L) (inch) mm 3 12N G 4 5 Width (W) (inch) mm (0.098 ± 0.008) (0.080 ± 0.008) 2.60 ± 0.20 2.10 ± 0.20 □□ 6 Thickness (T) (inch) mm Terminal (S) (inch) mm (0.063 ± 0.008) (0.020 ± 0.004) 1.70 ± 0.20 0.50 ± 0.10 3 Material Type HQ : High Q type 4 Inductance Value 10N = 10nH R10 = 100nH 5 Tolerance G = ±2% 6 Internal Code J = ±5% 1 K = ±10% (t1 ) (Ref.) mm 0.70 Wire Wound Chip Inductors SWI1008HQ Series 1 Scope This specification applies to fixed inductors of the following types used in electronic equipment : *HQ Type : 2 For lower inductance with high Q factor at high frequency and stable circuit requirement. Construction *Configuration & Dimension : Please refer to the attached figures and tables. *Terminals 3 : Consist of Ag alloy followed by Nickel, then Au platting for easier soldering. Operating Temperature Range Operating Temperature Range is the scope of ambient temperature at which the inductor can be operated continuously at rated current. *Temp. Range : Ceramic material : -40°C ~ +125°C 4 Ingredient of terminals electrode 3rd Layer Ceramic Type : 2nd Layer 1st Layer : Ag 1st Layer 2nd Layer : Nickel (Ni) Termination 3rd Layer : Gold (Au) 5 Characteristics Standard Atmospheric Conditions Unless otherwise specified, the standard range of atmospheric conditions for making measurements and tests are as follows: Ambient Temperature : 25°C ± 2°C Relative Humidity : 60% to 70% Air Pressure : 86Kpa to 106Kpa 2 Wire Wound Chip Inductors SWI1008HQ Series Temperature Profile 1 Reflow Temperature Profile (Temperature of the mounted parts surface on the printed circuit board) Recommended Peak Temperature : 250℃ Max 250℃ up /within 10secs Max. Reflow temperature : 260°C Gradient of temperature rise : av 1-4℃/sec Preheat : 160-190℃/within 90-120secs 220℃ up /within 30-60secs Composition of solder Sn-3Ag-0.5Cu 2 Dip Temperature Solder bathtub temperature : 260℃ max within 5secs. Preheating temperature : 100～130℃ deposit solder temperature. Composition of solder Sn-3Ag-0.5Cu 3 Soldering iron tip temperature : 350°C max / within 3 seconds. 3 Wire Wound Chip Inductors SWI1008HQ Series Part No. Inductance (nH) Tolerance Q2 Min S.R.F.3 Min (MHz) RDC 4 Max (Ω) IDC 5 Max (mA) Marking 1 SWI1008HQ 3N0 □-□□ 3.0 @ 50MHz K, J 70 @ 1500MHz 8100 0.04 1600 3N0 SWI1008HQ 7N8 □-□□ 7.8 @ 50MHz K, J 75 @ 1500MHz 3800 0.05 1600 7N8 SWI1008HQ 10N □-□□ 10 @ 50MHz K, J 60 @ 500MHz 3600 0.08 1300 10N SWI1008HQ 12N □-□□ 12 @ 50MHz K, J, G 70 @ 500MHz 2800 0.06 1500 12N SWI1008HQ 18N □-□□ 18 @ 50MHz K, J, G 62 @ 350MHz 2700 0.08 1400 18N SWI1008HQ 22N □-□□ 22 @ 50MHz K, J, G 62 @ 350MHz 2050 0.07 1400 22N SWI1008HQ 33N □-□□ 33 @ 50MHz K, J, G 75 @ 350MHz 1700 0.09 1300 33N SWI1008HQ 39N □-□□ 39 @ 50MHz K, J, G 75 @ 350MHz 1300 0.09 1300 39N SWI1008HQ 47N □-□□ 47 @ 50MHz K, J, G 75 @ 350MHz 1450 0.12 1200 47N SWI1008HQ 56N □-□□ 56 @ 50MHz K, J, G 75 @ 350MHz 1230 0.12 1200 56N SWI1008HQ 68N □-□□ 68 @ 50MHz K, J, G 80 @ 350MHz 1150 0.13 1000 68N SWI1008HQ 82N □-□□ 82 @ 50MHz K, J, G 80 @ 350MHz 1060 0.16 1000 82N SWI1008HQ R10 □-□□ 100 @ 50MHz K, J, G 62 @ 350MHz 820 0.16 1000 R10 1. Inductance is measured in HP-4287A RF LCR meter with HP-16193 fixture. 2. Q is measured in HP-4287A RF LCR meter with HP-16193 fixture. 3. SRF is measured in ENA E5071B network analyzer or equivalent. 4. RDC is measured in HP-4338B milliohmeter or equivalent. 5. For 15 °C Rise. Remarks : Unit weight = 0.025g (for ref.) 4 Wire Wound Chip Inductors SWI1008HQ Series L vs Freq Plot 10000 1000 R10 47N 22N L (nH) 100 10N 10 3N0 1 1 10 100 1000 10000 Freq (MHz) Q vs Freq Plot 140 22N 120 47N 3N3 100 80 Q 10N 60 R10 40 20 0 1 10 100 Freq (MHz) 5 1000 10000 Wire Wound Chip Inductors SWI1008HQ Series ITEM Inductance and Tolerance Quality Factor Electrical Characteristics Mechanical Characteristics Insulation Resistance Dielectric Withstanding Voltage Temperature Coefficient of Inductance (TCL) Component Adhesion (Push Test) Drop Test Thermal Shock Test Solderability Resistance to Soldering Heat Vibration (Random) Cold Temperature Storage Endurance Characteristics High Temperature Storage Moisture Resistance High Temperature with Loaded CONDITION Measuring Frequency : As shown in Product Table Measuring Temperature : +25°C Measured at 100V DC between inductor terminals and center of case. Measured at 500V AC between inductor terminals and center of case for a maximum of 1 minute. Over -40°C to +85°C at frequency specified in Product Table. The component shall be reflow soldered onto a P.C. Board ( 240°C ± 5°C for 20 seconds ). Then a dynometer force gauge shall be applied to any side of the component. The inductor shall be dropped two times on the concrete floor or the vinyl tile from 1M naturally. Each cycle shall consist of 30 minutes at -40°C followed by 30 minutes at +85°C with a 5 minutes transition time between temperature extremes. Test duration is 10 cycles. Dip pads in flux and dip in solder pot containing lead free solder at 240°C ± 5°C for 5 seconds. Dip the components into flux and dip into solder pot containing lead free solder at 260°C ± 5°C for 5 ± 2 seconds. Inductors shall be randomly vibrated at amplitude of 1.5mm and frequency of 10-55Hz : 0.04G/Hz for a minimum of 15 minutes per axis for each of the three axes. Inductors shall be stored at temperature of -40°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored at temperature of 85°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored in the chamber at 45°C at 90-95 R.H. for 1000 hours. Then inductors are to be tested after 2 hours at room temperature. Inductors shall be stored in the chamber at +85°C for 1000 hours with rated current applied. Inductors shall be tested at the beginning of test at 500 hours and 1000 hours. Then inductors are to be tested after 1 hour at room temperature. 6 SPECIFICATION Within Specified Tolerance 1000 mega ohms minimum No damage occurs when the test voltage is applied. +25 to 500 ppm/°C 6 TCL = L1 - L2 x 10 (ppm /°C) L1(T1-T2) Minimum 1Kg Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage A minimum of 80% of the metalized area must be covered with solder. Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage Inductors shall not have a shorted or open winding. Wire Wound Chip Inductors SWI1008HQ Series Type Pcs/Reel SWI1008HQ 2,000 Φ 1.50 Type SWI1008HQ Chip Cavity Insert Pitch T 2.0 1.75 Tape Thickness 3.50 A B F K T W 2.20 2.83 4.00 1.75 0.22 8.00 W B A F Blank Portions Chip Cavity K 4.0 Leader Top Tape Strength The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. Top Tape 0~15° 80mm min. Direction of tape feed 160mm min. Base Tape Recommended Pattern Dimensions (unit : m/m) Type A B C A SWI1008HQ 3.00 1.20 2.20 B C 7