SB0602-L

SPECIFICATION FOR APPROVAL
REF. :
SB0602□□□□L□-□□□
ABC'S DWG NO.
PROD.
SMD Power Inductor
NAME
REV.
20150818-D
PAGE
1
Ⅰ﹒Configuration and dimensions:
1
2
B
0.25(typ)
90
°
D
0.6(typ)
C
2R2
3
B'
A
4
G
E
F
F
3
100~101
2.20 ref.
LCR
1
3
3
LCR
1
1.20 ref.
2
2.20 ref.
2
4
3.20 ref.
4
3.20 ref.
1
4.20 ref.
1.80 ref. 3
2.20 ref.
4.20 ref.
2R2~6R8
2.20 ref.
Ⅱ﹒Schematic diagram:
1
( PC Board pattern )
Unit:m/m
A
B
B'
C
D
E
F
G
5.00±0.3
6.50±0.3
5.00±0.3
1.85±0.25
1.50±0.1
3.00 typ.
1.25 typ.
3.50 typ.
Ⅲ﹒Description:
a﹒Ferrite drum core construction.
Ⅳ﹒General specification:
a﹒Storage temp.:-40℃ ----+125℃
b﹒Operating temp.:-40℃----+125℃
(Temp. rise included)
c﹒Resistance to solder heat:260℃.10 secs.
AR-001C
Temperature
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
Reflow Area
Forced Cooling Area
+3.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
250
217℃
Temperature ( ℃ )
b﹒Enamelled copper wire:F class
c﹒Product weight: 0.17g(ref.)
d﹒Moisture sensitivity Level 1
e﹒Products comply with RoHS' requirements
f﹒Halogen free available.
Peak Temp:260℃ max.
Max. Peak Temp - 5℃:30sec max.
Max time above 217℃ :60sec~150sec max.
60sec~150sec
200
60sec max.
150
60sec~120sec
100
50
0
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF. :
SB0602□□□□L□-□□□
ABC'S DWG NO.
PROD.
SMD Power Inductor
NAME
REV.
20150818-D
PAGE
2
Ⅴ﹒Electrical characteristics:
DWG No.
SB06022R2ML□-□□□
SB06023R3ML□-□□□
SB06024R7ML□-□□□
SB06026R8ML□-□□□
SB0602100ML□-□□□
SB0602150ML□-□□□
SB0602220ML□-□□□
SB0602330ML□-□□□
SB0602470ML□-□□□
SB0602680ML□-□□□
SB0602101ML□-□□□
1).
2). "-
Inductance
( μH )
Q
ref.
2.2±20%
3.3±20%
4.7±20%
6.8±20%
10.0±20%
15.0±20%
22.0±20%
33.0±20%
47.0±20%
68.0±20%
100.0±20%
30
30
30
30
30
30
30
30
30
30
30
:Packaging information:
□□□ ":Reference code
Test Freq. ( Hz )
L
Q
100k
Code
3). Electrical specifications at 25℃
4). Inductance test freq. : 100kHz / 0.1V
5). Rated current : I 1DC△lL0A=10% typ.
I 2DC△lL0A=50% typ. & temp. rise 40℃ max.
AR-001C
SRF
( MHz )
nom.
95
70
65
50
45
35
25
22
20
15
13
RDC
(Ω)
max.
0.05
0.07
0.10
0.15
0.22
0.31
0.46
0.68
1.10
1.50
2.30
I 1DC
(A)
typ.
1.70
1.40
1.05
0.95
0.82
0.60
0.47
0.43
0.36
0.30
0.23
I 2DC
(A)
typ.
2.10
1.75
1.45
1.18
0.98
0.76
0.60
0.53
0.44
0.37
0.27
SPECIFICATION FOR APPROVAL
REF. :
SB0602□□□□L□-□□□
ABC'S DWG NO.
PROD.
SMD Power Inductor
NAME
REV.
20150818-D
PAGE
3
Ⅵ﹒Packaging information:
( 1 ) Configuration
T
Cover tape
N
A
B
2.0±0.5
∮C
∮C
D
G
Embossed carrier
※Carrier tape width : D
P:8 m/m
End
Leader
no component
200 m/m min.
4 m/m
Start
Trailer
no component
400 m/m min.
Components
User direction of feed
( 2 ) Dimensions
Unit:m/m
Style
A
07 - 16
178
13 - 16
330
B
C
D
G
21±0.8
13
16
18
21±0.8
13±0.5
16
18
+0
+0
N
50
50
-0
-0
T
20.5
22.4
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Code
AR-001C
Q'TY (pcs)
Outer : Carton
G.W. (gw)
Style
Q'TY (pcs)
G.W. (Kg)
Size (cm)
B
900
230
07 - 16
27,000
8.3
42 x 41 x 24
C
3,000
800
13 - 16
18,000
6.1
38 x 37 x 22
SPECIFICATION FOR APPROVAL
REF. :
ABC'S DWG NO.
PROD.
SMD Power Inductor
NAME
REV.
SB0602□□□□L□-□□□
20150818-D
PAGE
4
Ⅶ﹒Reliability test:
Item
1.High Temperature
Exposure
Reference documents
MIL-STD-202 Method 108
2.Temperature Cycling JESD22-A 104
3.Biased Humidity Test MIL-STD-202 Method 103
Test Condition
1.Temperature: 125±2℃
2.Time:96±2 hours.
1.Temperature: -40℃ ~ +125℃
2.Number of cycle:100 cycle
3.Dwell time:30 minutes
1.Temperature:85±2 ℃
2.Humidity: 85% RH.
3.Time:96±2 Hours
1.Temperature: 125℃ (Temp. rise included)
2.Time:96±2 hours.
3.Rated current
4.Operational Life
JESD22-A 108
5.External Visual
JESD22-B 101 &
Inspect product constructions, marking and
MIL-STD-883 Method 2009 workmanship.
6.Physical Dimensions
JESD22-B 100
7.Resistance to solvents MIL-STD-202 Method 215
Test Specification
1.No mechanical or electrical damage.
2.Inductance shall not change
more than ±20%.
1.No mechanical or electrical damage.
2.Inductance shall not change
more than ±20%.
1.No mechanical or electrical damage.
2.Inductance shall not change
more than ±20%.
1.No mechanical or electrical damage.
2.Inductance shall not change
more than ±20%.
1.No pollution on the surface of products.
2.Clear marking.
3.No crack.
Verify physical dimensions to the applicable
product detail specification.
Per product specification standard
Immerse into solvent for 3±0.5 minutes &
brush 10 times for 3 cycles.
1.No body change in apperarance.
2.No marking blurred.
3.Inductance shall not change
more than ±20%.
8.Vibration Test
MIL-STD-202 Method 204
9.Resistance To
Soldering Heat Test
MIL-STD-202 Method 210
& J-STD020D.1
10.Saturation Current
JIS C 6436 &
User SPEC.
1.Frequency and Amplitued :
10-2000-10 Hz, 1.5 mm.
2.Direction:X, Y, Z
3.Test duration:2 hours for each direction,
6 hours in total.
1.Highest temperature:260±5℃.
2.Time(temp.≧ 217℃):60~150 Second.
3.IR reflow times:3 times.
1.Applied rated current for 5 second.
2.Saturation current
11.Over load
JIS C 6436 &
User SPEC.
1.Applied one and half rated current for
a period of 5 minutes.
2.Rated current
No electrical or mechanical damage
12.Temperature Rise
Current
JIS C 6436 &
User SPEC.
1.Applied rated current for 10 minutes.
2.Temperature measure by digital surface
thermometer.
3.Irms current
Surface temperature rise is less than 40℃ max.
13.Solderability Test
J-STD-002 &
JESD22-B 102
1.Baking in pre-testing:
150±5℃ / 16Hours±30 min.
2.Peak temperature:240±5℃
3.Time(temp.≧217℃):60~150 second.
4.IR reflow times:1 times.
More than 95% soldering coverage min on
terminations.
14.Electrical
Characteriazation
MIL-STD-202 Method 304
& User SPEC.
15.Drop
1.Products shall be mounted on SPEC. PCB
and dropped down from a height of 1m
CNS-C6354 & GB/T 2423.8 2.Drop total time:6 time
(Every side of sample drop 2 time)
16.Terminal Strength
Test
IEC 60068-2-21
AR-001C
1.Operating temperature:-40℃~125℃
2.Room temperature:25℃.
1.Apply push force to samples
mounted on PCB.
2.Force of 1.8 kg for 60±1 seconds.
1.No mechanical or electrical damage.
2.Inductance shall not change
more than ±20%.
1.No mechanical or electrical damage.
2.Inductance shall not change
more than ±20%.
Inductance shall not drop
more than 10% typ.
1.No mechanical or electrical damage.
2.Inductance shall not change
more than ±20%.
1. Adhesion on PCB shall be enough.
2. Product appearance shall not break.
3. No electrical damage.
After test, inductors shall be no
mechanical damage.