SPECIFICATION FOR APPROVAL REF. : CC4532□□□□L□-□□□ ABC'S DWG NO. PROD. Wound Chip Inductor NAME REV. 20150421-J PAGE 1 Ⅰ﹒Configuration and dimensions: 8R2K Marking Inductance code F 1.6 C 4.2±0.2 F 1.5 2.2 1.5 E B A ( PCB Pattern ) Unit:m/m A B C E 4.50 ±0.3 3.20 ±0.2 3.20±0.2 1.20 F 1.00+0.3 -0.0 Ⅱ﹒Description: a﹒Ferrite drum core construction. b﹒Enamelled copper wire:H class c﹒Product weight: 0.110 g(ref.) d﹒Moisture sensitivity Level 3 e﹒Products comply with RoHS' requirements Ⅲ﹒General specification: Reflow profile Peak Temp:250℃ max. Max time above 245℃ :20~40sec max. Max time above 217℃ :60~150sec max. 200℃~250℃ Average Ramp-up Rate:3℃/second max. a﹒Temp. rise :20℃ max. b﹒Ambient temp.:100℃ max. Temperature Rising Area c﹒Storage temp.:-40℃ ----+125℃ Preheat Area Reflow Area Forced Cooling Area 150 ~ 200℃ / 60 ~ 180sec d﹒Operating temp.:-40℃----+125℃ (Temp. rise included) f﹒Rated current:Current cause inductance drop within 10% g﹒Resistance to solder heat:250℃.10 secs. 250 245 Temperature ( ℃ ) e﹒Terminal pull strength:1.5 kg min. 20~40sec 217 200 60~150sec 150 100 50 h﹒Resistance to solvent:Per MIL-STD-202F 0 AR-001C 6℃ / second max. Peak Temperature: 250℃ 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF. : CC4532□□□□L□-□□□ ABC'S DWG NO. PROD. Wound Chip Inductor NAME REV. 20150421-J PAGE 2 Ⅳ﹒Electrical characteristics: DWG No. CC45321R0KL□ -□□□ CC45321R2KL□ -□□□ CC45321R5KL□ -□□□ CC45321R8KL□ -□□□ CC45322R2KL□ -□□□ CC45322R7KL□ -□□□ CC45323R3KL□ -□□□ CC45323R9KL□ -□□□ CC45324R7KL□ -□□□ CC45325R6KL□ -□□□ CC45326R8KL□ -□□□ CC45328R2KL□ -□□□ CC4532100KL□ -□□□ CC4532120KL□ -□□□ CC4532150KL□ -□□□ CC4532180KL□ -□□□ CC4532220KL□ -□□□ CC4532270KL□ -□□□ CC4532330KL□ -□□□ CC4532390KL□ -□□□ CC4532470KL□ -□□□ CC4532560KL□ -□□□ CC4532680KL□ -□□□ CC4532820KL□ -□□□ CC4532101KL□ -□□□ CC4532121KL□ -□□□ CC4532151KL□ -□□□ CC4532181KL□ -□□□ CC4532221KL□ -□□□ CC4532271KL□ -□□□ CC4532331KL□ -□□□ CC4532391KL□ -□□□ CC4532471KL□ -□□□ CC4532561KL□ -□□□ CC4532681KL□ -□□□ 1). 2). "- Inductance ( μH ) 1.00 1.20 1.50 1.80 2.20 2.70 3.30 3.90 4.70 5.60 6.80 8.20 10.00 12.00 15.00 18.00 22.00 27.00 33.00 39.00 47.00 56.00 68.00 82.00 100.00 120.00 150.00 180.00 220.00 270.00 330.00 390.00 470.00 560.00 680.00 :Packaging information: □□□ ":Reference code 3). Electrical specifications at 25℃ AR-001C ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% Code Q min. 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 20 20 20 20 20 20 20 20 20 20 20 Test Freq. ( MHz ) 7.96 7.96 7.96 7.96 7.96 7.96 7.96 7.96 7.96 7.96 7.96 7.96 2.52 2.52 2.52 2.52 2.52 2.52 2.52 2.52 2.52 2.52 2.52 2.52 0.796 0.796 0.796 0.796 0.796 0.796 0.796 0.796 0.796 0.796 0.796 SRF ( MHz ) min. 180.0 160.0 130.0 100.0 80.0 60.0 45.0 40.0 35.0 30.0 28.0 25.0 22.0 21.0 20.0 19.0 18.0 16.0 14.0 12.0 11.5 11.0 10.0 9.0 8.0 7.5 7.0 6.5 5.5 5.0 4.0 3.0 3.0 3.0 2.5 RDC (Ω) max. 0.11 0.12 0.15 0.16 0.18 0.20 0.22 0.24 0.27 0.30 0.35 0.40 0.50 0.60 0.70 0.80 0.90 1.20 1.40 1.60 1.90 2.20 2.60 3.50 4.00 4.50 6.50 7.50 9.00 11.00 13.00 14.00 16.00 21.00 24.20 IDC ( mA ) max. 1050 1000 950 900 850 800 750 700 650 650 600 600 550 500 450 400 370 330 300 280 260 240 220 200 180 160 140 120 120 100 90 85 75 70 65 SPECIFICATION FOR APPROVAL REF. : PROD. NAME CC4532□□□□L□-□□□ ABC'S DWG NO. Wound Chip Inductor REV. 20150421-J PAGE 3 Ⅴ﹒Curve: @ Inductance VS. DC Superposition Characteristics 10 7 5 2 101K 3 330K Inductance (uH) 2 10 1 7 5 3 2 2R7K 10 0 7 5 1R0J 3 2 10 1 2 3 5 7 10 2 2 5 7 10 3 3 2 5 7 10 3 3 DC Current (mA) @ Q VS. Frequency Response 100 90 80 70 101K 60 331K 1R0M Q 50 2R7K 330K 40 100K 30 20 10 -1 10 2 4 6 0 8 10 2 Frequency (MHz) AR-001C 4 6 1 8 10 2 4 SPECIFICATION FOR APPROVAL REF. : CC4532□□□□L□-□□□ ABC'S DWG NO. PROD. Wound Chip Inductor NAME 20150421-J REV. PAGE 4 Ⅵ﹒Packaging information: ( 1 ) Configuration T Cover tape N A B 2.0±0.5 ∮C ∮C D G Embossed carrier ※Carrier tape width : D 4 m/m P:8 m/m Leader no component 200 m/m min. 8R2K 8R2K 8R2K Start 8R2K End Trailer no component 400 m/m min. Components User direction of feed ※ There is no differentiation or directions of polarity ( marking ) in the packaging method. ( 2 ) Dimensions Unit:m/m Style A 07 - 12 178 13 - 12 330 B C D G 21±0.8 13 12 14 21±0.8 13±0.5 12 14 +0 +0 N 50 50 -0 -0 T 16.5 18.4 ( 3 ) Q'TY & G.W. Per package Inner : Reel Series AR-001C Q'TY (pcs) G.W. (gw) Outer : Carton Style Q'TY (pcs) G.W. (Kg) Size (cm) CC4532 500 140 07 - 12 20,000 8.00 41 x 39 x 22 CC4532 2,000 550 13 - 12 18,000 6.80 41 x 39 x 22 SPECIFICATION FOR APPROVAL REF. : CC4532□□□□L□-□□□ ABC'S DWG NO. PROD. Wound Chip Inductor NAME REV. 20150421-J PAGE 5 Ⅶ﹒Dwging number expression: C C 4 5 3 2 Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1:Product Classification L:Lead Free Standard products comply with RoHS' requirements Appendix code 2:Package Information Code Inner package Inner package Q'TY Remark A Bag 500 pcs B T / R ( Reel package ) 500 pcs UCT C T / R ( Reel package ) 2,000 pcs UCT D T / R ( Reel package ) 500 pcs UCT E T / R ( Reel package ) 2,000 pcs UCT F T / R ( Reel package ) 2,000 pcs G T / R ( Reel package ) 1,000 pcs UCT blue reel UCT blue reel Note: 1 package code "E" : 200 -0 m/m AR-001C 100 100 100 100 100 100 Start 100 End 450-0 m/m SPECIFICATION FOR APPROVAL REF. : PROD. Wound Chip Inductor NAME ABC'S DWG NO. REV. CC4532□□□□L□-□□□ 20150421-J PAGE 6 Ⅷ﹒Reliability test: Item 1.High Temperature Exposure Reference documents MIL-STD-202 Method 108 2.Temperature Cycling JESD22-A 104 3.Biased Humidity Test MIL-STD-202 Method 103 Test Condition 1.Temperature: 125±2℃ 2.Time:96±2 hours. 1.Temperature: -40℃ ~ +125℃ 2.Number of cycle:100 cycle 3.Dwell time:30 minutes 1.Temperature:85±2 ℃ 2.Humidity: 85% RH. 3.Time:96±2 Hours 1.Temperature: 125℃ (Temp. rise included) 2.Time:96±2 hours. 3.Rated current 4.Operational Life JESD22-A 108 5.External Visual JESD22-B 101 & Inspect product constructions, marking and MIL-STD-883 Method 2009 workmanship. 6.Physical Dimensions JESD22-B 100 7.Resistance to solvents MIL-STD-202 Method 215 Test Specification 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±10%. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. Verify physical dimensions to the applicable product detail specification. Per product specification standard Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change more than ±10%. 8.Vibration Test MIL-STD-202 Method 204 9.Resistance To Soldering Heat Test MIL-STD-202 Method 210 & J-STD020D.1 10.Saturation Current JIS C 6436 & User SPEC. 1.Frequency and Amplitued : 10-2000-10 Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.Highest temperature:250±5℃. 2.Time(temp.≧ 217℃):60~150 Second. 3.IR reflow times:3 times. 1.Applied rated current for 5 second. 2.Rated current 11.Over load JIS C 6436 & User SPEC. 1.Applied one and half rated current for a period of 5 minutes. 2.Rated current No electrical or mechanical damage 12.Temperature Rise Current JIS C 6436 & User SPEC. 1.Applied rated current for 10 minutes. 2.Temperature measure by digital surface thermometer. 3.Irms current Surface temperature rise is less than 20℃ max. 13.Solderability Test J-STD-002 & JESD22-B 102 1.Baking in pre-testing: 150±5℃ / 16Hours±30 min. 2.Peak temperature:240±5℃ 3.Time(temp.≧217℃):60~150 second. 4.IR reflow times:1 times. More than 95% soldering coverage min on terminations. 14.Electrical Characteriazation MIL-STD-202 Method 304 & User SPEC. 1.Operating temperature:-40℃~125℃ 15.Withstanding Voltage Test MIL-STD-202 Method 301 & User SPEC. 1.DC: 500 V (Terminal to Coating) 2.Time:1minutes 16.Insulation Resistance MIL-STD-202 Method 302 17.Drop 1.Products shall be mounted on SPEC. pcb and dropped down from a heigh of 1m CNS-C6354 & GB/T 2423.8 2.Drop total time:6 time (Every side ofsample drop 2 time) 18.Terminal Strength Test IEC 60068-2-21 AR-001C 2.Room temperature:25℃. DC voltage 100V applied between inductor terminal and coating for 1 minute. 1.Apply push force to samples mounted on PCB. 2.Force of 1.8 kg for 60±1 seconds. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±10%. Inductance shall not drop more than 10% max. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±10%. 1.During the test no breakdown. 2.No mechanical or electrical damage. 1.IR = 1000MΩ Min. 2.No mechanical or electrical damage. 1. Adhesion on PCB shall be enough. 2. Product appearance shall not break. 3. No electrical damage. After test, inductors shall be no mechanical damage.