SP6045-L

SPECIFICATION FOR APPROVAL
REF. :
SP6045□□□□L□-□□□
ABC'S DWG NO.
PROD.
Shielded SMD Power Inductor
NAME
REV.
PAGE
20130506-B
1
Ⅰ﹒Configuration and dimensions：
B'
A
D
C
2R0
B
E
7.4
3.0
2.2
3.4
2.2
5.2
( PCB Pattern )
Unit：m/m
A
B
B'
C
D
E
6.60±0.30
6.60±0.30
7.00±0.30
4.50±0.30
1.40 typ.
1.50 typ.
Ⅱ﹒Schematic diagram：
1
2
Ⅲ﹒Description：
a﹒Ferrite ER core construction.
b﹒Magnetically shielded.
c﹒Enamelled copper wire：F class
Peak Temp：250℃ max.
Max. Peak Temp - 5℃：30sec max.
Max time above 217℃ ：60sec~150sec max.
Temperature
Rising Area
d﹒Product weight： 1.0 g（ref.）
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
Reflow Area
Forced Cooling Area
+3.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max.
e﹒Moisture sensitivity Level 1
f﹒Products comply with RoHS' requirements
Ⅳ﹒General specification：
a﹒Storage temp.：-55℃ ~ +125℃
b﹒Operating temp .：-55℃ ~ +125℃
( Temp. rise included )
c﹒Resistance to solder heat：250℃. 10 secs.
AR-001C
217℃
Temperature ( ℃ )
g﹒Halogen free available
Peak Temperature:
250℃
250
60sec~150sec
200
60sec max.
150
60sec~120sec
100
50
0
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF. :
SP6045□□□□L□-□□□
ABC'S DWG NO.
PROD.
Shielded SMD Power Inductor
NAME
20130506-B
REV.
PAGE
2
Ⅴ﹒Electrical characteristics：
Inductance
L ( μH )
Isat
(A)
Irms
(A)
SP6045R70YL□-□□□
0.70 ± 25 ％
15.0
SP60451R0YL□-□□□
1.00 ± 25 ％
SP60451R5YL□-□□□
DWG No.
RDC
( mΩ )
max.
typ.
16.0
4.8
3.7
12.0
13.0
6.0
4.6
1.50 ± 25 ％
10.0
11.0
6.9
5.3
SP60452R0YL□-□□□
2.00 ± 25 ％
8.0
9.0
10.7
8.2
SP60452R5YL□-□□□
2.50 ± 25 ％
7.0
8.4
11.8
9.1
SP60453R0YL□-□□□
3.00 ± 25 ％
6.3
6.6
17.3
13.3
SP60453R9YL□-□□□
3.90 ± 25 ％
6.0
6.2
19.1
14.7
SP60454R5YL□-□□□
4.50 ± 25 ％
5.4
5.8
20.8
16.0
1).
2). "-
：Packaging information：
Code
□□□"：Reference code
3). Electrical specifications at 25℃
4). Inductance Test Freq.：100KHz / 1V
5). Irms base on Temp. rise 40℃ typ.
6). Isat base on inductance drop 25% typ. of L value at 20℃
@ Performance Graphs
R70
1R0
100
100
1.2
ΔT℃
ΔT℃
0.5
L
60
0.4
40
0.3
0.2
20
0.1
0.0
0
5
10
15
DC CURRENT (A)
AR-001C
20
0
25
1.0
INDUCTANCE (μH)
80
0.6
TEMPERATURE (℃)
INDUCTANCE (μH)
0.7
80
0.8
L
60
0.6
40
0.4
20
0.2
0.0
0
2
4
6
8
10
12
14
DC CURRENT (A)
16
18
0
20
TEMPERATURE (℃)
0.8
SPECIFICATION FOR APPROVAL
REF. :
SP6045□□□□L□-□□□
ABC'S DWG NO.
PROD.
Shielded SMD Power Inductor
NAME
REV.
PAGE
20130506-B
3
@ Performance Graphs
1R5
2R0
80
1.0
L
60
0.8
40
0.6
0.4
20
INDUCTANCE (μH)
ΔT℃
1.2
TEMPERATURE (℃)
INDUCTANCE (μH)
1.4
100
2.5
ΔT℃
80
2.0
60
1.5
L
1.0
40
0.5
20
TEMPERATURE (℃)
100
1.6
0.2
4
6
8
10
12
14
16
0
20
18
0.0
0
0
2
4
6
100
2.0
60
1.5
L
40
1.0
20
0.5
INDUCTANCE (μH)
80
ΔT℃
TEMPERATURE (℃)
INDUCTANCE (μH)
100
ΔT℃
80
3.0
2.5
60
L
2.0
40
1.5
1.0
20
0.5
0
2
4
6
8
10
12
0.0
0
14
2
DC CURRENT (A)
4
6
0
10
8
DC CURRENT (A)
3R9
4R5
100
4.0
100
5.0
80
L
2.5
60
2.0
40
1.5
1.0
20
0.5
INDUCTANCE (μH)
ΔT℃
3.0
TEMPERATURE (℃)
4.5
3.5
INDUCTANCE (μH)
14
4.0
3.5
2.5
4.0
80
ΔT℃
3.5
3.0
L
60
2.5
40
2.0
1.5
20
1.0
0.5
2
4
6
DC CURRENT (A)
AR-001C
12
3R0
2R5
3.0
0.0
0
10
DC CURRENT (A)
DC CURRENT (A)
0.0
0
8
TEMPERATURE (℃)
2
8
0
10
0.0
0
2
4
6
DC CURRENT (A)
8
0
10
TEMPERATURE (℃)
0.0
0
SPECIFICATION FOR APPROVAL
REF. :
SP6045□□□□L□-□□□
ABC'S DWG NO.
PROD.
Shielded SMD Power Inductor
NAME
REV.
20130506-B
4
PAGE
Ⅵ﹒Packaging information：
( 1 ) Configuration
T
Cover Tape
N
B
A
2.0±0.5
∮C
∮C
D
G
Embossed carrier
※Carrier tape width : D
P:12 m/m
4 m/m
End
Start
2R0
Leader
no component
200 m/m min.
2R0
2R0
2R0
Trailer
no component
400 m/m min.
Components
User direction of feed
( 2 ) Dimensions
Unit:m/m
Style
A
B
C
D
13 - 16
330
21±0.8
13±0.5
16
G
18
+0
N
50
T
-0
22.4
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Code
B
AR-001C
Outer : Carton
Q'TY (pcs)
G.W. (gw)
Style
Q'TY (pcs)
G.W. (Kg)
Size (cm)
1,000
1,200
13 - 16
6,000
9.50
38 x 37 x 22
SPECIFICATION FOR APPROVAL
REF. :
SP6045□□□□L□-□□□
ABC'S DWG NO.
PROD.
Shielded SMD Power Inductor
NAME
REV.
20130506-B
PAGE
5
Ⅶ﹒Reliability test：
Item
1.High Temperature
Exposure
Reference documents
MIL-STD-202 Method 108
Test Condition
1.Temperature: 125℃
2.Time:96 hours.
1.Temperature: -55℃ ~ 125℃
2.Temperature Cycling JESD22 Method JA-104
2.Number of cycle:96 cycle
3.Dwell time:30 minutes
3.Biased Humidity Test MIL-STD-202 Method 103
1.Temperature: 85±5 ℃
2.Time:96 Hours
3.Humidity: 85±5% RH.
1.Temperature: 125℃
2.Time:96 hours.
3.Apply rated current.
4.Operational Life
MIL-PRF-27
5.Exeternal Visual
MIL-STD-883 Method 2009 constructions, marking and
Inspect product
workmanship.
Test Specification
1.No mechanical and electrical
damage.
2.Inductance shall not change
more than ±25%.
1.No mechanical and electrical
damage.
2.Inductance shall not change
more than ±25%.
1.No mechanical and electrical
damage.
2.Inductance shall not change
more than ±25%.
1.No mechanical and electrical
damage.
2.Inductance shall not change
more than ±25%.
1.No pollution on the surface of
products.
2.Clear marking.
3.No crack.
6.Physical Dimensions JESD22 Method JB-100
Verify physical dimensions to
the applicable product detail
specification.
Per product specification
standard
7.Resistance to solvents MIL-STD-202 Method 215
Immerse into solvent for 3±0.5 minutes &
brush 10 times for therr cycles.
1.No body change in apperarance.
2.No marking blurred.
3.Inductance shall not change
more than ±25%.
8.Vibration Test
MIL-STD-202 Method 204
1.Frequency and Amplitued :
10-2000-10 Hz, 1.5 mm.
2.Direction:X, Y, Z
3.Test duration:2 hours for each direction,
6 hours in total.
1.No mechanical and electrical
damage.
2.Inductance shall not change
more than ±25%.
9.Resistance To
Soldering Heat Test
MIL-STD-202 Method 210
1.Highest temperature： 250±5℃
2.Time（temp.≧ 217℃）：60~150 Second.
3.IR reflow times：3 times.
10.Rated current
MIL-STD-202 Method 330
11.Temperature rise
MIL-PRF-27
12.Over load
MIL-PRF-27
1.No mechanical and electrical
damage.
2.Inductance shall not change
more than ±25%.
1.No mechanical and electrical
damage.
Apply rated current for 5 second.
2.Inductance shall not change
more than ±25%.
1.No mechanical and electrical
damage.
Apply rated current for 10 minutes.
2.Inductance shall not change
more than ±25%.
1.No mechanical and electrical
damage.
Apply twice as rated current for 5 minutes.
(It's not application to some special design) 2.Inductance shall not change
more than ±25%.
1.Baking in pre-testing：
155±5℃ / 16Hours±30 min.
2.Peak temperature：240±5℃
3.Time（temp.≧217℃）：60~150 second.
4.IR reflow times：1 times.
The terminal shall be at least 95%
covered with fresh solder.
User Spec.
1.Operating temperature： -55℃~125℃
2.Room temperature：25℃.
1.No mechanical and electrical
damage.
2.Inductance shall not change
more than ±25%.
MIL-STD-202 Method 201
1.DV:500V
2.Time:1minutes
16.Drop
JESD22-B111
Packaged & Drop down from 1m.In 1 angle
1ridges & 2 surfaces orientation.
17.Terminal Strength
Test
JIS-C-6429
1.Apply push force to samples
mounted on PCB.
2.Force of 1.8 kg for 60±1 seconds.
13.Solderability Test
14.Electrical
Characteriazation
15.Withstanding
Voltage Test
AR-001C
J-STD-002
1.During the test no breakdown.
2.The characteristic is normal after test.
1.No case deformation or change in
appearance.
2.Inductance shall not change
more than ±25%.
After test, inductors shall be no
mechanical damage.