SPECIFICATION FOR APPROVAL REF. : PROD. ABC'S DWG NO. Semi-shielded SMD Power Inductor NAME REV. RN6045□□□□F□-□□□ PAGE 20150722-C 1 Ⅰ﹒Configuration and dimensions： A 100 C B D F E G G Unit：m/m A B C D E F G 6.00 ±0.2 6.00 ±0.2 4.50 max. 2.50 ref. 2.30 ref. 6.00 ref. 2.00 ref. Ⅱ﹒Description： a﹒Ferrite drum core construction. b﹒Magnetically epoxy. c﹒Enamelled copper wire：H class Peak Temp：250℃ max. Max. Peak Temp - 5℃：30sec max. Max time above 217℃ ：60sec~150sec max. d﹒Product weight：0.56 g（ref.） Temperature Rising Area e﹒Moisture sensitivity Level 1 Preheat Area +4.0℃ / sec max. 150 ~ 200℃ / 60 ~ 120sec Reflow Area f﹒Products comply with RoHS' requirements a﹒Storage temp.：-40℃ ----+125℃ b﹒Operating temp.：-40℃----+125℃ (Temp. rise included) c﹒Resistance to solder heat：250℃ . 10 secs. AR-001C 217℃ Temperature ( ℃ ) Ⅲ﹒General specification： Peak Temperature: 250℃ 250 g﹒Halogen free available Forced Cooling Area +3.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max. 60sec~150sec 200 60sec max. 150 60sec~120sec 100 50 0 50 100 150 200 250 SPECIFICATION FOR APPROVAL REF. : PROD. NAME ABC'S DWG NO. Semi-shielded SMD Power Inductor REV. RN6045□□□□F□-□□□ 20150722-C PAGE Ⅳ﹒ Electrical characteristics： DWG No. RN60451R0YF□-□□□ RN60451R3YF□-□□□ RN60451R8YF□-□□□ RN60452R2YF□-□□□ RN60453R3YF□-□□□ RN60454R7YF□-□□□ RN60456R8YF□-□□□ RN60458R2YF□-□□□ RN6045100MF□-□□□ RN6045120MF□-□□□ RN6045150MF□-□□□ RN6045220MF□-□□□ RN6045330MF□-□□□ RN6045470MF□-□□□ RN6045680MF□-□□□ RN6045101MF□-□□□ 1). 2). "- Inductance (uH) 1.0±30% 1.3±30% 1.8±30% 2.2±30% 3.3±30% 4.7±30% 6.8±30% 8.2±30% 10±20% 12±20% 15±20% 22±20% 33±20% 47±20% 68±20% 100±20% ：Packaging information： □□□ "：Reference code Code 3). Electrical specifications at 25℃ 4). Inductance Test Condition.：100kHz / 1V 5). Irms base on Temp. rise 40℃ max. 6). Isat base on △ L/L0A＝30％ max. AR-001C RDC (mΩ) max. 13.9 17.0 19.8 25.1 30.2 37.6 47.3 55.0 58.6 85.0 95.8 142.0 188.0 257.0 351.0 494.0 Isat (A) max. Irms (A) max. 8.50 8.00 7.00 6.00 5.00 4.00 3.80 3.30 3.00 2.60 2.30 1.90 1.50 1.30 1.00 0.80 4.20 4.00 3.70 3.50 3.20 3.00 2.80 2.70 2.50 2.20 1.90 1.50 1.40 1.10 0.90 0.70 2 SPECIFICATION FOR APPROVAL REF. : PROD. NAME ABC'S DWG NO. Semi-shielded SMD Power Inductor REV. RN6045□□□□F□-□□□ PAGE 20150722-C Ⅴ﹒Curve： RN60451R0YF□ 1.6 60.0 50.0 1.2 △ T (℃ ) L (uH) 40.0 0.8 30.0 20.0 0.4 10.0 0.0 0.0 0.0 2.0 4.0 IDC (A) 6.0 8.0 10.0 0.0 2.0 4.0 IDC (A ) 6.0 8.0 6.0 60.0 5.0 50.0 4.0 40.0 △ T (℃ ) L (uH) RN60454R7YF□ 3.0 30.0 2.0 20.0 1.0 10.0 0.0 0.0 0.0 1.0 2.0 IDC (A) 3.0 4.0 5.0 0.0 1.0 2.0 IDC (A ) 3.0 4.0 5.0 50.0 50.0 40.0 40.0 30.0 30.0 △ T (℃ ) L (uH) RN6045330MF□ 20.0 20.0 10.0 10.0 0.0 0.0 0.0 0.5 1.0 IDC (A) 1.5 2.0 0.0 0.5 1.0 IDC (A ) 1.5 2.0 RN6045101MF□ 120.0 50.0 100.0 40.0 △ T (℃ ) L (uH) 80.0 60.0 30.0 20.0 40.0 10.0 20.0 0.0 0.0 0 AR-001C 0.2 0.4 0.6 IDC (A) 0.8 1 1.2 0 0.2 0.4 0.6 IDC (A ) 0.8 1 1.2 3 SPECIFICATION FOR APPROVAL REF. : PROD. ABC'S DWG NO. Semi-shielded SMD Power Inductor NAME REV. RN6045□□□□F□-□□□ PAGE 20150722-C 4 Ⅵ﹒Packaging information： ( 1 ) Configuration T Cover tape N A B 2.0±0.5 ∮C ∮C D G Embossed carrier ※Carrier tape width : D 4 m/m P : 12 m/m End Start 100 100 Leader no component 200 m/m min. 100 100 100 Trailer no component 400 m/m min. Components User direction of feed ( 2 ) Dimensions Unit:m/m Style A 13 - 16 330 B 21±0.8 C D 13±0.5 16 G 18 +0 N 50 -0 T 22.4 ( 3 ) Q'TY & G.W. Per package Inner : Reel Code B AR-001C Outer : Carton Q'TY (pcs) G.W. (gw) Style Q'TY (pcs) G.W. (Kg) Size (cm) 1,000 940 13 - 16 6,000 6.9 38 x 37 x 22 SPECIFICATION FOR APPROVAL REF. : PROD. ABC'S DWG NO. Semi-shielded SMD Power Inductor NAME REV. RN6045□□□□F□-□□□ 20150722-C PAGE 5 Ⅶ﹒Reliability test： Item 1.High Temperature Exposure Reference documents MIL-STD-202 Method 108 2.Temperature Cycling JESD22-A 104 3.Biased Humidity Test MIL-STD-202 Method 103 Test Condition 1.Temperature: 125±2℃ 2.Time:96±2 hours. 1.Temperature: -40℃ ~ +125℃ 2.Number of cycle:100 cycle 3.Dwell time:30 minutes 1.Temperature：85±2 ℃ 2.Humidity: 85% RH. 3.Time:96±2 Hours 1.Temperature: 125℃ (Temp. rise included) 2.Time:96±2 hours. 3.Rated current 4.Operational Life JESD22-A 108 5.External Visual JESD22-B 101 & Inspect product constructions, marking and MIL-STD-883 Method 2009 workmanship. 6.Physical Dimensions JESD22-B 100 7.Resistance to solvents MIL-STD-202 Method 215 Test Specification 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. Verify physical dimensions to the applicable product detail specification. Per product specification standard Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change more than ±20%. 8.Vibration Test MIL-STD-202 Method 204 9.Resistance To Soldering Heat Test MIL-STD-202 Method 210 & J-STD020D.1 10.Saturation Current JIS C 6436 & User SPEC. 1.Frequency and Amplitued : 10-2000-10 Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.Highest temperature：250±5℃. 2.Time（temp.≧ 217℃）：60~150 Second. 3.IR reflow times：3 times. 1.Applied rated current for 5 second. 2.Saturation current 11.Over load JIS C 6436 & User SPEC. 1.Applied one and half rated current for a period of 5 minutes. 2.Rated current No electrical or mechanical damage 12.Temperature Rise Current JIS C 6436 & User SPEC. 1.Applied rated current for 10 minutes. 2.Temperature measure by digital surface thermometer. 3.Irms current Surface temperature rise is less than 40℃ max. 13.Solderability Test J-STD-002 & JESD22-B 102 1.Baking in pre-testing： 150±5℃ / 16Hours±30 min. 2.Peak temperature：240±5℃ 3.Time（temp.≧217℃）：60~150 second. 4.IR reflow times：1 times. More than 95% soldering coverage min on terminations. 14.Electrical Characteriazation MIL-STD-202 Method 304 & User SPEC. 15.Drop 1.Products shall be mounted on SPEC. PCB and dropped down from a height of 1m CNS-C6354 & GB/T 2423.8 2.Drop total time：6 time (Every side of sample drop 2 time) 16.Terminal Strength Test IEC 60068-2-21 AR-001C 1.Operating temperature：-40℃~125℃ 2.Room temperature：25℃. 1.Apply push force to samples mounted on PCB. 2.Force of 1.8 kg for 60±1 seconds. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. Inductance shall not drop more than 30% max. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1. Adhesion on PCB shall be enough. 2. Product appearance shall not break. 3. No electrical damage. After test, inductors shall be no mechanical damage.