SPECIFICATION FOR APPROVAL REF. : PROD. NAME DH4028□□□□F□-□□□ ABC'S DWG NO. Shielded SMD Power Inductor REV. 20150824-C PAGE 1 Ⅰ﹒Configuration and dimensions： C 100 B A H D F I E G ( PCB Pattern ) Unit：m/m A B C D E F G H I 5.00 max. 5.00 max. 2.80 max. 2.10 typ. 6.20 typ. 5.20 ref. 1.60 ref. 2.00 ref. 4.20 ref. Ⅱ﹒Description： a﹒Ferrite drum core construction. b﹒Magnetically shielded. c﹒Enamelled copper wire：H class d﹒Product weight： 0.250g（ref.） Peak Temp：250℃ max. Max. Peak Temp - 5℃：30sec max. Max time above 217℃ ：60sec~150sec max. e﹒Moisture sensitivity Level 1 f﹒Products comply with RoHS' requirements Temperature Rising Area g﹒Halogen free available Preheat Area +4.0℃ / sec max. 150 ~ 200℃ / 60 ~ 120sec Reflow Area Forced Cooling Area +3.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max. Peak Temperature: 250℃ 250 Ⅲ﹒General specification： a﹒Storage temp.：-40℃ ----+125℃ b﹒Operating temp.：-40℃----+125℃ (Temp. rise included) c﹒Resistance to solder heat：250℃.10 secs. Temperature ( ℃ ) 217℃ 60sec max. 150 60sec~120sec 100 50 0 AR-001C 60sec~150sec 200 50 100 150 200 250 SPECIFICATION FOR APPROVAL REF. : DH4028□□□□F□-□□□ ABC'S DWG NO. PROD. Shielded SMD Power Inductor NAME REV. 20150824-C PAGE 2 Ⅳ﹒Electrical characteristics： DWG No. Inductance ( μH ) RDC mΩ typ. max. Isat (A) Irms (A) DH40281R2YF□-□□□ 1.2 ±30 ％ 12.3 17.0 3.04 4.82 DH40282R2YF□-□□□ 2.2 ±30 ％ 17.4 23.0 2.32 3.78 DH40283R6YF□-□□□ 3.6 ±30 ％ 25.6 35.0 1.82 2.93 DH40284R7YF□-□□□ 4.7 ±30 ％ 29.8 40.0 1.58 2.63 DH40285R4YF□-□□□ 5.4 ±30 ％ 34.9 47.0 1.49 2.39 DH40286R8YF□-□□□ 6.8 ±30 ％ 43.2 58.0 1.37 2.25 DH40287R4YF□-□□□ 7.4 ±30 ％ 46.7 63.0 1.28 2.16 DH40288R6YF□-□□□ 8.6 ±30 ％ 51.5 70.0 1.22 2.12 DH4028100MF□-□□□ 10.0 ±20 ％ 64.9 88.0 1.13 1.76 DH4028120MF□-□□□ 12.0 ±20 ％ 74.2 100.0 0.99 1.62 DH4028150MF□-□□□ 15.0 ±20 ％ 87.9 119.0 0.90 1.42 DH4028180MF□-□□□ 18.0 ±20 ％ 104.0 136.0 0.85 1.28 DH4028220MF□-□□□ 22.0 ±20 ％ 138.0 179.0 0.72 1.10 DH4028270MF□-□□□ 27.0 ±20 ％ 152.0 197.0 0.68 1.06 DH4028330MF□-□□□ 33.0 ±20 ％ 184.0 239.0 0.59 0.95 DH4028390MF□-□□□ 39.0 ±20 ％ 218.0 272.0 0.57 0.90 DH4028470MF□-□□□ 47.0 ±20 ％ 240.0 300.0 0.52 0.86 DH4028560MF□-□□□ 56.0 ±20 ％ 278.0 348.0 0.45 0.81 DH4028680MF□-□□□ 68.0 ±20 ％ 361.0 452.0 0.41 0.70 DH4028820MF□-□□□ 82.0 ±20 ％ 442.0 552.0 0.39 0.59 DH4028101MF□-□□□ 100.0 ±20 ％ 487.0 609.0 0.34 0.56 1). 2). "- ：Packaging information： □□□ "：Reference code Code 3). Electrical specifications at 25℃ 4). Inductance Test Condition.：100kHz / 0.1V 5). Irms base on Temp. rise 40℃ typ. 6). Isat base on △ L/L0A＝35％ typ. AR-001C SPECIFICATION FOR APPROVAL REF. : PROD. NAME DH4028□□□□F□-□□□ ABC'S DWG NO. Shielded SMD Power Inductor REV. 20150824-C PAGE Ⅴ﹒Curve： DH40284R7YF□ 100.0 6.0 5.0 80.0 △ T (℃ ) L (uH) 4.0 3.0 60.0 40.0 2.0 20.0 1.0 0.0 0.0 0.0 0.5 1.0 1.5 IDC (A ) 2.0 2.5 0.00 3.0 1.00 2.00 3.00 4.00 5.00 1.14 1.52 1.90 0.78 1.04 1.30 0.6 0.8 1.0 IDC (A ) DH4028220MF□ 70.0 25.0 60.0 20.0 △ T (℃ ) L (uH) 50.0 15.0 10.0 40.0 30.0 20.0 5.0 10.0 0.0 0.0 0.00 0.30 0.60 IDC (A ) 0.90 0.00 1.20 0.38 0.76 IDC (A ) DH4028470MF□ 60.0 80.0 50.0 60.0 △ T (℃ ) L (uH) 40.0 30.0 40.0 20.0 20.0 10.0 0.0 0.0 0.0 0.2 0.4 IDC (A ) 0.6 0.8 0.00 0.26 0.52 IDC (A ) DH4028101MF□ 120.0 80.0 100.0 60.0 △ T (℃ ) L (uH) 80.0 60.0 40.0 40.0 20.0 20.0 0.0 0.0 0.0 0.1 0.2 0.3 IDC (A ) AR-001C 0.4 0.5 0.0 0.2 0.4 IDC (A ) 3 SPECIFICATION FOR APPROVAL REF. : DH4028□□□□F□-□□□ ABC'S DWG NO. PROD. Shielded SMD Power Inductor NAME REV. 20150824-C PAGE 4 Ⅵ﹒Packaging information： ( 1 ) Configuration T Cover tape N A B 2.0±0.5 ∮C ∮C D G Embossed carrier ※Carrier tape width : D P:8 m/m 4 m/m Start End 100 Leadr no component 200 m/m min. 100 100 100 Trailer no component 400 m/m min. Components User direction of feed ( 2 ) Dimensions Unit:m/m Style A B C D G N T 07 - 12 178 21±0.8 13 12 14 +0 50 -0 16.5 ( 3 ) Q'TY & G.W. Per package Inner : Reel Code B AR-001C Q'TY (pcs) G.W. (gw) 500 210 Outer : Carton Style 07 - 12 Q'TY (pcs) G.W. (Kg) Size (cm) 20,000 9.9 42 x 41 x 24 SPECIFICATION FOR APPROVAL REF. : ABC'S DWG NO. PROD. Shielded SMD Power Inductor NAME REV. DH4028□□□□F□-□□□ 20150824-C PAGE 5 Ⅶ﹒Reliability test： Item 1.High Temperature Exposure Reference documents MIL-STD-202 Method 108 2.Temperature Cycling JESD22-A 104 3.Biased Humidity Test MIL-STD-202 Method 103 Test Condition 1.Temperature: 125±2℃ 2.Time:96±2 hours. 1.Temperature: -40℃ ~ +125℃ 2.Number of cycle:100 cycle 3.Dwell time:30 minutes 1.Temperature：85±2 ℃ 2.Humidity: 85% RH. 3.Time:96±2 Hours 1.Temperature: 125℃ (Temp. rise included) 2.Time:96±2 hours. 3.Rated current 4.Operational Life JESD22-A 108 5.External Visual JESD22-B 101 & Inspect product constructions, marking and MIL-STD-883 Method 2009 workmanship. 6.Physical Dimensions JESD22-B 100 7.Resistance to solvents MIL-STD-202 Method 215 Test Specification 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. Verify physical dimensions to the applicable product detail specification. Per product specification standard Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change more than ±20%. 8.Vibration Test MIL-STD-202 Method 204 9.Resistance To Soldering Heat Test MIL-STD-202 Method 210 & J-STD020D.1 10.Saturation Current JIS C 6436 & User SPEC. 1.Frequency and Amplitued : 10-2000-10 Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.Highest temperature：250±5℃. 2.Time（temp.≧ 217℃）：60~150 Second. 3.IR reflow times：3 times. 1.Applied rated current for 5 second. 2.Saturation current 11.Over load JIS C 6436 & User SPEC. 1.Applied one and half rated current for a period of 5 minutes. 2.Rated current No electrical or mechanical damage 12.Temperature Rise Current JIS C 6436 & User SPEC. 1.Applied rated current for 10 minutes. 2.Temperature measure by digital surface thermometer. 3.Irms current Surface temperature rise is less than 40℃ typ. 13.Solderability Test J-STD-002 & JESD22-B 102 1.Baking in pre-testing： 150±5℃ / 16Hours±30 min. 2.Peak temperature：240±5℃ 3.Time（temp.≧217℃）：60~150 second. 4.IR reflow times：1 times. More than 95% soldering coverage min on terminations. 14.Electrical Characteriazation MIL-STD-202 Method 304 & User SPEC. 15.Drop 1.Products shall be mounted on SPEC. PCB and dropped down from a height of 1m CNS-C6354 & GB/T 2423.8 2.Drop total time：6 time (Every side of sample drop 2 time) 16.Terminal Strength Test IEC 60068-2-21 AR-001C 1.Operating temperature：-40℃~125℃ 2.Room temperature：25℃. 1.Apply push force to samples mounted on PCB. 2.Force of 1.8 kg for 60±1 seconds. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. Inductance shall not drop more than 30% typ. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1. Adhesion on PCB shall be enough. 2. Product appearance shall not break. 3. No electrical damage. After test, inductors shall be no mechanical damage.