1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT White LED Driver for LCD Backlights with step-up DC/DC controller TYPE BD9203EFV FEATURE ・ ・ ・ ・ ・ ・ ・ 6CH LED current driver up to 150mA/CH built-in *2 Over voltage protection (OVP), Short circuit protection (SCP), LED open and short detection Step-up DC/DC controller built-in PWM and DC Dimming Programmable timer latch and soft-start period by external capacitor Over voltage protection (OVP), Short current protection (SCP), LED open and short detection Under voltage lock out (UVLO) ・ HTSSOP-B28 package ○ ABSOLUTE MAXIMUM RATINGS PARAMETER (Ta=25℃) Symbol Limit Unit STB Voltage VCC VREF5V STB 36 7 36 V V V LED Output Voltage LED1～6 40 V FAIL Output Voltage FAIL SEL, UVLO, PWM1, PWM2, RT, SS, SLOPE, ISET, VREF, CP, FB, OVP, CS N Pd Topr Tstg ILED 40 V 7 V 15 3.30 *1 -40～+85 -55～+150 150 *2 V W ℃ ℃ mA Power Supply Voltage Pin Voltage Power Dissipation Operating Temperature Range Storage Temperature Range LED Maximum Current *1 Pd derated at 26.4 mW/℃ for temperature above Ta=25℃, mounted on 70mm×70mm×1.6mm 2 layer(cupper area 70mm×70mm)glass-epoxy PCB. *2 This is the constant current value per 1ch. Please perform setting of the constant current value in the range that is not beyond a value of Pd. This product is not designed for protection against radioactive rays. ○ OPERATING CONDITIONS (Ta=25℃) PARAMETER Power Supply Voltage CT Oscillation Frequency Range VREF input voltage range Symbol VCC FCT Limit 9～35 100～1000 Unit V kHz VREF 0～VREF5V V REV. Ａ 2/4 ○ ELECTRICAL CHARACTERISTICS(unless otherwise specified VCC=24V, Ta=25℃) PARAMETER Symbol MIN. Limit TYP. MAX. UNIT Conditions 【Total Current Consumption】 Circuit Current ICC － 5 10 mA Standby Current IST － 0 10 uA STB=3V, LED1～6=ON, RT=100kΩ STB=0V VREF5V Voltage VREF5 4.9 5.0 5.1 V IO=0mA VREF5V source current IREF5 20 － - V 【VREF5V】 【Switching block】 N source resistance RONH - 7 14 Ω ION=-10mA N sink resistance 【SOFT START】 RONL - 3.4 7 Ω ION=10mA SS source current ISS -2.0 -1.0 -0.5 uA SS END pin voltage 【Error-Amp block】 VSS 3.8 4.0 4.2 V LED control voltage FB sink current FB source current SS=SWEEP UP VLED 0.65 0.75 0.85 V IFBSINK 40 100 200 uA LED=2.0V, VFB=1.0V IFBSOURCE -200 -100 -40 uA LED=0V, VFB=1.0V RT=100kΩ 【CT Oscillator block】 Oscillation Frequency FCT 500 600 700 kHz RT pin output voltage VRT 1.05 1.5 1.95 V VSLOPE 1.05 1.5 1.95 V DMAX 76 85 94 % SLOPE pin output voltage MAX DUTY 【OVP】 Over Voltage Protection voltage OVP hysterisis OVP Feedback Voltage VOVP 3.8 4.0 4.2 V VOVPHYS 100 200 400 mV VOVP=SWEEP UP FBOVP 3.5 3.6 3.7 V PWM1, 2=0V VSCP 0.05 0.20 0.35 V VOVP=SWEEP DOWN VCC=SWEEP UP VOVP=SWEEP DOWN 【SCP】 Short Circuit Protection voltage 【UVLO】 Operating voltage (VCC) VUVLO_VCC 6.0 7.0 8.0 V hysterisis (VCC) VUHYS_VCC 150 300 600 mV Cancel voltage (UVLO) VUVLO_U 2.375 2.5 2.625 V hysterisis (UVLO) VUHYS_U 50 100 200 mV UVLO=SWEEP DOWN VCP ICP 1.8 -2.0 2.0 -1.0 2.2 -0.5 V uA CP=SWEEP UP VCP=0V VCC=SWEEP DOWN UVLO=SWEEP UP 【FILTER(CP)】 CP detection voltage CP source current 【LED output (LED1～6)】 LED current accuracy ⊿ILED -3 - 3 % ILED=40mA Open detection voltage VOPEN 0.05 0.20 0.35 V VLED=SWEEP DOWN Short detection voltage VSHORT 4.5 5.0 5.5 V VLED=SWEEP UP 【STB】 Input High voltage STBH 2.0 - VCC V Input Low voltage STBL -0.3 - 0.8 V IEN 13 25 38 uA V Input current VIN=5V(STB) 【PWM1, PWM2】 Input High voltage PWMH 2.0 - 5.0 Input Low voltage PWML -0.3 - 0.5 V Input current IPWM -5 0 5 uA VIN=5V(PWM1, PWM2) VOL 0.05 0.10 0.20 V IOL=1mA 【FAIL output(open drain)】 FAIL Low voltage (This product is not designed for protection against radioactive rays.) REV. Ａ 3/4 ○ BLOCK DIAGRAM VIN C IN + CVREF COUT VREF5V UVLO OSDET VCC VCC CVCC UVLO (VCC) STB OVP FILTER VREG OVP CP CP FAIL SLOPE + RT TSD UVLO OSC PWM COMP + - Driver Control Logic Durrent Sence SS AGND ERR AMP FB RPC CPC N CS PGND3 + LED1 LED2 LED3 LED4 LED5 LED6 Current driver SEL PWM1 PWM2 ○ PACKEGE, MARKING SPECIFICATION VREF PGND1 ISET PGND2 ISET Open-Short Detect BD9203EFV OSDET LOT No. HTSSOP-B28 ○ PIN No. & PIN NAME PIN No. 1 2 PIN Name Function PGND3 N Power GND DC/DC switching output Active LED channel select pin (3 state) Protect signal output Under voltage lock out input External PWM input 2 External PWM input 1 Power Supply Voltage Enable pin Internal regulator output Analog GND CT frequency setting R Slope compensation setting R LED output current setting R 3 SEL 4 5 6 7 8 9 10 11 12 13 14 FAIL UVLO PWM2 PWM1 VCC STB VREF5V AGND RT SLOPE ISET PIN No. 15 16 PIN Name Function VREF CP DC dimming input Filter set Cap. 17 FB Error amp output 18 19 20 21 22 23 24 25 26 27 28 PGND1 LED1 LED2 LED3 LED4 LED5 LED6 PGND2 SS OVP CS REV. Ａ LED output GND1 LED output 1 LED output 2 LED output 3 LED output 4 LED output 5 LED output 6 LED output GND2 Soft start period setting Cap. DC/DC over voltage protection DC/DC current sense 4/4 ○ Operation Notes 1) Absolute maximum ratings An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages up to -0.3 V to be applied to the ICT pin. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Mutual impedance Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). 7) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, as shown in the figures below, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Although the circuit design allows voltages up to -0.3 V to be applied to the ICT pin, voltages lower than this may cause the behavior described above. Use caution when designing (Pin B) Resistor B C Transistor (NPN) ～ ～ the circuit. E (Pin A) ～ ～ GND N P+ N P N Parasitic elements GND GND (Pin B) (Pin A) ～ ～ C ～ ～ B Parasitic elements GND P P substrate N N P substrate Parasitic elements N + P + P + P N E Other Adjacent Elements GND Parasitic elements Simplified structure of a Monolithic IC REV. Ａ Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. 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