ROHM BD82065FVJ

1/4
Structure
Silicon Monolithic IC
Products
High side switch IC
Type
BD82065FVJ
Features
Low on resistance 70mΩ MOSFET Switch
1A Continuous current load
Active “High” control logic
Soft start circuit
Over current detection
Thermal shutdown
Under voltage lockout
Open drain error flag output
Reverse-current protection when power switch off
TSSOP-B8J Package
ESD protection
◇Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Supply voltage
VIN
-0.3 ~ 6.0
V
Enable voltage
VEN
-0.3 ~ 6.0
V
/OC voltage
V/OC
-0.3 ~ 6.0
V
/OC sink current
IS/OC
~ 5
mA
OUT voltage
VOUT
-0.3 ~ 6.0
V
Storage temperature
TSTG
-55 ~ 150
°C
*1
Power dissipation
PD
587.5
*1 Mounted on 70mm*70mm*1.6mm glass-epoxy PCB. Derating : 4.7mW/°C above Ta=25°C.
* This product is not designed for protection against radioactive rays.
mW
◇Operating conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
VIN
2.7
-
5.5
V
Operating temperature
TOPR
-40
-
85
°C
Continuous output current
IOUT
0.0
-
1.0
A
Operating voltage
REV. A
2/4
◇Electric characteristics
Unless otherwise specified VIN = 5.0V, Ta = 25°C
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Operating Current
IDD
-
110
160
μA
VEN = 5V, VOUT = Open
Standby Current
ISTB
-
0.01
1
μA
VEN = 0V, VOUT = Open
VEN
2.0
-
-
V
High input
VEN
-
-
0.8
V
Low input
IEN
-1.0
0.01
1.0
μA
VEN = 0V or 5V
/OC output LOW voltage
V/OC
-
-
0.5
V
I/OC = 0.5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC delay time
T/OC
10
15
20
ms
ON resistance
RON
-
70
110
mΩ
Current Limit Threshold
ITH
1.5
2.4
3.0
A
Short-circuit current
ISC
1.1
1.5
2.1
A
Output rise time
TON1
-
0.8
10
ms
RL = 10Ω
Output rise delay time
TON2
-
1.1
20
ms
RL = 10Ω
Output fall time
TOFF1
-
5
20
μs
RL = 10Ω
Output fall delay time
TOFF2
-
10
40
μs
RL = 10Ω
Switch leak current
ILSW
-
-
1.0
μA
VEN = 0V, VOUT = 0V
Reverse leak current
ILREV
-
-
1.0
μA
VOUT = 5.5V, VIN = 0V
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
Current consumption
I/O
EN input voltage
EN input current
Power switch
IOUT = 500mA
VOUT = 0V, CL = 47μF
RMS
UVLO
UVLO
Threshold
◇Measurement circuit
◇Timing chart at output rise / fall time
TOFF1
TON1
VIN
A
VOUT
IN
RL
GND
CL
90%
10%
10%
A
OUT
90%
TOFF2
IOUT
TON2
VEN
EN
VEN
/OC
50%
REV. A
50%
3/4
◇Block diagram
OUT
GND
IN
Charge
Pump
UVLO
IN
OUT
OCD
OUT
Gate
Logic
/OC
EN
TSD
◇Pin description
Pin No.
Pin Name
1
GND
2,3
IN
4
EN
5
/OC
6,7,8
OUT
Function
Ground
Power supply input. Input terminal to the power switch and power
supply input terminal of the internal circuit.
Enable input.
Power switch on at High level.
Over current output.
Low level at over current, over temperature detection.
Open drain output.
Power switch output.
◇Package
D 8 2
0 6 5
Lot No.
TSSOP-B8J
(Unit : mm)
REV. A
4/4
●Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention
to the interference by common impedance of layout pattern when there are plural power supplies and GND lines.
Especially, when there are GND pattern for small signal and GND pattern for large current included the external
circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the
power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between
terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of
the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then
breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to
apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In
addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power
supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
When junction temperatures become 170°C (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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