TECHNICAL NOTE DC Brushless Motor Driver Series for Cooling Fans Low-voltage Single-phase Full-wave DC Brushless Fan Motor Drivers BH6766FVM, BD6989FVM, BH6799FVM, BH6789FVM ●Description This is the summary of models that suit for notebook PC cooling fan. They employ Bi-CMOS and Bi-CDMOS process, and realize low ON resistor, low power consumption, and quiet drive. They also incorporate lock protection and automatic restart circuit which does not require external capacitor. ●Features 1) Soft switched drive 2) Incorporating lock protection and automatic restart circuit(BD6989FVM、BH6799FVM、BH6789FVM) 3) Rotating speed pulse signal (FG) output (BD6989FVM、BH6799FVM、BH6766FVM) 4) Lock alarm signal (AL) output (BH6789FVM) 5) PWM speed control (BD6989FVM) 6) MSOP8 compact package ●Applications For compact 5V fan such as notebook PC cooling fan ●Lineup Low voltage single-phase full wave PWM speed control Lock protection circuit incorporated FG output BD6989FVM PWM speed control not available Lock protection circuit incorporated FG output BH6799FVM AL output BH6789FVM FG output BH6766FVM Lock protection circuit not incorporated Jan. 2007 ●Absolute maximum ratings ◎BD6989FVM Parameter Symbol Limit Unit Supply voltage Vcc 10 V Power dissipation Pd 585＊ mW Operating temperature Topr -40～+105 ℃ Storage temperature Tstg -55～+150 ℃ Output voltage Vomax 10 V Output current Iomax 700＊＊ mA FG signal output current IFG 10 mA FG signal output voltage VFG 10 V Tjmax 150 ℃ Junction temperature ＊ ＊＊ Reduce by 4.68mW/℃ over 25℃. (70.0mm×70.0mm×1.6mm glass epoxy board) This value is not to exceed Pd. ◎BH6799FVM Parameter Supply voltage Power dissipation Operating temperature Storage temperature Output current FG signal output current FG signal output voltage Junction temperature ＊ ＊＊ Symbol Limit Unit Vcc Pd Topr Tstg Iomax IFG VFG Tjmax 7 585＊ -40～+105 -55～+150 1000＊＊ 5 7 150 V mW ℃ ℃ mA mA V ℃ Reduce by 4.68mW/℃ over 25℃. (70.0mm×70.0mm×1.6mm glass epoxy board) This value is not to exceed Pd. ◎BH6789FVM Parameter Symbol Limit Unit Supply voltage Vcc 7 V Power dissipation Pd 585＊ mW Topr -40～+105 ℃ Operating temperature Storage temperature Tstg -55～+150 ℃ Iomax 1000＊＊ mA AL signal output current IAL 5 mA AL signal output voltage VAL 7 V Tjmax 150 ℃ Output current Junction temperature ＊ ＊＊ Reduce by 4.68mW/℃ over 25℃. (70.0mm×70.0mm×1.6mm glass epoxy board) This value is not to exceed Pd. 2/16 ◎BH6766FVM Parameter Symbol Limit Unit Supply voltage Vcc 7 V Power dissipation Pd 585＊ mW Operating temperature Topr -40～+105 ℃ Storage temperature Tstg -55～+150 ℃ Iomax 600＊＊ mA IFG 5 mA Output current FG signal output current FG signal output voltage Junction temperature VFG 7 V Tjmax 150 ℃ Reduce by 4.68mW/℃ over 25℃. (70.0mm×70.0mm×1.6mm glass epoxy board) This value is not to exceed Pd. ＊ ＊＊ ●OPERATING CONDITIONS ◎BD6989FVM Parameter Symbol Limit Unit Operating supply voltage range Vcc 2.9～8.0 V Hall input voltage range VH 0～Vcc-1.8 V ◎BH6799FVM, BH6789FVM Parameter Symbol Limit Unit Operating supply voltage range Vcc 2.0～6.0 V Hall input voltage range VH 0.4～Vcc-1.1 V ◎BH6766FVM Parameter Symbol Limit Unit Operating supply voltage range Vcc 2.0～6.0 V Hall input voltage range VH 0.4～Vcc-1.1 V 3/16 ●ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=5V) ◎BD6989FVM Parameter Symbol Limit Unit Conditions Characteristics Min. Typ. Max. Icc - 4 6 mA Fig.1 Input offset voltage VHOFS - - ±6 mV - PWM input H level VPWMH 2.5 - Vcc V Fig.2 PWM input L level VPWML 0 - 0.7 V Fig.3 FPWM 0.02 - 50 kHz Circuit current Input frequency Io＝250mA Output voltage VO - 0.4 0.6 V Input-output Gain GIO 45 48 51 dB VFGL - - 0.3 V IFG=3mA VFG=10V FG low voltage Upper and Lower total FIg.4,5 - Fig.6 FG leak current IFGL - - 20 μA Input hysteresis voltage VHYS ±5 ±10 ±15 mV Fig.7 Lock detection ON time TON 0.35 0.50 0.65 sec Fig.8 Lock detection OFF time TOFF 3.5 5.0 6.5 sec Fig.9 ◎BH6799FVM, BH6789FVM Parameter Circuit current Symbol Limit Min. Typ. Max. Unit Conditions Characteristics Icc - 5 8 mA Fig.10 VHOFS - - ±6 mV - Output voltage VO - 0.32 0.49 V Input-output Gain GIO 45 48 51 dB FG low voltage VFGL - - 0.3 V IFG=3mA Fig.13 AL low voltage VALL - - 0.3 V IAL=3mA Fig.14 Input hysteresis voltage VHYS ±5 ±10 ±15 mV Fig.15 Lock detection ON time TON 0.35 0.50 0.65 sec Fig.16 Lock detection OFF time TOFF 3.5 5.0 6.5 sec Fig.17 Hall bias voltage VHB 1.1 1.3 1.5 V Input offset voltage Io＝250mA Upper and Lower total Fig.11,12 - IHB=5mA Fig.18 ◎BH6766FVM Parameter Symbol Limit Unit Conditions Characteristics Min. Typ. Max. Icc - 5 8 mA Fig.19 VHOFS - - ±6 mV - Output voltage VO - 0.6 0.9 V Input-output Gain GIO 45 48 51 dB FG low voltage VFGL - - 0.3 V Input hysteresis voltage VHYS ±5 ±10 ±15 mV VHB 1.1 1.3 1.5 V Circuit current Input offset voltage Hall bias voltage 4/16 Io＝250mA Upper and Lower total Fig.20,21 - IFG=3mA Fig.22 Fig.23 IHB=5mA Fig.24 ●Reference Data ◎BD6989FVM BD6989FVM 95℃ 25℃ 4.0 -40℃ 3.0 2.0 1.0 2.5 PWM input H level, VPWMH[V] Operating Voltage Range -40℃ 2.0 25℃ 1.5 95℃ 1.0 0.5 0.0 Operating Voltage Range 4 6 8 0 2 4 6 8 95℃ 0.5 0.6 95℃ 0.4 25℃ -40℃ 0.2 0.3 0.4 0.5 0.6 -0.4 -0.6 25℃ 95℃ -0.8 0.7 0.1 -40℃ 5 0 -5 -40℃ 25℃ -10 95℃ -15 0.2 0.3 0.4 Operating Voltage Range 0.5 0.6 2 4 6 5V 8V 0.05 0.7 0 2 4 0.55 0.53 95℃ 25℃ -40℃ 0.48 0.45 0.43 8 Operating Voltage Range 5.75 5.50 5.25 95℃ 25℃ -40℃ 5.00 4.75 4.50 4.25 Operating Voltage Range 4.00 0 2 4 6 8 0 10 2 4 6 8 10 Supply voltage, Vcc[V] Supply voltage, Vcc[V] Fig.7 Input hysteresis voltage 10 BD6989FVM 6.00 0.40 10 Supply voltage, Vcc[V] 8 Fig.6 FG low voltage 0.58 0.50 6 FG current, IFG[mA] -20 0 2.9V 0.10 BD6989FVM 0.60 Lock detection ON time, TON[sec] 10 0.15 Fig.5 Output H voltage 95℃ 25℃ 10 BD6989FVM 0.20 Output current, Io[A] Fig.4 Output L voltage 15 8 0.00 0.0 BD6989FVM 6 Fig.3 PWM input L level -40℃ Output current, Io[A] 20 4 Supply voltage, Vcc[V] -1.0 0.1 2 -0.2 0.0 0.0 Operating Voltage Range 0 10 BD6989FVM 0.0 Output H voltage, VOH[V] 0.8 0.2 25℃ 1.0 Fig.2 PWM input H level BD6989FVM 1.0 -40℃ 1.5 Supply voltage, Vcc[V] Fig.1 Circuit current Output L voltage, VOL[V] 2.0 0.0 10 FG low voltage, VFGL[V] 2 Supply voltage, Vcc[V] Fig.9 Lock detection OFF time Fig.8 Lock detection ON time ◎BH6799FVM/BH6789FVM BH6799FVM/BH6789FVM 6 BH6799FVM/BH6789FVM 1.0 BH6799FVM/BH6789FVM 0.0 -40℃ 105℃ 25℃ 4 3 -40℃ 2 1 0.8 0.6 Output H voltage, VOH[V] Output L voltage, VOL [V] 5 Circuit current, Icc[mA] Input hysteresis voltage, VHYS [my] 2.5 0.0 0 BD6989FVM 3.0 Lock detection OFF time, TOFF[sec] Circuit current, Icc[mA] 5.0 BD6989FVM 3.0 PWM input L level, VPWML[V] 6.0 105℃ 0.4 25℃ 0.2 -40℃ Operating Voltage Range 0 2 4 6 Supply voltage, Vcc[V] Fig.10 Circuit current 8 -0.4 25℃ 105℃ -0.6 -0.8 -1.0 0.0 0 -0.2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Output current, Io[A] Fig.11 Output L voltage 5/16 0.7 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Output current, Io [A] Fig.12 Output H voltage 0.7 BH6799FVM 0.4 0.4 AL low voltage, VALL[V] 0.3 0.2 2.2V 0.1 0.3 0.2 2.2V 0.1 5V 5V 6V 0.0 6V 0.0 0 1 2 3 4 0 5 1 Fig.13 FG low voltage -40℃ 25℃ 0.4 0 105℃ 0.2 Operating Voltage Range 25℃ 105℃ -10 3 4 0.0 2.0 4.0 6.0 Operating Voltage Range 0 5 2 4 6 Fig.15 Input hysteresis voltage BH6799FVM/BH6789FVM BH6799FVM/BH6789FVM 1.6 105℃ 25℃ 6.5 -40℃ 6.0 5.5 25℃ 5.0 4.5 105℃ 4.0 3.5 8 Supply voltage, Vcc[V] 1.2 -40℃ 0.8 0.4 Operating Voltage Range 3.0 0.0 -40℃ -5 -15 2 7.0 Lock detection OFF time, TOFF[sec] Lock detection ON time, TON[sec] 0.8 0.6 25℃ -40℃ 5 Fig.14 AL low voltage BH6799FVM/BH6789FVM 1.0 105℃ 10 AL current, IAL[mA] FG current, IFG[mA] BH6799FVM 15 Hall bias voltage, VHB[V] FG low voltage, VFGL[V] BH6789FVM 0.5 Input hysteresis voltage, VHYS [mV] 0.5 0.0 0 8.0 2 4 6 8 0 Supply voltage, Vcc[V] Supply voltage, Vcc[V] Fig.16 Lock detection ON time Fig.17 Lock detection OFF time 2 4 6 8 10 Hall bias current, IHB[mA] Fig.18 Hall bias voltage ◎BH6766FVM Output L voltage, VOL [V] 105℃ 3 25℃ -40℃ 2 1 0.8 0.6 105℃ 0.4 25℃ 0.2 -40℃ Operating Voltage Range 0.0 0 0 2 4 6 0.1 0.2 BH6766FVM 0.3 0.2 2.2V 5V 6V 0 1 2 0.3 0.4 0.5 0.6 25℃ 105℃ -0.8 0.7 0.0 0.1 4 FG current, IFG[mA] Fig.22 FG low voltage 5 0.2 0.3 0.4 0.5 BH6766FVM 1.6 105℃ 25℃ 25℃ 10 -40℃ 5 Operating Voltage Range 0 -5 -40℃ -10 25℃ -15 0.7 Fig.21 Output H voltage 105℃ 15 0.6 Output current, Io [A] 1.2 -40℃ 0.8 0.4 105℃ 0.0 -20 3 -0.6 BH6766FVM 20 Input hysteresis voltage, VHYS [mV] FG low voltage, VFGL[V] 0.4 0.0 -0.4 Fig.20 Output L voltage Fig.19 Circuit current 0.1 -40℃ Output current, Io[A] Supply voltage, Vcc[V] 0.5 -0.2 -1.0 0.0 8 BH6766FVM 0.0 Hall bias voltage, VHB[V] Circuit current, Icc[mA] 5 4 BH6766FVM 1.0 Output H voltage, VOH[V] BH6766FVM 6 0 2 4 6 8 Supply voltage, Vcc[V] Fig.23 Input hysteresis voltage 6/16 0 2 4 6 8 Hall bias current, IHB[mA] Fig.24 Hall bias voltage 10 ●Block diagram, application circuit, and pin assignment(Constant etc are for reference) ◎BD6989FVM Take a measure against Vcc voltage rise due to reverse M connection of power supply and back electromotive force. P.12 OUT2 GND 1 500Ω Incorporates soft switching function. Adjust at an optimum value because gradient of 8 150kΩ Vcc + OUT1 OSC 2 7 Lock Protection switching of output waveform depends on hall element output. VCC Control 90kΩ H+ P.10 3 TSD HALL 10kΩ 500Ω 150kΩ 4 PIN No. Terminal name 1 2 3 4 5 6 7 8 OUT2 Vcc H+ HFG PWM OUT1 GND P.11 FG This is an open collector output. Connect a pull-up resistor. 5 + - input is enabled. Input frequency must be 50kHz at the maximum. 6 + - H- OSC : Internal reference oscillation circuit TSD : Thermal shutdown (heat rejection circuit) PWM Speed control by PWM P.13 Function Motor output terminal 2 Power supply terminal Hall input terminal+ Hall input terminalFG signal output terminal PWM signal input terminal Motor output terminal 1 GND terminal ◎BH6799FVM, BH6789FVM Incorporates soft switching OUT2 function. Adjust at an optimum value because gradient of switching of output waveform depends on hall element output. GND 150kΩ 1 500Ω H+ P.10 2 Lock Protection HB HALL OUT1 TSD + - 500Ω 3 Hall Bias H- 4 M + OSC 8 OSC : Internal reference oscillation circuit TSD : Thermal shutdown (heat rejection circuit) 7 Take a measure against Vcc voltage rise due to reverse connection of power supply and back electromotive force. P.12 Vcc 6 150kΩ FG/AL + 5 - This is an open collector output. Connect a pull-up resistor. P.13 PIN No. Terminal name 1 2 3 4 5 6 7 8 OUT2 H+ HB HFG/AL Vcc OUT1 GND Function Motor output terminal 2 Hall input terminal+ Hall bias terminal Hall input terminalFG/AL signal output terminal Power supply terminal Motor output terminal 1 GND terminal 7/16 ◎BH6766FVM TSD: Incorporates soft switching OUT2 function. Adjust at an optimum value because gradient of switching of output waveform depends on hall element output. 500Ω 2 + Hall Bias Take a measure against Vcc voltage rise due to reverse connection of power supply and back electromotive force. 7 P.12 + Vcc - 3 M OUT1 TSD HB HALL 8 - H+ P.10 Thermal shutdown (heat rejection circuit) GND 150kΩ 1 6 500Ω 150kΩ H- FG - 4 5 + This is an open collector output. Connect a pull-up resistor. P.13 PIN No. Terminal name 1 2 3 4 5 6 7 8 OUT2 H+ HB HFG Vcc OUT1 GND Function Motor output terminal 2 Hall input terminal+ Hall bias terminal Hall input terminalFG signal output terminal Power supply terminal Motor output terminal 1 GND terminal ●Truth table ◎BD6989FVM H+ H- PWM OUT1 OUT2 FG H L H L L H L H H(OPEN) H(OPEN) L L H L L L L H L L L(Output Tr：ON) H(Output Tr：OFF) L(Output Tr：ON) H(Output Tr：OFF) ◎BH6779FVM,BH6789FVM H+ H- OUT1 OUT2 FG H L L H H L L H L(Output Tr：ON) H(Output Tr：OFF) H+ H- OUT1 OUT2 FG H L L H H L L H H(Output Tr：OFF) L(Output Tr：ON) ◎BH6766FVM 8/16 ●Description of operations Function table Lock protection and auto restart circuit Soft switching PWM speed control FG output AL output BD6989FVM BH6799FVM BH6789FVM 〇 〇 〇 〇 〇 〇 〇 〇 BH6766FVM Reference page P.9 P.10 P.11 P.13 P.13 〇 〇 〇 〇 1) Lock protection and automatic restart circuit ＜BD6989FVM、BH6799FVM、BH6789FVM＞ Motor rotation is detected by hall signal, and lock detection ON time (TON) and lock detection OFF time (TOFF) are set by IC internal counter. External part (C or R) is not required. Timing chart is shown in Fig.25. Idling H+ OUT1 TON OUT2 Output Tr OFF ON Depends on hall signal. (H in this figure) FG ＜BD6989FVM,BH6799FVM＞ Hi (Open collector) AL ＜BH6789FVM＞ Motor locking Lock detection Lock release Recovers normal operation. Fig.25 Lock protection timing chart ＊ In the case of BD6989FVM, lock protection function is turned off when the time of PWM = L has elapsed more than 66.5 ms (typ.) in order to disable lock protection function when the motor is stopped by PWM input signal. PWM 66.5ms(typ.) Lock protection function Control signal (internal signal) ON OFF ON Fig.26 PWM signal and lock protection operation ＜BD6989FVM＞ When H level duty of PWM input signal is close to 0%, lock protection function does not work at an input frequency slower than 15Hz (typ.), therefore enter a frequency faster than 20Hz. 9/16 2) Soft switching (silent drive setting) Input signal to hall amplifier is amplified to produce an output signal. When the hall element output signal is small, the gradient of switching of output waveform is gentle; When it is large, the gradient of switching of output waveform is steep. Gain of 300 times (typ.) is provided between input and output. Enter an appropriate hall element output to IC where output waveform swings sufficiently. (H+)-(H-) OUT1 Fig.27 Relation between hall element output amplitude and output waveform 3) Hall input setting Hall input voltage range is shown in operating conditions. Vcc Hall input voltage range Hall input voltage range upper limit Hall input voltage range lower limit GND Fig.28 Hall input voltage range Adjust the value of hall element bias resistor R1 in Fig.29 so that the input voltage of a hall amplifier is input in "hall input voltage range" including signal amplitude. 〇Reducing the noise of hall signal Hall element may be affected by Vcc noise depending on the wiring pattern of board. In this case, place a capacitor like C1 in Fig.29. In addition, when wiring from the hall element output to IC hall input is long, noise may be loaded on wiring. In this case, place a capacitor like C2 in Fig.29. H- H+ HB H- H+ C2 RH Vcc C2 R1 Hall bias current ＝ HB / (R1 + RH) C1 RH Hall element R1 ＜BH6799FVM、BH6789FVM、BH6766FVM＞ ＜BD6989FVM＞ Fig.29 Application near of hall signal 10/16 Hall bias current ＝ Vcc / (R1 + RH) C1 4) PWM input ＜BD6989FVM＞ Rotation speed of motor can be changed by controlling ON/OFF of the upper output depending on duty of the signal input to PWM terminal. H+ PWM OUT1 OUT2 FG Fig.30 Timing chart in PWM control When the voltage input to PWM terminal applies H logic : normal operation L logic : H side output is off When PWM terminal is open, H logic is applied. PWM terminal has hysteresis of 400mV (typ.). ●Equivalent circuit Resistance is a typical value. ◎BD6989FVM 1) Hall input terminal, Motor output terminal 2)PWM signal input terminal Vcc Vcc 90kΩ 500Ω H+ H- PWM 10kΩ 500Ω 150kΩ 150kΩ Vcc 1kΩ 3)FG output terminal FG 1kΩ GND OUT1 OUT2 ◎BH6799FVM/BH6789FVM/ BH6766FVM 1) Hall input terminal, Motor output terminal 2) Hall bias terminal Vcc Vcc 500Ω H+ H500Ω HB 150kΩ 150kΩ Vcc 1kΩ 3) FG output terminal or AL output terminal FG or AL 1kΩ GND OUT1 OUT2 11/16 ●Safety measure 1) Reverse connection protection diode Reverse connection of power results in IC destruction as shown in Fig.31. When reverse connection is possible, reverse connection protection diode must be added between power supply and Vcc. Reverse power connection In normal energization Vcc After reverse connection destruction prevention Vcc Vcc Circuit block Circuit block Each pin Each pin Circuit block GND Large current flows Æ Thermal destruction GND Internal circuit impedance high Æ amperage small Each pin GND No destruction Fig.31 Flow of current when power is connected reversely 2) Measure against Vcc voltage rise by back electromotive force Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse connection protection diode is connected, Vcc voltage rises because the diode prevents current flow to power supply. ON ON ON Phase switching ON Fig.32 Vcc voltage rise by back electromotive force When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (A) Capacitor or (B) Zenner diode between Vcc and GND. If necessary, add both (C). (A) Capacitor (B) Zenner diode ON ON ON ON (C) Capacitor and zenner diode ON ON Fig.33 Measure against Vcc voltage rise 12/16 3) Problem of GND line PWM switching Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum. Vcc M Motor Driver GND Controller PWM input Prohibite Fig.34 GND Line PWM switching prohibited 4) FG and AL output FG and AL output is an open collector and requires pull-up resistor. The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG or AL output terminal is directly connected to power supply, could damage the IC. Vcc FG /AL Pull-up resistor Protection resistor R1 Connector of board Fig.35 Protection of FG and AL terminal ●Calculation of power consumed by IC Vcc Power consumed by this IC Pc is approximately calculated as follows: Icc FG IFG Pc=Pc1+Pc2+Pc3 ・Pc1：Power consumption by circuit current Pc1=Vcc×Icc OUT1 Io ・Pc2：Power consumption at output stage Pc2=VOL×Io+VOH×Io VOL is L voltage of output terminal 1 and 2. VOH is H voltage of output terminal 1 and 2. Io is the current flowing to output terminal 1 and 2. OUT2 Fig.36 Calculation of power consumed by IC ・Pc3：Power consumption at FG and AL Pc3=VFG×IFG＋VAL×IAL VFG is L voltage of FG output. VAL is L voltage of AL output. IFG and IAL are the current of FG and AL. Power consumption by IC greatly changes with use condition of IC such as power supply voltage and output current. Consider thermal design so that the maximum power dissipation on IC package is not exceeded. 13/16 ●Thermal derating curve Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θja [℃/W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.37 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja ＝ (Tj－Ta) / P [℃/W] Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at a specified condition. Fig.38 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70 [mm] x 1.6 [mm] (copper foil area below 3 [%])) θja = (Tj-Ta) / P [℃/W] Ambient temperature Ta[℃] Chip surface temperature Tj[℃] Power consumption P[W] Fig.37 Thermal resistance Pd(mW) 700 600 585 500 400 300 BD6989FVM、BH6799FVM BH6789FVM、BH6766FVM 200 100 0 ＊ 25 50 75 100 105 125 150 Reduce by 4.68 mW/°C over 25°C. (70.0mm×70.0mm×1.6mm glass epoxy board) Fig.38 Thermal derating curve 14/16 Ta(℃) ●Cautions on use 1) Absolute maximum ratings An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) GND potential The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. 9) Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11) GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100uF. 13) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. 14) In use We are sure that the example of application circuit is preferable, but please check the character further more in application to a part which requires high precision. In using the unit with external circuit constant changed, consider the variation of externally equipped parts and our IC including not only static character but also transient character and allow sufficient margin in determining. 15/16 ●Ordering part number ・Please order by ordering part number.・Please confirm the combination of each items.・Please write the letter close to left when column is blank. B D 6 9 9 F Package Type Part Number V M ― T R TR Emboss tape reel Pin 1 opposite draw-out side ・FVM ：MSOP8 ・BH6799 ・BD6989 ・BH6789 8 ・BH6766 ●PHYSICAL DIMENSION MSOP8 <Dimension> <Tape and Reel information> 5 1 4 0.29 ± 0.15 0.6 ± 0.2 8 2.8 ± 0.1 4.0 ± 0.2 2.9 ± 0.1 0.9Max. 0.75 ± 0.05 0.08 ± 0.05 Embossed carrier tape Quantity 3000pcs Direction of feed TR (The direction is the 1pin of product is at the upper light when you hold reel on the left hand and you pull out the tape on the right hand) 0.145 +0.05 −0.03 0.475 0.22 0.65 Tape +0.05 −0.04 0.08 M X X X X X X X 0.08 S X X X X X X X X X X X X X X 1Pin X X X X X X X X X X X X X X Direction of feed Reel (Unit:mm) ※When you order , please order in times the amount of package quantity. Catalog No.06T263A '07.1 ROHM © 1000 NZ Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2008 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev2.0