Document Number: MMG3014NT1 Rev. 4, 8/2014 Freescale Semiconductor Technical Data Heterojunction Bipolar Transistor Technology (InGaP HBT) MMG3014NT1 Broadband High Linearity Amplifier The MMG3014NT1 is a general purpose amplifier that is internally input matched and internally output prematched. It is designed for a broad range of Class A, small--signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 40 to 4000 MHz such as cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small--signal RF. 40--4000 MHz, 19.5 dB 25 dBm InGaP HBT GPA Features Frequency: 40--4000 MHz P1dB: 25 dBm @ 900 MHz Small--Signal Gain: 19.5 dB @ 900 MHz Third Order Output Intercept Point: 40.5 dBm @ 900 MHz Single 5 V Supply Active Bias Cost--effective SOT--89 Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel. Table 1. Typical Performance (1) SOT--89 Table 2. Maximum Ratings Rating Characteristic Symbol 900 MHz 2140 MHz 3500 MHz Unit Small--Signal Gain (S21) Gp 19.5 15 10 dB Input Return Loss (S11) IRL --25 --12 --8 dB Output Return Loss (S22) ORL --11 --13 --19 dB Power Output @1dB Compression P1dB 25 25.8 25 dBm Third Order Output Intercept Point OIP3 40.5 40.5 40 dBm Symbol Value Unit Supply Voltage VCC 6 V Supply Current ICC 300 mA RF Input Power Pin 25 dBm Storage Temperature Range Tstg --65 to +150 C Junction Temperature TJ 175 C 1. VCC = 5 Vdc, TA = 25C, 50 ohm system, application circuit tuned for specified frequency. Table 3. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Case Temperature 81C, 5 Vdc, 135 mA, no RF applied Symbol Value (2) Unit RJC 27.4 C/W 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1955. Freescale Semiconductor, Inc., 2008, 2011, 2014. All rights reserved. RF Device Data Freescale Semiconductor, Inc. MMG3014NT1 1 Table 4. Electrical Characteristics (VCC = 5 Vdc, 900 MHz, TA = 25C, 50 ohm system, in Freescale Application Circuit) Symbol Min Typ Max Unit Small--Signal Gain (S21) Gp 18.5 19.5 — dB Input Return Loss (S11) IRL — --25 — dB Output Return Loss (S22) ORL — --11 — dB Power Output @ 1dB Compression P1dB — 25 — dBm Third Order Output Intercept Point OIP3 — 40.5 — dBm Characteristic Noise Figure NF — 5.7 — dB Supply Current ICC 110 135 160 mA Supply Voltage VCC — 5 — V Table 5. Functional Pin Description 2 Pin Number Pin Function 1 RFin 2 Ground 3 RFout/DC Supply 1 2 3 Figure 1. Functional Diagram Table 6. ESD Protection Characteristics Test Conditions/Test Methodology Class Human Body Model (per JESD22--A114) 1B Machine Model (per EIA/JESD22--A115) A Charge Device Model (per JESD22--C101) IV Table 7. Moisture Sensitivity Level Test Methodology Per JESD22--A113, IPC/JEDEC J--STD--020 Rating Package Peak Temperature Unit 1 260 C MMG3014NT1 2 RF Device Data Freescale Semiconductor, Inc. 50 OHM TYPICAL CHARACTERISTICS 0 20 S11 S11, S22 (dB) Gp, SMALL--SIGNAL GAIN (dB) 25 15 TC = --40C 25C 85C VCC = 5 Vdc 5 --10 0 1 2 3 0 4 1 2 4 3 f, FREQUENCY (GHz) f, FREQUENCY (GHz) Figure 2. Small--Signal Gain (S21) versus Frequency Figure 3. Input/Output Return Loss versus Frequency 23 26 P1dB, 1 dB COMPRESSION POINT (dBm) VCC = 5 Vdc 21 900 MHz 19 17 1960 MHz 15 2140 MHz 13 2600 MHz 11 3500 MHz 9 6 10 1 1.5 2 2.5 3 Pout, OUTPUT POWER (dBm) f, FREQUENCY (GHz) Figure 4. Small--Signal Gain versus Output Power Figure 5. P1dB versus Frequency 180 160 140 120 100 80 60 40 20 0 VCC = 5 Vdc 0.5 26 22 200 0 25 24 18 14 1 2 3 4 5 VCC, COLLECTOR VOLTAGE (V) Figure 6. Collector Current versus Collector Voltage 6 OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) Gp, SMALL--SIGNAL GAIN (dB) S22 10 VCC = 5 Vdc ICC, COLLECTOR CURRENT (mA) --5 3.5 42 40 VCC = 5 Vdc 1 MHz Tone Spacing 38 0 1 2 3 4 f, FREQUENCY (GHz) Figure 7. Third Order Output Intercept Point versus Frequency MMG3014NT1 RF Device Data Freescale Semiconductor, Inc. 3 42 40 f = 900 MHz 1 MHz Tone Spacing 38 4.5 4.9 4.7 5.3 5.1 5.5 VCC, COLLECTOR VOLTAGE (V) OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 50 OHM TYPICAL CHARACTERISTICS 42 40 VCC = 5 Vdc f = 900 MHz 1 MHz Tone Spacing 38 --40 --20 20 40 60 80 100 T, TEMPERATURE (_C) Figure 9. Third Order Output Intercept Point versus Case Temperature Figure 8. Third Order Output Intercept Point versus Collector Voltage 105 --30 MTTF (YEARS) --40 --50 --60 --80 103 10 13 16 19 22 120 25 125 130 135 140 145 Pout, OUTPUT POWER (dBm) TJ, JUNCTION TEMPERATURE (C) Figure 10. Third Order Intermodulation versus Output Power NOTE: The MTTF is calculated with VCC = 5 Vdc, ICC = 135 mA 8 6 4 2 VCC = 5 Vdc 0 0 1 2 3 150 Figure 11. MTTF versus Junction Temperature 10 NF, NOISE FIGURE (dB) 104 VCC = 5 Vdc f = 900 MHz 1 MHz Tone Spacing --70 4 ACPR, ADJACENT CHANNEL POWER RATIO (dBc) IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc) 0 --20 --30 VCC = 5 Vdc, f = 2140 MHz Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth Input Signal PAR = 8.5 dB @ 0.01% Probability on CCDF --40 --50 --60 --70 10 13 16 19 22 f, FREQUENCY (GHz) Pout, OUTPUT POWER (dBm) Figure 12. Noise Figure versus Frequency Figure 13. Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power 25 MMG3014NT1 4 RF Device Data Freescale Semiconductor, Inc. 50 OHM APPLICATION CIRCUIT: 800--1000 MHz VSUPPLY R1 C4 C3 L1 RF INPUT Z1 Z2 Z3 DUT Z4 Z6 C5 Z7 Z8 C2 VCC C1 Z1, Z8 Z2, Z7 Z3 Z4 Z5 RF OUTPUT C6 C7 0.274 x 0.058 Microstrip 0.073 x 0.058 Microstrip 0.066 x 0.058 Microstrip 0.509 x 0.058 Microstrip Z5 Z6 PCB 0.172 x 0.058 Microstrip 0.403 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 14. 50 Ohm Test Circuit Schematic 30 S21 20 R1 S21, S11, S22 (dB) 10 0 C1 S22 --10 C6 L1 C4 C3 C2 C5 C7 --20 S11 --30 --40 700 MMG30XX Rev 2 VCC = 5 Vdc 800 900 1000 1100 f, FREQUENCY (MHz) Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 220 pF Chip Capacitors C0805C221J5GAC Kemet C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet C4 2.2 F Chip Capacitor C0805C225J4RAC Kemet C5 0.2 pF Chip Capacitor 12065J0R2BS AVX C6 4.7 pF Chip Capacitor C0603C479J5GAC Kemet C7 1.8 pF Chip Capacitor C1206C189D5GAC Kemet L1 10 nH Chip Inductor HK160810NJ--T Taiyo Yuden R1 0 Chip Resistor ERJ3GEY0R00V Panasonic MMG3014NT1 RF Device Data Freescale Semiconductor, Inc. 5 50 OHM APPLICATION CIRCUIT: 1800--2200 MHz VSUPPLY R1 C4 C3 L1 RF INPUT Z1 Z2 DUT Z3 Z4 Z5 Z6 C2 VCC C1 C5 Z1, Z7 Z2 Z3 Z4 Z7 RF OUTPUT C6 0.347 x 0.058 Microstrip 0.399 x 0.058 Microstrip 0.176 x 0.058 Microstrip 0.172 x 0.058 Microstrip Z5 Z6 PCB 0.162 x 0.058 Microstrip 0.241 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 17. 50 Ohm Test Circuit Schematic 20 S21 R1 S21, S11, S22 (dB) 10 C1 0 C5 L1 C4 C3 S11 --10 --20 1600 C6 S22 VCC = 5 Vdc 1800 2000 2200 C2 MMG30XX Rev 2 2400 f, FREQUENCY (MHz) Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 9. 50 Ohm Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 22 pF Chip Capacitors C0805C220J5GAC Kemet C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet C4 2.2 F Chip Capacitor C0805C225J4RAC Kemet C5 1.5 pF Chip Capacitor C0603C159J5RAC Kemet C6 1.1 pF Chip Capacitor C0603C119J5GAC Kemet L1 15 nH Chip Inductor HK160815NJ--T Taiyo Yuden R1 0 Chip Resistor ERJ3GEY0R00V Panasonic MMG3014NT1 6 RF Device Data Freescale Semiconductor, Inc. 50 OHM APPLICATION CIRCUIT: 2300--2700 MHz VSUPPLY R1 C4 C3 L1 RF INPUT Z1 Z2 DUT Z3 Z4 Z5 Z7 C2 VCC C1 C5 Z1, Z7 Z2 Z3 Z4 Z6 RF OUTPUT C6 0.347 x 0.058 Microstrip 0.488 x 0.058 Microstrip 0.087 x 0.058 Microstrip 0.136 x 0.058 Microstrip Z5 Z6 PCB 0.036 x 0.058 Microstrip 0.403 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 20. 50 Ohm Test Circuit Schematic 20 S21 S21, S11, S22 (dB) 10 R1 0 C1 L1 S11 --10 C4 C3 C2 C5 C6 --20 VCC = 5 Vdc --30 2100 S22 2300 2500 MMG30XX Rev 2 2700 2900 f, FREQUENCY (MHz) Figure 21. S21, S11 and S22 versus Frequency Figure 22. 50 Ohm Test Circuit Component Layout Table 10. 50 Ohm Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 22 pF Chip Capacitors C0805C220J5GAC Kemet C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet C4 2.2 F Chip Capacitor C0805C225J4RAC Kemet C5, C6 1.1 pF Chip Capacitors C0603C119J5GAC Kemet L1 15 nH Chip Inductor HK160815NJ--T Taiyo Yuden R1 0 Chip Resistor ERJ3GEY0R00V Panasonic MMG3014NT1 RF Device Data Freescale Semiconductor, Inc. 7 50 OHM APPLICATION CIRCUIT: 3400--3600 MHz VSUPPLY R1 C4 C3 L1 RF INPUT Z1 Z2 Z3 DUT Z4 Z6 Z7 C5 Z8 C2 VCC C1 Z1, Z8 Z2 Z3 Z4, Z5 Z5 RF OUTPUT C6 C7 0.347 x 0.058 Microstrip 0.068 x 0.058 Microstrip 0.419 x 0.058 Microstrip 0.088 x 0.058 Microstrip Z6 Z7 PCB 0.084 x 0.058 Microstrip 0.403 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 23. 50 Ohm Test Circuit Schematic 20 S21 S21, S11, S22 (dB) 10 R1 0 C1 S11 C5 C4 C3 L1 C2 C6 --10 C7 S22 --20 VCC = 5 Vdc --30 3400 MMG30XX Rev 2 3450 3500 3550 3600 f, FREQUENCY (MHz) Figure 24. S21, S11 and S22 versus Frequency Figure 25. 50 Ohm Test Circuit Component Layout Table 11. 50 Ohm Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1 3.3 pF Chip Capacitor C0805C339J5GAC Kemet C2 2.0 pF Chip Capacitor C0805C209J5GAC Kemet C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet C4 2.2 F Chip Capacitor C0805C225J4RAC Kemet C5 0.6 pF Chip Capacitor 06035J0R6BS AVX C6 0.9 pF Chip Capacitor 06035J0R9BS AVX C7 0.8 pF Chip Capacitor 06035J0R8BS AVX L1 56 nH Chip Inductor HK160856NJ--T Taiyo Yuden R1 0 Chip Resistor ERJ3GEY0R00V Panasonic MMG3014NT1 8 RF Device Data Freescale Semiconductor, Inc. 50 OHM TYPICAL CHARACTERISTICS Table 12. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25C, 50 Ohm System) S11 S21 S12 S22 f MHz |S11| |S21| |S12| |S22| 250 0.622 174.6 10.280 153.8 0.0336 0.6 0.448 --171.6 300 0.618 174.0 10.107 148.3 0.0336 0.3 0.457 --171.9 350 0.616 173.4 9.933 143.1 0.0337 --0.1 0.465 --172.5 400 0.613 173.0 9.760 138.3 0.0337 --0.4 0.475 --173.3 450 0.611 172.5 9.586 133.8 0.0338 --0.6 0.483 --174.0 500 0.611 172.0 9.300 129.8 0.0338 --0.8 0.490 --174.9 550 0.610 171.4 9.009 126.0 0.0339 --1.0 0.497 --175.8 600 0.610 170.9 8.716 122.4 0.0339 --1.2 0.503 --176.8 650 0.610 170.4 8.363 119.2 0.0340 --1.4 0.508 --177.9 700 0.611 169.9 8.064 116.2 0.0340 --1.6 0.512 --178.9 750 0.615 169.5 7.734 113.3 0.0341 --1.7 0.517 176.5 800 0.618 171.8 7.403 110.9 0.0342 --1.8 0.526 175.5 850 0.621 171.4 7.073 108.4 0.0342 --1.9 0.533 174.5 900 0.625 170.9 6.838 106.0 0.0343 --2.0 0.536 173.5 950 0.624 170.2 6.629 103.7 0.0343 --2.2 0.536 172.6 1000 0.624 169.6 6.422 101.5 0.0344 --2.3 0.537 171.8 1050 0.624 168.9 6.227 99.4 0.0344 --2.5 0.537 170.9 1100 0.625 168.3 6.044 97.3 0.0346 --2.7 0.538 169.9 1150 0.626 167.6 5.866 95.4 0.0347 --2.8 0.538 169.1 1200 0.628 166.9 5.700 93.5 0.0349 --3.0 0.539 168.2 1250 0.629 166.1 5.545 91.7 0.0351 --3.2 0.540 167.3 1300 0.632 165.4 5.393 89.9 0.0352 --3.4 0.540 166.5 1350 0.634 164.6 5.257 88.2 0.0354 --3.6 0.541 165.6 1400 0.636 163.8 5.117 86.5 0.0355 --3.8 0.543 164.9 1450 0.640 163.0 4.988 84.8 0.0356 --4.0 0.544 164.1 1500 0.643 162.2 4.864 83.2 0.0357 --4.2 0.545 163.3 1550 0.646 161.3 4.742 81.7 0.0359 --4.4 0.547 162.6 1600 0.649 160.5 4.630 80.1 0.0360 --4.5 0.549 161.8 1650 0.653 159.7 4.517 78.6 0.0361 --4.8 0.550 161.1 1700 0.657 158.9 4.414 77.1 0.0362 --5.0 0.552 160.3 1750 0.661 158.0 4.312 75.6 0.0363 --5.2 0.554 159.6 1800 0.665 157.2 4.215 74.2 0.0364 --5.5 0.556 158.9 1850 0.669 156.4 4.123 72.7 0.0364 --5.7 0.557 158.2 1900 0.673 155.5 4.033 71.3 0.0365 --6.0 0.559 157.4 1950 0.677 154.7 3.947 69.8 0.0366 --6.3 0.560 156.7 2000 0.681 153.8 3.864 68.4 0.0367 --6.6 0.562 156.0 2050 0.685 153.0 3.783 67.0 0.0367 --6.9 0.563 155.2 2100 0.689 152.2 3.707 65.5 0.0368 --7.2 0.564 154.4 2150 0.693 151.3 3.633 64.1 0.0369 --7.6 0.564 153.6 2200 0.697 150.5 3.562 62.7 0.0369 --7.9 0.565 152.8 2250 0.701 149.6 3.494 61.3 0.0370 --8.3 0.565 152.0 2300 0.705 148.7 3.426 59.8 0.0371 --8.7 0.565 151.2 2350 0.709 147.8 3.363 58.4 0.0371 --9.1 0.564 150.3 (continued) MMG3014NT1 RF Device Data Freescale Semiconductor, Inc. 9 50 OHM TYPICAL CHARACTERISTICS Table 12. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25C, 50 Ohm System) (continued) S11 S21 S12 S22 f MHz |S11| |S21| |S12| |S22| 2400 0.712 146.9 3.299 57.0 0.0372 --9.5 0.564 149.5 2450 0.715 146.0 3.240 55.6 0.0373 --9.9 0.563 148.6 2500 0.719 145.0 3.181 54.1 0.0373 --10.3 0.562 147.7 2550 0.722 144.1 3.124 52.7 0.0374 --10.8 0.562 146.8 2600 0.724 143.1 3.071 51.3 0.0374 --11.2 0.561 145.9 2650 0.728 142.2 3.017 49.9 0.0375 --11.6 0.560 145.0 2700 0.730 141.2 2.968 48.5 0.0376 --12.0 0.559 144.0 2750 0.733 140.2 2.920 47.1 0.0377 --12.4 0.559 143.1 2800 0.736 139.2 2.872 45.8 0.0378 --12.9 0.558 142.1 2850 0.738 138.2 2.828 44.4 0.0380 --13.4 0.557 141.1 2900 0.740 137.2 2.784 43.0 0.0381 --13.8 0.557 140.1 2950 0.742 136.2 2.743 41.7 0.0382 --14.4 0.557 139.1 3000 0.745 135.2 2.703 40.3 0.0384 --14.9 0.557 138.1 3050 0.747 134.2 2.664 39.0 0.0385 --15.4 0.557 137.1 3100 0.749 133.1 2.627 37.6 0.0386 --15.9 0.557 136.1 3150 0.751 132.1 2.590 36.3 0.0388 --16.4 0.557 135.1 3200 0.753 131.1 2.555 35.0 0.0389 --17.0 0.558 134.1 3250 0.756 130.1 2.521 33.7 0.0390 --17.5 0.558 133.2 3300 0.758 129.1 2.487 32.4 0.0391 --18.0 0.559 132.2 3350 0.760 128.1 2.455 31.1 0.0393 --18.5 0.560 131.3 3400 0.762 127.1 2.422 29.8 0.0394 --19.0 0.560 130.5 3450 0.764 126.1 2.392 28.6 0.0395 --19.5 0.561 129.6 3500 0.766 125.1 2.361 27.3 0.0396 --20.0 0.562 128.9 3550 0.768 124.2 2.331 26.1 0.0397 --20.5 0.563 128.1 3600 0.770 123.2 2.302 24.9 0.0398 --21.0 0.564 127.4 3650 0.772 122.3 2.273 23.7 0.0399 --21.4 0.565 126.7 3700 0.774 121.3 2.246 22.6 0.0400 --21.8 0.566 126.1 3750 0.775 120.4 2.218 21.5 0.0401 --22.2 0.567 125.6 3800 0.777 119.5 2.192 20.4 0.0403 --22.6 0.568 125.1 3850 0.778 118.6 2.167 19.2 0.0404 --23.0 0.569 124.6 3900 0.780 117.6 2.142 18.1 0.0405 --23.4 0.570 124.2 3950 0.781 116.7 2.118 17.1 0.0406 --23.9 0.571 123.7 4000 0.783 115.8 2.091 16.0 0.0407 --24.2 0.572 123.5 MMG3014NT1 10 RF Device Data Freescale Semiconductor, Inc. 1.90 3.00 2X 45 4.35 2X 1.25 3X 0.70 0.85 2X 1.50 Figure 26. PCB Pad Layout for SOT--89A M3014N YYWW Figure 27. Product Marking MMG3014NT1 RF Device Data Freescale Semiconductor, Inc. 11 PACKAGE DIMENSIONS MMG3014NT1 12 RF Device Data Freescale Semiconductor, Inc. MMG3014NT1 RF Device Data Freescale Semiconductor, Inc. 13 MMG3014NT1 14 RF Device Data Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier Biasing Software .s2p File Development Tools Printed Circuit Boards Reference Designs 2110--2170 MHz, 4 W, 28 V W--CDMA Smart Demo Reference Design (Devices MMG3014N, MW7IC2240N) For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office. REVISION HISTORY The following table summarizes revisions to this document. Revision Date Description 0 Apr. 2008 Initial Release of Data Sheet 1 Sept. 2008 Updated Fig. 15, “S21, S11 and S22 versus Frequency,” to correct S11 and S22 curve label transposition error, p. 6 Updated data in Table 12, “Common Emitter S-Parameters,” for better simulation response, pp. 9--10 2 Jan. 2011 Corrected temperature at which ThetaJC is measured from 25C to 81C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 Removed ICC bias callout from applicable graphs as bias is not a controlled value, pp. 4--9 Removed ICC bias callout from Table 12, Common Emitter S--Parameters heading as bias is not a controlled value, pp. 9--10 Added .s2p file and Printed Circuit Boards availability to Software and Tools, p. 16 Added Reference Design availability to Development Tools, p. 16 3 Oct. 2011 Table 1, Maximum Ratings, increased Input Power from 15 dBm to 25 dBm to reflect the true capability of the device, p. 1 Changed ESD Human Body Model rating from Class 1C to Class 1B to reflect recent ESD test results of the device, p. 2 Corrected part number for the C7 capacitor in Table 8, 50 Ohm Test Circuit Component Designations and Values, from C0603C189J5GAC to C1206C189D5GAC, p. 5. Replaced the PCB Pad Layout drawing, the package isometric and mechanical outline for Case 1514--02 (SOT--89) with Case 2142--01 (SOT--89) as a result of the device transfer from a Freescale wafer fab to an external GaAs wafer fab and new assembly site. The new assembly and test site’s SOT--89 package has slight dimensional differences, pp. 1, 11--14. Refer to PCN13337, GaAs Fab Transfer. 4 Aug. 2014 Table 2, Maximum Ratings: updated Junction Temperature from 150C to 175C to reflect recent test results of the device, p. 1 Added Failure Analysis information, p. 15 MMG3014NT1 RF Device Data Freescale Semiconductor, Inc. 15 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. E 2008, 2011, 2014 Freescale Semiconductor, Inc. MMG3014NT1 Document Number: MMG3014NT1 Rev. 4, 8/2014 16 RF Device Data Freescale Semiconductor, Inc.