MOTOROLA MMG3002NT1

MOTOROLA
Freescale Semiconductor, Inc.
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SEMICONDUCTOR TECHNICAL DATA
The RF MOSFET Line
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
MMG3002NT1
Broadband High Linearity Amplifier
Freescale Semiconductor, Inc.
The MMG3002NT1 is a General Purpose Amplifier that is internally
input and output matched. It is designed for a broad range of Class A,
small - signal, high linearity, general purpose applications. It is suitable for
applications with frequencies from 40 to 3600 MHz such as Cellular, PCS,
BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small - signal RF.
40 - 3600 MHz, 20 dB
21 dBm
InGaP HBT
Features
Frequency: 40 - 3600 MHz
P1dB: 21 dBm
Power Gain: 20 dB
Third Order Output Intercept Point: 37.5 dBm
Single Voltage Supply
Internally Matched to 50 Ohms
Low Cost SOT - 89 Surface Mount Package
Pb - Free Leads
In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel.
•
•
•
•
•
•
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TYPICAL PERFORMANCE (1)
Characteristic
12
3
CASE 1514 - 01, STYLE 1
SOT - 89
PLASTIC
MAXIMUM RATINGS
Symbol
900
MHz
2140
MHz
3500
MHz
Unit
Power Gain (S21)
Gp
20
18
14.5
dB
Input Return Loss
(S11)
IRL
- 16
- 26
- 16
dB
Output Return Loss
(S22)
ORL
- 12
-8
- 11
dB
Power Output @
1dB Compression
P1db
21
21
18.5
dBm
Third Order Output
Intercept Point
IP3
37.5
36
32
dBm
Rating
Symbol
Value
Unit
Supply Voltage (2)
VCC
7
V
Supply Current (2)
ICC
400
mA
RF Input Power
Pin
12
dBm
Storage Temperature Range
Tstg
- 65 to +150
°C
Junction Temperature (3)
TJ
150
°C
(2) Voltage and current applied to device.
(3) For reliable operation, the junction temperature should not exceed
150°C.
(1) VCC = 5.2 Vdc, TC = 25°C, 50 ohm system
THERMAL CHARACTERISTICS (VCC = 5.2 Vdc, ICC = 110 mA, TC = 25°C)
Characteristic
Thermal Resistance, Junction to Case
Symbol
Value (4)
Unit
RθJC
46.5
°C/W
(4) Refer to AN1955/D, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes - AN1955.
Rev. 2
MOTOROLA
RF DEVICE DATA
 Motorola,
Inc. 2004
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MoreInformation
InformationOn
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ThisProduct,
Product,
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MMG3002NT1
1
Freescale Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS (VCC = 5.2 Vdc, 900 MHz, TC = 25°C, 50 ohm system, in Motorola Application Circuit)
Symbol
Min
Typ
Max
Unit
Power Gain (S21)
Characteristic
Gp
19.3
20
—
dB
Input Return Loss (S11)
IRL
—
- 16
—
dB
Output Return Loss (S22)
ORL
—
- 12
—
dB
Power Output @ 1dB Compression
P1dB
—
21
—
dBm
Third Order Output Intercept Point
IP3
—
37.5
—
dBm
Noise Figure
NF
—
4.2
—
dB
Supply Current (1)
ICC
95
110
125
mA
Supply Voltage (1)
VCC
—
5.2
—
V
Freescale Semiconductor, Inc.
(1) For reliable operation, the junction temperature should not exceed 150°C.
MMG3002NT1
2
MOTOROLA RF DEVICE DATA
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Freescale Semiconductor, Inc.
FUNCTIONAL PIN DESCRIPTION
2
Pin
Number
1
2
3
Pin Function
1
RFin
2
Ground
3
RFout/DC Supply
Freescale Semiconductor, Inc.
FUNCTIONAL DIAGRAM
ESD PROTECTION CHARACTERISTICS
Test Conditions/Test Methodology
Class
Human Body Model (per JESD 22 - A114 - G)
1B (Minimum)
Machine Model (per EIA/JESD 22 - A115 - A)
A (Minimum)
Charge Device Model (per JESD 22 - C101- A)
IV (Minimum)
MOISTURE SENSITIVITY LEVEL
Test Methodology
Per JESD 22 - A113
Rating
1
MOTOROLA RF DEVICE DATA
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MMG3002NT1
3
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
25
0
−10
25°C
20
S11, S22 (dB)
Gp, POWER GAIN (dB)
S22
TC = 85°C
- 40°C
15
VCC = 5.2 Vdc
0
1
2
3
0
1
2
3
4
f, FREQUENCY (GHz)
f, FREQUENCY (GHz)
Figure 1. Unmatched Power Gain (S21) versus
Frequency
Figure 2. Unmatched Input/Output
Return Loss versus Frequency
P1dB, 1 dB COMPRESSION POINT (dBm)
24
900 MHz
19
2140 MHz
17
15
2600 MHz
3500 MHz, C5 = 0.1 pF
13
11
VCC = 5.2 Vdc
ICC = 110 mA
9
10
12
14
16
18
20
22
21
20
19
VCC = 5.2 Vdc
ICC = 110 mA
18
17
0.5
1
1.5
2
2.5
3
Pout, OUTPUT POWER (dBm)
f, FREQUENCY (GHz)
Figure 3. Power Gain versus Output Power
Figure 4. P1dB versus Frequency
160
140
120
100
80
60
40
20
0
4.6
23
22
4.7
4.8
4.9
5
5.1
5.2
5.3
5.4
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
21
Gp, POWER GAIN (dB)
VCC = 5.2 Vdc
ICC = 110 mA
−40
4
23
ICC, COLLECTOR CURRENT (mA)
S11
−30
10
Freescale Semiconductor, Inc.
−20
42
39
36
33
VCC = 5.2 Vdc
ICC = 110 mA
100 kHz Tone Spacing
30
27
0
1
2
3
VCC, COLLECTOR VOLTAGE (V)
f, FREQUENCY (GHz)
Figure 5. Collector Current versus Collector
Voltage
Figure 6. Third Order Output Intercept Point
versus Frequency
MMG3002NT1
4
3.5
MOTOROLA RF DEVICE DATA
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4
Freescale Semiconductor, Inc.
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
42
39
36
33
30
900 MHz
100 kHz Tone Spacing
27
5.1
5
5.2
5.3
5.4
VCC, COLLECTOR VOLTAGE (V)
41
40
39
38
37
VCC = 5.2 Vdc, ICC = 110 mA, 900 MHz
100 kHz Tone Spacing
8 Vdc Supply with 25 W Dropping Resistor
36
35
−40
0
20
40
60
80
100
T, TEMPERATURE (_C)
105
−30
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
−20
Figure 8. Third Order Output Intercept Point
versus Case Temperature
Figure 7. Third Order Output Intercept Point
versus Collector Voltage
MTTF (YEARS)
−40
−50
−60
104
103
VCC = 5.2 Vdc
ICC = 110 mA
900 MHz
100 kHz Tone Spacing
−70
102
−80
5
7
9
11
13
15
17
19
120
21
125
Pout, OUTPUT POWER (dBm)
6
4
2
VCC = 5.2 Vdc
ICC = 110 mA
0
0.5
1
1.5
2
2.5
3
135
140
145
150
NOTE: The MTTF is calculated with VCC = 5.2 Vdc, ICC = 110 mA
3.5
Figure 10. MTTF versus Junction Temperature
ACPR, ADJACENT CHANNEL POWER RATIO (dB)
8
0
130
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Third Order Intermodulation versus
Output Power
NF, NOISE FIGURE (dB)
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
4
−20
−30
−40
−50
VCC = 5.2 Vdc, ICC = 110 mA, f = 2140 MHz
Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth
Peak/Avg. = 8.5 dB @ 0.01% Probability (CCDF)
−60
−70
9
11
13
15
17
f, FREQUENCY (GHz)
Pout, OUTPUT POWER (dBm)
Figure 11. Noise Figure versus Frequency
Figure 12. Single - Carrier W - CDMA Adjacent
Channel Power Ratio versus Output Power
MOTOROLA RF DEVICE DATA
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19
MMG3002NT1
5
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 40- 800 MHz
VSUPPLY
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
Z1, Z5
Z2
Z3
Z4
Z5
VCC
C2
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.172″ x 0.058″ Microstrip
Z4
PCB
0.403″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, εr = 4.1
Figure 13. 50 Ohm Test Circuit Schematic
30
S21
20
R1
10
S21, S11, S22 (dB)
Freescale Semiconductor, Inc.
C1
Z3
RF
OUTPUT
C4
C3
0
L1
−10
−20
C2
C1
S22
S11
VCC = 5.2 Vdc
ICC = 110 mA
−30
MMG30XX
Rev 1
−40
0
200
400
600
800
f, FREQUENCY (MHz)
Figure 14. S21, S11 and S22 versus Frequency
Figure 15. 50 Ohm Test Circuit Component Layout
Table 1. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
0.01 µF Chip Capacitors
0603A103JAT2A
AVX
C3
0.1 µF Chip Capacitor
0603A102JAT2A
AVX
C4
1 µF Chip Capacitor
0603A105JAT2A
AVX
L1
470 nH Chip Inductor
BK2125HM471
Taiyo Yuden
R1
7.5 W Chip Resistor
RK73B2AT7R5J
KOA Speer
Table 2. Supply Voltage versus R1 Values
Supply Voltage
6
7
8
9
10
11
12
V
R1 Value
7.3
16
25
35
44
53
62
Ω
NOTE: To provide VCC = 5.2 Vdc and ICC = 110 mA at the device.
MMG3002NT1
6
MOTOROLA RF DEVICE DATA
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Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 800 - 3400 MHz
VSUPPLY
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
Z1, Z5
Z2
Z3
Z4
Z5
VCC
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.172″ x 0.058″ Microstrip
C2
Z4
PCB
0.403″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, εr = 4.1
Figure 16. 50 Ohm Test Circuit Schematic
30
S21
20
S21, S11, S22 (dB)
Freescale Semiconductor, Inc.
C1
Z3
RF
OUTPUT
R1
10
C4
C3
L1
0
C2
C1
S22
−10
−20
S11
−30
800
1200
1600
2000
VCC = 5.2 Vdc
ICC = 110 mA
2400
2800
3200
MMG30XX
Rev 1
3600
f, FREQUENCY (MHz)
Figure 17. S21, S11 and S22 versus Frequency
Figure 18. 50 Ohm Test Circuit Component Layout
Table 3. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
150 pF Chip Capacitors
0603A151JAT2A
AVX
C3
0.1 µF Chip Capacitor
0603A102JAT2A
AVX
C4
1 µF Chip Capacitor
0603A105JAT2A
AVX
L1
56 nH Chip Inductor
HK160856NJ - T
Taiyo Yuden
R1
7.5 W Chip Resistor
RK73B2AT7R5J
KOA Speer
MOTOROLA RF DEVICE DATA
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MMG3002NT1
7
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 3.4 - 3.6 GHz
VSUPPLY
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
Z1, Z6
Z2
Z3
Z4
Z5
Z6
C5
VCC
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.086″ x 0.058″ Microstrip
Z4
Z5
PCB
C2
0.085″ x 0.058″ Microstrip
0.404″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, εr = 4.1
Figure 19. 50 Ohm Test Circuit Schematic
20
S21
10
S21, S11, S22 (dB)
Freescale Semiconductor, Inc.
C1
Z3
RF
OUTPUT
R1
VCC = 5.2 Vdc
ICC = 110 mA
C4
C3
0
L1
S22
C2
C1
−10
C5
S11
−20
MMG30XX
Rev 1
−30
3200
3300
3400
3500
3600
3700
3800
f, FREQUENCY (MHz)
Figure 20. S21, S11 and S22 versus Frequency
Figure 21. 50 Ohm Test Circuit Component Layout
Table 4. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
150 pF Chip Capacitors
0603A151JAT2A
AVX
C3
0.1 µF Chip Capacitor
0603A102JAT2A
AVX
C4
1 µF Chip Capacitor
0603A105JAT2A
AVX
C5 (1)
0.1 pF Chip Capacitor for 3400 - 3600 MHz
06035J0R1BBT
AVX
L1
39 nH Chip Inductor
HK160839NJ - T
Taiyo Yuden
R1
7.5 W Chip Resistor
RK73B2AT7R5J
KOA Speer
(1) Tuning capacitor: Capacitor value and location on the transmission line are varied for different frequencies.
MMG3002NT1
8
MOTOROLA RF DEVICE DATA
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Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
Freescale Semiconductor, Inc.
Table 5. Class A Common Emitter S - Parameters at VCC = 5.2 Vdc, ICC = 110 mA, TC = 255C
S11
S21
S12
S22
f
GHz
|S11|
∠φ
|S21|
∠φ
|S12|
∠φ
|S22|
∠φ
0.1
0.05966
176.181
10.25158
174.805
0.07235
- 0.722
0.04946
- 167.612
0.15
0.07228
- 178.627
9.96687
171.111
0.07071
- 1.821
0.0953
- 129.396
0.2
0.09041
151.476
10.46556
167.719
0.07464
- 3.053
0.05913
- 124.668
0.25
0.0909
149.96
10.36837
164.949
0.07424
- 3.553
0.08015
- 125.378
0.3
0.08882
145.472
10.30366
162.017
0.07406
- 4.277
0.09694
- 122.814
0.35
0.08508
140.833
10.2505
158.995
0.07407
- 4.934
0.11062
- 121.876
0.4
0.08377
136.078
10.17971
156.158
0.07405
- 5.7
0.12723
- 122.007
0.45
0.08191
131.492
10.10383
153.293
0.07365
- 6.307
0.14156
- 122.555
0.5
0.07982
125.857
10.02536
150.437
0.07358
- 7.037
0.15558
- 123.436
0.55
0.07776
120.816
9.94165
147.642
0.07346
- 7.676
0.1685
- 124.8
0.6
0.0773
115.435
9.85596
144.898
0.07336
- 8.2
0.18177
- 126.796
0.65
0.07677
110.371
9.76098
142.109
0.07321
- 8.911
0.19472
- 128.506
0.7
0.07664
104.874
9.6623
139.374
0.07301
- 9.464
0.20662
- 130.47
0.75
0.07628
100.112
9.56168
136.692
0.0729
- 10.069
0.21833
- 132.663
0.8
0.07619
95.73
9.45426
134.024
0.07275
- 10.618
0.22977
- 134.835
0.85
0.07601
91.72
9.34921
131.391
0.07273
- 11.184
0.24125
- 137.084
0.9
0.07567
87.313
9.23967
128.792
0.07257
- 11.821
0.25232
- 139.685
0.95
0.07642
83.036
9.13144
126.149
0.07238
- 12.312
0.26303
- 142.257
1
0.07619
80.021
9.01205
123.659
0.07228
- 12.88
0.27394
- 144.736
1.05
0.07666
76.201
8.90327
121.137
0.07218
- 13.474
0.28332
- 147.346
1.1
0.07678
73.008
8.78013
118.657
0.07202
- 13.93
0.29417
- 150.042
1.15
0.07673
70.68
8.66342
116.191
0.0719
- 14.519
0.30394
- 152.767
1.2
0.07674
68.773
8.53991
113.779
0.07178
- 15.062
0.31393
- 155.358
1.25
0.07628
66.216
8.42251
111.392
0.07176
- 15.551
0.32286
- 157.992
1.3
0.07618
64.635
8.30514
109.034
0.07164
- 16.115
0.33259
- 160.483
1.35
0.07454
62.959
8.18109
106.673
0.07149
- 16.539
0.34127
- 162.981
1.4
0.07373
60.65
8.06498
104.367
0.07152
- 17.114
0.34972
- 165.377
1.45
0.0724
59.062
7.94403
102.073
0.07137
- 17.565
0.35931
- 167.823
1.5
0.06466
48.656
7.85198
99.72
0.0715
- 18.187
0.35762
- 170.82
1.55
0.0646
44.563
7.73641
97.503
0.07167
- 18.755
0.36484
- 172.845
1.6
0.06495
39.856
7.63068
95.372
0.07161
- 19.217
0.37158
- 174.751
1.65
0.0657
35.953
7.52257
93.247
0.07165
- 19.614
0.37821
- 176.697
1.7
0.06599
31.949
7.43591
91.089
0.07171
- 20.239
0.38558
- 178.85
1.75
0.0666
28.693
7.31976
88.981
0.07168
- 20.731
0.39036
179.588
1.8
0.06649
25.448
7.22121
86.872
0.07176
- 21.241
0.39732
177.775
1.85
0.06637
22.687
7.11782
84.83
0.07181
- 21.685
0.40211
175.992
1.9
0.06563
19.369
7.01794
82.771
0.07188
- 22.233
0.40749
174.294
1.95
0.06514
15.516
6.91688
80.824
0.07197
- 22.678
0.41306
172.684
2
0.0641
13.294
6.82126
78.739
0.07217
- 23.218
0.41825
170.97
2.05
0.06323
9.843
6.72865
76.797
0.07214
- 23.632
0.42367
169.372
2.1
0.06288
6.976
6.63794
74.849
0.07234
- 24.15
0.42905
167.644
2.15
0.06195
4.218
6.55483
72.888
0.07244
- 24.689
0.43442
166.014
2.2
0.06084
2.075
6.46275
70.939
0.07265
- 25.273
0.43857
164.274
2.25
0.05942
- 0.3
6.37821
69.013
0.07275
- 25.755
0.44419
162.598
2.3
0.05808
- 2.187
6.29055
67.098
0.07295
- 26.316
0.44756
160.879
2.35
0.05526
- 4.038
6.20851
65.179
0.07318
- 26.813
0.45231
159.11
MOTOROLA RF DEVICE DATA
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MMG3002NT1
9
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc.
Table 5. Class A Common Emitter S - Parameters at VCC = 5.2 Vdc, ICC = 110 mA, TC = 255C (continued)
S11
S21
S12
S22
f
GHz
|S11|
∠φ
|S21|
∠φ
|S12|
∠φ
|S22|
∠φ
2.4
0.05338
- 6.096
6.12256
63.315
0.07337
- 27.387
0.45571
157.425
2.45
0.05054
- 7.643
6.04461
61.45
0.07359
- 27.903
0.46063
155.679
2.5
0.04768
- 10.036
5.96594
59.564
0.07386
- 28.462
0.46419
153.884
2.55
0.04494
- 12.811
5.88833
57.733
0.07416
- 29.19
0.4681
152.005
2.6
0.04239
- 14.731
5.81782
55.868
0.07435
- 29.754
0.47249
150.142
2.65
0.0393
- 16.676
5.74121
53.98
0.07445
- 30.312
0.47601
148.126
2.7
0.03707
- 20.889
5.66538
52.04
0.0748
- 31.053
0.47991
146.214
2.75
0.0346
- 21.7
5.59155
50.247
0.07499
- 31.654
0.48371
144.147
2.8
0.03163
- 24.056
5.51967
48.401
0.07519
- 32.344
0.48777
142.183
2.85
0.02869
- 26.756
5.44631
46.54
0.0754
- 33.048
0.49144
140.072
2.9
0.02667
- 28.324
5.37422
44.74
0.07563
- 33.749
0.4961
138.081
2.95
0.02324
- 29.457
5.30336
42.914
0.07577
- 34.431
0.50017
136.001
133.872
3
0.02069
- 34.403
5.23613
41.138
0.07596
- 35.209
0.5054
3.05
0.01861
- 37.625
5.16698
39.322
0.07624
- 35.917
0.50901
131.91
3.1
0.01563
- 41.101
5.09908
37.495
0.07648
- 36.648
0.51431
129.855
3.15
0.01407
- 49.967
5.03148
35.696
0.0766
- 37.389
0.51844
127.844
3.2
0.01296
- 54.052
4.96452
33.935
0.07684
- 38.12
0.52333
125.818
3.25
0.01129
- 59.44
4.89769
32.159
0.07708
- 38.894
0.52814
123.86
3.3
0.01031
- 67.904
4.83271
30.407
0.07721
- 39.663
0.53368
121.891
3.35
0.00977
- 71.657
4.76883
28.702
0.07742
- 40.479
0.53765
120.096
3.4
0.00821
- 77.779
4.707
26.984
0.07764
- 41.116
0.54299
118.206
3.45
0.0076
- 90.054
4.64886
25.288
0.07774
- 41.964
0.54702
116.357
3.5
0.0074
- 97.151
4.59041
23.575
0.07797
- 42.707
0.55121
114.75
3.55
0.00666
- 114.876
4.5319
21.885
0.07819
- 43.538
0.55593
113.11
3.6
0.00749
- 127.171
4.47455
20.231
0.07843
- 44.293
0.55935
111.522
MMG3002NT1
10
MOTOROLA RF DEVICE DATA
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1.7
7.62
0.305 diameter
2.49
3.48
5.33
1.27
1.27
2.54
0.58
0.86
Freescale Semiconductor, Inc.
0.64
3.86
Recommended Solder Stencil
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 22. Recommended Mounting Configuration
MOTOROLA RF DEVICE DATA
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MMG3002NT1
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Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc.
NOTES
MMG3002NT1
12
MOTOROLA RF DEVICE DATA
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Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc.
NOTES
MOTOROLA RF DEVICE DATA
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MMG3002NT1
13
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc.
NOTES
MMG3002NT1
14
MOTOROLA RF DEVICE DATA
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PACKAGE DIMENSIONS
3
4
4.70
4.40
A
1.87
1.79
0.15 M C A B
0.60
0.40
B
2X R0.15 TYP
Freescale Semiconductor, Inc.
1.70
1.40
3
4
2.70
2.40
2X 4° TYP
4.50
3.70
1.30
0.70
5
1
2
2X
3
0.20 M C B
0.48
0.38
0.48
0.38
0.15 M C A B
0.58
0.48
0.46
0.40
0.15 M C A B
2X 4 ° TYP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.5MM PER END. DIMENSION DOES
NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED 0.5MM PER SIDE.
4. DIMENSIONS ARE DETERMINED AT THE OUTMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING
ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
E.P.
2X R0.20
4X
0.10 C
SEATING PLANE
0.65
0.55
1.35
1.25
C
1.50
1.50
1.65
1.55
STYLE 1:
PIN 1. RF INPUT
2. GROUND
3. RF OUTPUT
CASE 1514 - 01
ISSUE A
SOT - 89
PLASTIC
MOTOROLA RF DEVICE DATA
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BOTTOM VIEW
MMG3002NT1
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Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc.
Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright
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