5x7mm Precision TCXO Model D75F - Connor

Available at Digi-Key
www.digikey.com
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
5x7mm
Precision TCXO
Model D75F
Description:
Features:
The Connor-Winfield’s D75F is a 5x7mm
Surface Mount Temperature Compensated
Crystal Controlled Oscillator (TCXO) with a
Tri-State LVCMOS output. Through the use of
Analog Temperature Compensation, the D75F
is capable of holding sub 1-ppm stabilities over
the 0 to 70°C temperature range.
• 3.3 Vdc Operation
• LVCMOS Output
• Frequency Stability: ± 0.50 ppm
• Temperature Range: 0 to 70°C
• Low Jitter <1ps RMS
• Tri-State Enable/Disable Function
• 5x7mm Surface Mount Package
• Tape and Reel Packaging
• RoHS Compliant / Pb Free
D7
5
27 F 11
4
.0
MH 4
Z
Absolute Maximum Ratings
Parameter
Storage Temperature
Supply Voltage (Vcc)
Input Voltage
Minimum
Nominal
Maximum
Units
-55
-0.5
-0.5
-
-
-
85
6.0
Vcc+0.5
°C
Vdc
Vdc
Maximum
Units
Notes
Operating Specifications
Parameter
Minimum
Nominal Frequency (Fo)
Frequency Calibration @ 25 °C
Frequency Stability vs. Temperature
Frequency vs. Load Stability
Frequency vs. Voltage Stability
Static Temperature Hysteresis
Aging Operating Temperature Range:
Supply Voltage (Vcc)
Supply Current (Icc)
Period Jitter
Integrated Phase Jitter
SSB Phase Noise ( Fo = 19.44 MHz)
@ 10Hz offset
@ 100Hz offset
@ 1KHz offset
@ 10KHz offset
@ 100KHz offset
Start-up Time
Nominal
- 13.0, 19.44, 25.0 or 27.0
-1.0
-
-0.5
-
-0.2
-
-0.2
-
-
-
-1.0
-
0
-
3.135
3.3
-
-
-
3
-
0.5
-
-
-
-
-
-
-
1.0
0.5
0.2
0.2
0.4
1.0
70
3.465
6
5
1.0
-80
-110
-135
-150
-150
-
-
-
-
-
-
10
Notes
MHz
ppm 1
ppm 2
ppm ±5%
ppm ±5%
ppm 3
ppm/year
°C
Vdc ±5%
mA
ps rms
ps rms 4
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
ms
Enable / Disable Input Characteristics (Pad 8)
Parameter
Minimum
Enable Voltage (High)
Disable Voltage (Low)
Nominal
Maximum
70%Vcc
-
-
-
30%Vcc
Units
Notes
Vdc
Vdc
5
5
LVCMOS Output Characteristics
Parameter
Load
Voltage (High) (Voh)
(Low)
(Vol)
Duty Cycle at 50% of Vcc Rise / Fall Time 10% to 90% Minimum
Nominal
Maximum
-
90%Vcc
-
45
-
15
-
-
50
-
-
-
10%Vcc
55
8
Units
Notes
pF
Vdc
Vdc
%
ns
6
Package Characteristics
Package
Vibration:
Shock: Soldering Process;
Notes:
Bulletin
Page
Revision
Date
Tx237
1 of 2
03
03 Dec 2013
Hermetically sealed crystal mounted on a ceramic package
Environmental Characteristics
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
RoHS compliant lead free. See soldering profile on page 2.
Ordering Information
D75F-13.0M, D75F-19.44M, D75F-25.0M or D57F-027.0M
1. Initial calibration @ 25°C. Specifications at time of shipment after 48 hours of operation.
2. Frequency stability vs. change in temperature. [±(Fmax - Fmin)/(2*Fo)].
3. Frequency change after reciprocal temperature ramped over the operating range. Frequency measured before and after at 25°C.
4. BW = 12 KHz to 20 MHz.
5. Leave Pad 8 unconnected if enable / disable function is not required. When tri-stated, the output stage is disabled but the oscillator and compensation circuit are still active (current consumption < 1 mA).
6. For best performance it is recommended that the circuit connected to this output should have an equivalent input capacitance of 15pF.
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
Package Layout
Suggested Pad Layout
0.079 Max.
(2.0mm)
0.276 ±0.006
(7.0mm)
0.295
(7.49mm)
Keep Out Area
8
0.025(6 Places)
(0.635mm)
1
0.030
(0.762mm)
(4 Places)
2
10
4
260°C
220°C
180°C
150°C
120°C
0
10 s
Up to 120 s
60 to 90 s
Typical
Typical
Meets IPC/JEDEC J-STD-020C
9
10
4
1
2
3
0.051
(1.28mm)
5
8
0.038
(0.965mm)
(4 Places)
5
0.100
(2.54mm)
Bottom
View
Temperature
260°C
6
Top View
0.215
(5.46mm)
0.040
(1.02mm)
(6 Places)
3
7
9
0.037
(0.94mm)
Pin 1
1:
2:
3:
4:
5:
6:
7:
8:
9:
10:
0.051
(1.28mm)
0.030
(0.76mm)
0.197
±0.006
(5.0mm)
D75F 1144
27.0 MHZ
Pad Connections
7
6
Dimensional Tolerance:
±.005 (.127mm)
±.02 (.508mm)
0.100
(2.54mm)
* Do not route any traces in the keep out area. It is
recommended the next layer under the keep out
area is to be ground plane.
Design Recommendations
Vcc, should have
a large copper
area for reduced
inductance.
Connect a 0.01uF
bypass capacitor
<0.1”(2.54mm)
from the pad.
8
5
10
4
1
3
Ground,
should have
a large copper
area for reduced
inductance.
Top View
OSC
Output Waveform
50 Ohm trace
<1”by design
Vcc
0.010”(0.254mm)
Recommended
clearance
inductance
for internal
copper flood.
6
9
Do Not Connect
Do Not Connect
Do Not Connect
Ground
Output
Do Not Connect
Do Not Connect
Tri-State Enable / Disable
Supply Voltage Vcc
N/C
Buffer
Ground
Top View
1V/Div
Ground
Test Circuit
50 Ohm Trace
Without Output
Vias
Buffer
DNC
TOP LAYER
GROUND LAYER
1
.......
N/C
DNC DNC
2
3
10
4
9
5
Ground
Vcc
Supply
Voltage
BOTTOM LAYER
Attention: To achieve optimal frequency stability, and in some cases to meet the specification stated on this data
sheet, it is required that the circuit connected to this TCXO output must have the equivalent input capacitance
that is specified by the nominal load capacitance. Deviations from the nominal load capacitance will have a
graduated effect on the stability of approximately 20 ppb per pF load difference.
8
7
Output
6
15 pF
0.1 uF
Bypass
10 nF
Bypass
Enable/ DNC DNC
Disable
DNC = Do Not Connect
Tape and Reel Dimensions
Solder Profile
Temperature
PIN 1
260°C
260°C
220°C
180°C
.69
150°C
(17.5mm)
8.46 DIA
(216mm DIA)
.08
(2.0mm)
.31
.08
120°C
(7.9mm)
(2.0mm)
.21
(5.4mm)
0
9.84 DIA
(250mm DIA)
.157
(4.0mm)
.08
(2.0mm)
3.15
(80mm)
.315
(8.0mm)
Direction
Of
Feed
(Customer)
.06 DIA
(1.5mm DIA)
Meets IPC/JEDEC J-STD-020C
Bulletin
1.00 DIA
(25mm DIA)
Page
.295 (7.5mm)
MEETS EIA-481A and EIAJ-1009B
2,000 PCS/REEL
10 s
Up to 120 s
60 to 90 s
Typical
Typical
.07 (1.75mm)
.83 (16.0mm)
Specifications subject to change without notification. See Connor-Winfield's website for latest revision. All dimensions in inches.
© Copyright 2014 The Connor-Winfield Corporation Not intended for life support applications.
Revision
Date
Tx237
2 of 2
03
03 Dec 2013