UT54LVDS032LVE - Aeroflex Microelectronic Solutions

Standard Products
UT54LVDS032LV/E Low Voltage Quad Receiver
Data Sheet
October, 2012
www.aeroflex.com/lvds
FEATURES
INTRODUCTION
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The UT54LVDS032LV Quad Receiver is a quad CMOS
differential line receiver designed for applications requiring
ultra low power dissipation and high data rates. The device is
designed to support data rates in excess of 400.0 Mbps (200
MHz) utilizing Low Voltage Differential Signaling (LVDS)
technology.
>400.0 Mbps (200 MHz) switching rates
+340mV differential signaling
3.3 V power supply
TTL compatible outputs
Cold spare all pins
Ultra low power CMOS technology
1.9ns maximum propagation delay
200ps maximum differential skew
Operational environment; total dose irradiation testing to
MIL-STD-883 Method 1019
- Total-dose: 300 krad(Si) and 1Mrad(Si)
- Latchup immune (LET > 100 MeV-cm2/mg)
 Packaging options:
- 16-lead flatpack (dual in-line)
 Standard Microcircuit Drawing 5962-98652
- QML Q and V compliant part
 Compatible with ANSI/TIA/EIA-644 Standard
The UT54LVDS032LV accepts low voltage (340mV)
differential input signals and translates them to 3V CMOS
output levels. The receiver supports a three-state function that
may be used to multiplex outputs. The receiver also supports
OPEN, shorted and terminated (100 ) input fail-safe. Receiver
output will be HIGH for all fail-safe conditions.
The UT54LVDS032LV and companion quad line driver
UT54LVDS031LV provides new alternatives to high power
pseudo-ECL devices for high speed point-to-point interface
applications.
All pins have Cold Spare buffers. These buffers will be high
impedance when VDD is tied to VSS.
RIN1+
+
RIN1-
R1
ROUT1
R2
ROUT2
R3
ROUT3
R4
ROUT4
-
RIN2+
+
RIN2-
-
RIN3+
+
RIN3-
-
RIN4+
+
RIN4-
-
EN
EN
Figure 1. UT54LVDS032LV Quad Receiver Block Diagram
1
APPLICATIONS INFORMATION
RIN1-
1
16
RIN1+
2
3
15
RIN4-
14
RIN4+
ROUT4
EN
ROUT1
4
5
EN
UT54LVDS032LV
Receiver
VDD
RIN2+
6
13
12
11
RIN2-
7
10
RIN3+
VSS
8
9
RIN3-
ROUT2
The UT54LVDS032LV receiver’s intended use is primarily in
an uncomplicated point-to-point configuration as is shown in
Figure 3. This configuration provides a clean signaling
environment for quick edge rates of the drivers. The receiver is
connected to the driver through a balanced media which may
be a standard twisted pair cable, a parallel pair cable, or simply
PCB traces. Typically, the characteristic impedance of the media
is in the range of 100. A termination resistor of 100should
be selected to match the media and is located as close to the
receiver input pins as possible. The termination resistor converts
the current sourced by the driver into voltages that are detected
by the receiver. Other configurations are possible such as a
multi-receiver configuration, but the effects of a mid-stream
connector(s), cable stub(s), and other impedance
discontinuities, as well as ground shifting, noise margin limits,
and total termination loading must be taken into account.
ROUT3
Figure 2. UT54LVDS032LV Pinout
TRUTH TABLE
ENABLE
Enables
Input
Output
EN
EN
RIN+ - RIN-
ROUT
L
H
X
Z
VID > 0.1V
H
VID < -0.1V
L
Full Fail-safe
OPEN/SHORT or
Terminated
H
All other combinations
of ENABLE inputs
DATA
INPUT
Name
Description
2, 6, 10, 14
RIN+
Non-inverting receiver input pin
1, 7, 9, 15
RIN-
Inverting receiver input pin
3, 5, 11, 13
ROUT
Receiver output pin
4
EN
Active high enable pin, OR-ed
with EN
12
EN
Active low enable pin, OR-ed
with EN
16
VDD
Power supply pin, +3.3 + 0.3V
8
VSS
Ground pin
RT 100
+
-
DATA
OUTPUT
1/4 UT54LVDS031LV
Figure 3. Point-to-Point Application
The UT54LVDS032LV differential line receiver is capable of
detecting signals as low as 100mV, over a + 1V common-mode
range centered around +1.2V. This is related to the driver offset
voltage which is typically +1.2V. The driven signal is centered
around this voltage and may shift +1V around this center point.
The +1V shifting may be the result of a ground potential
difference between the driver’s ground reference and the
receiver’s ground reference, the common-mode effects of
coupled noise or a combination of the two. Both receiver input
pins should honor their specified operating input voltage range
of 0V to +2.4V (measured from each pin to ground).
PIN DESCRIPTION
Pin No.
1/4 UT54LVDS032LV
2
2. Terminated Input. If the driver is disconnected (cable
unplugged), or if the driver is in a three-state or poweroff condition, the receiver output will again be in a
HIGH state, even with the end of cable 100
termination resistor across the input pins. The
unplugged cable can become a floating antenna which
can pick up noise. If the cable picks up more than 10mV
of differential noise, the receiver may see the noise as
a valid signal and switch. To insure that any noise is
seen as common-mode and not differential, a balanced
interconnect should be used. Twisted pair cable offers
better balance than flat ribbon cable.
Receiver Fail-Safe
The UT54LVDS032LV receiver is a high gain, high speed
device that amplifies a small differential signal (20mV) to TTL
logic levels. Due to the high gain and tight threshold of the
receiver, care should be taken to prevent noise from appearing
as a valid signal.
The receiver’s internal fail-safe circuitry is designed to source/
sink a small amount of current, providing fail-safe protection
(a stable known state of HIGH output voltage) for floating,
terminated or shorted receiver inputs.
1. Open Input Pins. The UT54LVDS032LV is a quad
receiver device, and if an application requires only 1, 2
or 3 receivers, the unused channel(s) inputs should be
left OPEN. Do not tie unused receiver inputs to ground
or any other voltages. The input is biased by internal
high value pull up and pull down resistors to set the
output to a HIGH state. This internal circuitry will
guarantee a HIGH, stable output state for open inputs.
3. Shorted Inputs. If a fault condition occurs that shorts
the receiver inputs together, thus resulting in a 0V
differential input voltage, the receiver output remains
in a HIGH state. Shorted input fail-safe is not supported
across the common-mode range of the device (VSS to
2.4V). It is only supported with inputs shorted and no
external common-mode voltage applied.
3
OPERATIONAL ENVIRONMENT
PARAMETER
LIMIT
UNITS
Total Ionizing Dose (TID)
1.0E6
rad(Si)
Single Event Latchup (SEL)
>100
MeV-cm2/mg
Neutron Fluence1
1.0E13
n/cm2
Notes:
1. Guarnteed but not tested.
ABSOLUTE MAXIMUM RATINGS1
(Referenced to VSS)
SYMBOL
PARAMETER
LIMITS
VDD
DC supply voltage
VI/O
Voltage on any pin during operation
-0.3 to (VDD + 0.3V)
Voltage on any pin during cold spare
-.3 to 4.0V
TSTG
-0.3 to 4.0V
Storage temperature
-65 to +150C
PD
Maximum power dissipation
1.25 W
TJ
Maximum junction temperature2
+150C
Thermal resistance, junction-to-case3
10C/W
DC input current
±10mA
JC
II
Notes:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability and performance.
2. Maximum junction temperature may be increased to +175C during burn-in and life test.
3. Test per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
VDD
Positive supply voltage
3.0 to 3.6V
TC
Case temperature range
-55 to +125C
VIN
DC input voltage, receiver inputs
DC input voltage, logic inputs
4
2.4V
0 to VDD for EN, EN
DC ELECTRICAL CHARACTERISTICS* 1
(VDD = 3.3V + 0.3V; -55C < TC < +125C); Unless otherwise noted, Tc is per the temperature range ordered
SYMBOL
PARAMETER
CONDITION
MIN
MAX
VIH
High-level input voltage
(TTL)
VIL
Low-level input voltage
(TTL)
0.8
V
VOL
Low-level output voltage
IOL = 2mA, VDD = 3.0V
0.25
V
VOH
High-level output voltage
IOH = -0.4mA, VDD = 3.0V
2.7
IIN
Logic input leakage current
Enables = EN/EN = 0 and 3.6V,
VDD = 3.6
-10
+10
A
II
Receiver input Current
VIN = 2.4V
-15
+15

Cold Spare Leakage Current
VIN=3.6V, VDD=VSS
-20
+20

VTH3
Differential Input High Threshold
VCM = +1.2V
+100
mV
VTL3
Differential Input Low Threshold
VCM = +1.2V
-100
IOZ3
Output Three-State Current
Disabled, VOUT = 0 V or VDD
-10
VCL
Input clamp voltage
ICL = +18mA
-1.5
Output Short Circuit Current
Enabled, VOUT = 0 V2
-15
ICC3
Supply current, receivers enabled
EN, EN = VDD or VSS
Inputs Open
ICCZ3
Supply current, receivers disabled
EN = VSS, EN = VDD
Inputs Open
ICS
IOS2, 3
2.0
UNIT
V
V
mV
+10

V
-130
mA
15
mA
mA
4
Notes:
* For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25oC per MIL-STD-883 Method 1019, Condition
A up to the maximum TID level procured.
1. Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground.
2. Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not exceed
maximum junction temperature specification.
3. Guaranteed by characterization.
5
AC SWITCHING CHARACTERISTICS1, 2, 3
(VDD = +3.3V + 0.3V, TC = -55 C to +125 C); Unless otherwise noted, Tc is per the temperature range ordered
SYMBOL
PARAMETER
MIN
MAX
UT54LVDS032LV
MIN
MAX
UNIT
UT54LVDS032LVE
tPHLD
Differential Propagation Delay High to Low
(figures 4 and 5)
1.0
4.0
1.0
1.9
ns
tPLHD
Differential Propagation Delay Low to High
(figures 4 and 5)
1.0
4.0
1.0
1.9
ns
tSKD
Differential Skew (tPHLD - tPLHD) (figures 4 and 5)
0
350
0
210
ps
tSK1
Channel-to-Channel Skew1 (figures 4 and 5)
0
500
0
200
ps
tSK2
Chip-to-Chip Skew5 (figures 4 and 5)
3.0
0.9
ns
tTLH4
Rise Time (figures 4 and 5)
1.2
1.2
ns
tTHL4
Fall Time (figures 4 and 5)
1.2
1.2
ns
tPHZ
Disable Time High to Z (figures 6 and 7)
12
3.8
ns
tPLZ
Disable Time Low to Z (figures 6 and 7)
12
3.8
ns
tPZH
Enable Time Z to High (figures 6 and 7)
12
3.8
ns
tPZL
Enable Time Z to Low (figures 6 and 7)
12
3.8
ns
Notes:
* For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25oC per MIL-STD-883 Method 1019,
Condition A up to the maximum TID level procured.
1. Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs.
2. Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z0 = 50, tr and tf (0% - 100%) < 1ns for RIN and tr and tf < 1ns for EN or EN.
3. CL includes probe and jig capacitance.
4. Guaranteed by characterization.
5. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
6
RIN+
Generator
RIN-
R
ROUT
40pF
50
50
Receiver Enabled
Figure 4. Receiver Propagation Delay and Transition Time Test Circuit or Equivalent Circuit
RIN-
+1.3V
0V Differential
VID = 200mV
+1.2V
+1.1V
RIN+
tPHLD
tPLHD
VOH
80%
80%
50%
50%
ROUT
20%
20%
VOL
tTHL
tTLH
Figure 5. Receiver Propagation Delay and Transition Time Waveforms
7
VDD
EN
2K
RIN+
RIN-
40pf
100
Figure 6. Receiver Three-State Delay Test Circuit or Equivalent Circuit
EN when EN = VDD
1.5V
VDD
1.5V
0V
VDD
1.5V
1.5V
EN when EN = VSS
0V
tPZL
tPLZ
Output when
VID = -100mV
Output when
VID = +100mV
50%
0.5V
VOZ
VOL
tPHZ
tPZH
0.5V
VOH
50%
VOZ
Figure 7. Receiver Three-State Delay Waveform
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PACKAGING
Figure 8. 16-pin Ceramic Flatpack
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ORDERING INFORMATION
UT54LVDS032LV/E QUAD RECEIVER:
UT54************- * *
* * *
Lead Finish:
(A) = Hot solder dipped
(C) = Gold
(X) = Factory option (gold or solder)
Screening:
(C) = HiRel Temperature Range flow
(P) = Prototype flow
Package Type:
(U) = 16-lead Flatpack (dual-in-line)
Access Time:
Not applicable
Device Type:
LVDS032LV LVDS Receiver
LVDS032LVE LVDS Receiver Enhanced AC’s
Notes:
1. Lead finish (A,C, or X) must be specified.
2. If an “X” is specified when ordering, then the part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3. Prototype flow per Aeroflex Manufacturing Flows Document. Tested at 25C only. Lead finish is GOLD ONLY. Radiation neither
tested nor guaranteed.
4. HiRel Temperature Range flow per Aeroflex Manufacturing Flows Document. Devices are tested at -55C, room temp, and 125C.
Radiation neither tested nor guaranteed.
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UT54LVDS032LV /E QUAD RECEIVER: SMD
5962 - 98652
** * * *
Lead Finish:
(A) = Hot solder dipped
(C) = Gold
(X) = Factory Option (gold or solder)
Case Outline:
(Y) = 16 lead Flatpack (dual-in-line)
Class Designator:
(Q) = QML Class Q
(V) = QML Class V
Device Type
02 = LVDS Receiver, 300k, 500k and 1M Rad(Si)
03 = LVDS Receiver, 100k Rad(Si)
04 = LVDS Receiver with enhanced ACs, 300K, 500K and 1Mrad(Si)
05 = LVDS Receiver with enhanced ACs, 100Krad(Si)
Drawing Number: 5962-98652
Total Dose
(R) = 1E5 rad(Si)
(F) = 3E5 rad(Si)
(G) = 5E5 rad(Si)
(H) = 1E6 rad(Si)
Federal Stock Class Designator: No Options
Notes:
1.Lead finish (A,C, or X) must be specified.
2.If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3.Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening.
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Aeroflex Colordo Springs - Datasheet Definition
Advanced Datasheet - Product In Development
Preliminary Datasheet - Shipping Prototype
Datasheet - Shipping QML & Reduced Hi-Rel
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Aeroflex Colorado Springs, Inc. reserves the right to make
changes to any products and services herein at any time
without notice. Consult Aeroflex or an authorized sales
representative to verify that the information in this data sheet
is current before using this product. Aeroflex does not assume
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use of any product or service described herein, except as
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