NESG2021M05 Data Sheet

A Business Partner of Renesas Electronics Corporation.
NESG2021M05
Data Sheet
NPN SiGe RF Transistor for Low Noise, High-Gain Amplification
Flat-Lead 4-Pin Thin-Type Super Minimold (M05)
•
•
•
ORDERING INFORMATION
Part Number
Order Number
NESG2021M05
NESG2021M05-A
NESG2021M05-T1
NESG2021M05-T1-A
Quantity
Supplying Form
Flat-lead 4-pin thintype supper minimold
(M05, 2012 PKG)
(Pb-Free)
50 pcs
(Non reel)
3 kpcs/reel
• 8 mm wide embossed taping
• Pin 3 (Collector), Pin 4
(Emitter) face the perforation
side of the tape
To order evaluation samples, please contact your nearby sales office.
Unit sample quantity is 50 pcs.
NT
Remark
Package
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Symbol
VCBO
VCEO
VEBO
IC
Ptot Note
Tj
Tstg
SC
O
Parameter
Collector to Base Voltage
Collector to Emitter Voltage
Emitter to Base Voltage
Collector Current
Total Power Dissipation
Junction Temperature
Storage Temperature
Note:
Ratings
13.0
5.0
1.5
35
175
150
−65 to +150
Unit
V
V
V
mA
mW
°C
°C
Mounted on 1.08 cm2 × 1.0 mm (t) glass epoxy PCB
DI
<R>
This device is an ideal choice for low noise, high-gain at low current amplifications.
NF = 0.9 dB TYP., Ga = 18.0 dB TYP. @ VCE = 2 V, IC = 3 mA, f = 2 GHz
NF = 1.3 dB TYP., Ga = 10.0 dB TYP. @ VCE = 2 V, IC = 3 mA, f = 5.2 GHz
Maximum stable power gain: MSG = 22.5 dB TYP. @ VCE = 3 V, IC = 10 mA, f = 2 GHz
High breakdown voltage technology for SiGe Tr. adopted: VCEO (absolute maximum ratings) = 5.0 V
Flat-lead 4-pin thin-type super minimold (M05) package
IN
U
•
ED
FEATURES
R09DS0034EJ0300
Rev. 3.00
Jun 20, 2012
CAUTION
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 1 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
ELECTRICAL CHARACTERISTICS (TA = +25°C)
Symbol
ICBO
IEBO
hFE Note 1
fT
S21e
NF
Noise Figure (2)
NF
Associated Gain (1)
Ga
Associated Gain (2)
Ga
Reverse Transfer Capacitance
Maximum Stable Power Gain
Gain 1 dB Compression Output
Power
3rd Order Intermodulation
Distortion Output Intercept
Point
2
Cre Note 2
MSG Note 3
PO (1 dB)
OIP3
Test Conditions
MIN.
TYP.
MAX.
Unit
VCB = 5 V, IE = 0
VEB = 1 V, IC = 0
VCE = 2 V, IC = 5 mA
−
−
130
−
−
190
100
100
260
nA
nA
−
VCE = 3 V, IC = 10 mA, f = 2 GHz
VCE = 3 V, IC = 10 mA, f = 2 GHz
VCE = 2 V, IC = 3 mA, f = 2 GHz,
ZS = ZSopt, ZL = ZLopt
VCE = 2 V, IC = 3 mA, f = 5.2 GHz,
ZS = ZSopt, ZL = ZLopt
VCE = 2 V, IC = 3 mA, f = 2 GHz,
ZS = ZSopt, ZL = ZLopt
VCE = 2 V, IC = 3 mA, f = 5.2 GHz,
ZS = ZSopt, ZL = ZLopt
VCB = 2 V, IE = 0, f = 1 MHz
VCE = 3 V, IC = 10 mA, f = 2 GHz
VCE = 3 V, IC = 12 mA, f = 2 GHz,
ZS = ZSopt, ZL = ZLopt
VCE = 3 V, IC = 12 mA, f = 2 GHz,
ZS = ZSopt, ZL = ZLopt
20
17.0
−
25
19.0
0.9
−
−
1.2
GHz
dB
dB
−
1.3
−
dB
15.0
18.0
−
dB
−
10.0
−
dB
−
20.0
−
0.1
22.5
9.0
0.2
−
−
pF
dB
dBm
−
17.0
−
dBm
ED
Parameter
DC Characteristics
Collector Cut-off Current
Emitter Cut-off Current
DC Current Gain
RF Characteristics
Gain Bandwidth Product
Insertion Power Gain
Noise Figure (1)
IN
U
<R>
3. MSG =
hFE CLASSIFICATION
FB/YFB
T1G
130 to 260
SC
O
Rank
Marking
hFE Value
DI
<R>
S21
S12
NT
Notes: 1. Pulse measurement: PW ≤ 350 μs, Duty Cycle ≤ 2%
2. Collector to base capacitance when the emitter grounded
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 2 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
100
25
50
75
100
125
Ambient Temperature TA (˚C)
100
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
VCE = 1 V
0.1
0.01
0.001
0.6
0.7
0.8
0.9
100
1.0
4
6
8
10
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
VCE = 2 V
10
1
0.1
0.01
0.001
0.0001
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Base to Emitter Voltage VBE (V)
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
35
VCE = 3 V
10
1
0.1
0.01
0.001
0.0001
0.4
2
Base to Emitter Voltage VBE (V)
DI
Collector Current IC (mA)
100
0
Collector to Base Voltage VCB (V)
SC
O
0.5
0.1
NT
1
0.0001
0.4
150
Collector Current IC (mA)
10
0.2
f = 1 MHz
IN
U
50
0.3
ED
175
150
Reverse Transfer Capacitance Cre (pF)
Mounted on Glass Epoxy PCB
(1.08 cm2 × 1.0 mm (t) )
200
0
Collector Current IC (mA)
REVERSE TRANSFER CAPACITANCE
vs. COLLECTOR TO BASE VOLTAGE
0.5
0.6
0.7
0.8
0.9
1.0
Base to Emitter Voltage VBE (V)
Collector Current IC (mA)
Total Power Dissipation Ptot (mW)
250
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
200 μ A
180 μ A
160 μ A
140 μ A
120 μ A
30
25
20
100 μ A
15
80 μ A
60 μ A
10
40 μ A
5
0
IB = 20 μ A
1
2
3
4
5
6
Collector to Emitter Voltage VCE (V)
Remark The graph indicates nominal characteristics.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 3 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
1 000
100
10
0.1
1
10
100
10
0.1
100
IN
U
VCE = 3 V
1
10
NT
DC Current Gain hFE
10
0.1
1
Collector Current IC (mA)
DC CURRENT GAIN vs.
COLLECTOR CURRENT
100
VCE = 2 V
100
Collector Current IC (mA)
1 000
DC CURRENT GAIN vs.
COLLECTOR CURRENT
ED
VCE = 1 V
DC Current Gain hFE
DC Current Gain hFE
1 000
DC CURRENT GAIN vs.
COLLECTOR CURRENT
10
100
Collector Current IC (mA)
DI
SC
O
Remark The graph indicates nominal characteristics.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 4 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
20
15
10
5
0
1
10
25
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
VCE = 2 V
f = 2 GHz
20
15
10
5
0
1
100
VCE = 3 V
f = 2 GHz
20
15
10
5
0
1
10
100
VCE = 2 V
IC = 10 mA
MSG
MAG
|S21e|2
10
5
0
0.1
30
MSG
25
20
15
MAG
|S21e|2
10
5
0
0.1
1
10
100
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
SC
O
15
VCE = 1 V
IC = 10 mA
35
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
25
20
40
Frequency f (GHz)
35
30
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
Collector Current IC (mA)
DI
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
40
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
1
10
100
Frequency f (GHz)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
25
100
Collector Current IC (mA)
NT
Gain Bandwidth Product fT (GHz)
30
10
IN
U
Collector Current IC (mA)
ED
25
30
VCE = 1 V
f = 2 GHz
Gain Bandwidth Product fT (GHz)
Gain Bandwidth Product fT (GHz)
30
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
40
VCE = 3 V
IC = 10 mA
35
30
MSG
25
20
15
MAG
|S21e|2
10
5
0
0.1
1
10
100
Frequency f (GHz)
Remark The graph indicates nominal characteristics.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 5 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
25
VCE = 1 V
f = 1 GHz
MSG
MAG
20
|S21e|2
15
10
5
0
1
10
100
30
VCE = 1 V
f = 2 GHz
25
MSG
20
15
|S21e|2
10
5
0
1
Collector Current IC (mA)
MAG
15
|S21e|
5
0
1
2
10
25
VCE = 1 V
f = 5 GHz
20
15
MAG
10
5
100
|S21e|2
0
–5
1
10
100
Collector Current IC (mA)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 2 V
f = 1 GHz
MSG
20
MAG
|S21e|2
15
10
5
0
1
10
100
Collector Current IC (mA)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Collector Current IC (mA)
DI
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN, MAG
vs. COLLECTOR CURRENT
NT
10
100
IN
U
MSG
20
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
VCE = 1 V
f = 3 GHz
SC
O
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
25
10
Collector Current IC (mA)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
MAG
ED
30
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 2 V
f = 2 GHz
MSG
MAG
20
15
|S21e|2
10
5
0
1
10
100
Collector Current IC (mA)
Remark The graph indicates nominal characteristics.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 6 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
25
VCE = 2 V
f = 3 GHz
MSG
20
MAG
15
10
|S21e|2
5
0
1
10
100
INSERTION POWER GAIN, MAG
vs. COLLECTOR CURRENT
30
VCE = 2 V
f = 5 GHz
25
20
MAG
15
10
|S21e|2
5
0
1
|S21e|2
15
5
0
1
10
VCE = 3 V
f = 2 GHz
25
100
MSG
MAG
20
15
|S21e|2
10
5
0
1
10
100
Collector Current IC (mA)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG
vs. COLLECTOR CURRENT
30
25
VCE = 3 V
f = 3 GHz
MSG
MAG
20
15
|S21e|
10
2
5
0
1
10
100
Collector Current IC (mA)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Collector Current IC (mA)
DI
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
30
NT
10
IN
U
20
MAG
100
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
25
MSG
SC
O
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
VCE = 3 V
f = 1 GHz
10
Collector Current IC (mA)
Collector Current IC (mA)
30
ED
30
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 3 V
f = 5 GHz
20
MAG
15
10
|S21e|2
5
0
1
10
100
Collector Current IC (mA)
Remark The graph indicates nominal characteristics.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 7 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
40
15
10
30
5
20
IC
–5
–25
–20
–15
–10
10
–5
0
0
Pout
30
5
10
0
–5
–20
–15
10
30
5
20
IC
–20
–15
–10
–5
0
5
0
OUTPUT POWER, COLLECTOR
CURRENT vs. INPUT POWER
IN
U
40
20
Output Power Pout (dBm)
50
Collector Current IC (mA)
VCE = 3 V, f = 3 GHz
Icq = 12 mA (RF OFF)
Pout
–5
–25
–10
Input Power Pin (dBm)
OUTPUT POWER, COLLECTOR
CURRENT vs. INPUT POWER
0
20
IC
15
VCE = 3 V, f = 5.2 GHz
Icq = 12 mA (RF OFF)
10
–5
0
0
Input Power Pin (dBm)
30
5
–5
–20
20
IC
0
–15
–10
–5
50
40
Pout
10
NT
Output Power Pout (dBm)
15
40
10
Input Power Pin (dBm)
20
50
10
0
Collector Current IC (mA)
0
VCE = 3 V, f = 2 GHz
Icq = 12 mA (RF OFF)
Collector Current IC (mA)
20
OUTPUT POWER, COLLECTOR
CURRENT vs. INPUT POWER
ED
Pout
50
Output Power Pout (dBm)
15
VCE = 3 V, f = 1 GHz
Icq = 12 mA (RF OFF)
Collector Current IC (mA)
Output Power Pout (dBm)
20
OUTPUT POWER, COLLECTOR
CURRENT vs. INPUT POWER
0
5
Input Power Pin (dBm)
DI
SC
O
Remark The graph indicates nominal characteristics.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 8 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
25
5
4
20
3
15
2
10
NF
1
4
20
3
15
2
10
NF
1
0
0
100
10
1
20
15
2
10
1
1
10
Noise Figure NF (dB)
15
2
10
5
NF
1
0
100
10
Collector Current IC (mA)
Collector Current IC (mA)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
VCE = 1 V
f = 5.2 GHz
Ga
12
14
14
12
12
10
10
8
8
6
6
4
4
NF
2
DI
2
0
20
3
0
1
10
0
100
Collector Current IC (mA)
Noise Figure NF (dB)
14
30
25
Ga
4
1
0
100
SC
O
0
5
NF
VCE = 2 V
f = 2 GHz
NT
3
IN
U
Ga
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
5
Noise Figure NF (dB)
25
6
Associated Gain Ga (dB)
Noise Figure NF (dB)
30
Associated Gain Ga (dB)
VCE = 1 V
f = 2 GHz
4
0
100
Collector Current IC (mA)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
5
5
10
Collector Current IC (mA)
6
25
VCE = 2 V
f = 5.2 GHz
Ga
14
12
10
10
8
8
6
6
4
4
NF
2
0
1
Associated Gain Ga (dB)
0
5
Ga
30
2
10
Associated Gain Ga (dB)
1
VCE = 2 V
f = 1 GHz
Associated Gain Ga (dB)
Ga
6
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
ED
Noise Figure NF (dB)
5
30
Noise Figure NF (dB)
VCE = 1 V
f = 1 GHz
Associated Gain Ga (dB)
6
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
0
100
Collector Current IC (mA)
Remark The graph indicates nominal characteristics.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 9 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
30
25
4
20
3
15
2
10
1
0
5
NF
1
0
100
10
VCE = 3 V
f = 2 GHz
Ga
4
25
20
3
15
2
10
1
0
NF
1
NT
Noise Figure NF (dB)
5
30
Associated Gain Ga (dB)
6
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
IN
U
Collector Current IC (mA)
ED
Ga
5
Noise Figure NF (dB)
VCE = 3 V
f = 1 GHz
Associated Gain Ga (dB)
6
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
5
0
100
10
Collector Current IC (mA)
SC
O
14
VCE = 3 V
f = 5.2 GHz
Noise Figure NF (dB)
12
10
Ga
14
12
10
8
8
6
6
4
4
DI
2
0
1
NF
10
2
Associated Gain Ga (dB)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
0
100
Collector Current IC (mA)
Remark The graphs indicate nominal characteristics.
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 10 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
S-PARAMETERS
S-parameters and noise parameters are provided on our web site in a form (S2P) that enables direct import of the
parameters to microwave circuit simulators without the need for keyboard inputs.
Click here to download S-parameters.
[Products] → [RF Devices] → [Device Parameters]
SC
O
NT
IN
U
ED
URL http://www.renesas.com/products/microwave/
DI
<R>
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 11 of 12
A Business Partner of Renesas Electronics Corporation.
NESG2021M05
PACKAGE DIMENSIONS
FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M05, 2012 PKG) (UNIT: mm)
(Top View)
(Bottom View)
2.05±0.1
IN
U
1
4
0.30+0.1
–0.05
T1G
2
(1.05)
3
(0.65)
0.65
1.30
2.0±0.1
ED
1.25±0.1
0.59±0.05
0.11+0.1
–0.05
0.5
NT
PIN CONNENTION
1. Base
2. Emitter
3. Collector
4. Emitter
SC
O
Remark ( ) : Reference value
DI
<R>
R09DS0034EJ0300 Rev. 3.00
Jun 20, 2012
Page 12 of 12
Revision History
NESG2021M05 Data Sheet
Description
Rev.
−
3.00
Date
Mar 2003
Jun 20, 2012
Page
−
Summary
Previous No. : PU10188EJ02V0DS
p.1
Modification of ORDERING INFORMATION
p.2
Modification of ELECTRICAL CHARACTERISTICS
ED
Modification of hFE CLASSIFICATION
Modification of S-PARAMETERS
Modification of PACKAGE DIMENSIONS
DI
SC
O
NT
IN
U
p.11
p.12
All trademarks and registered trademarks are the property of their respective owners.
C-1