μPG2301T5L

GaAs HBT INTEGRATED CIRCUIT
PG2301T5L
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POWER AMPLIFIER FOR BluetoothTM Class 1
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DESCRIPTION
The PG2301T5L is GaAs HBT MMIC for power amplifier which were developed for Bluetooth Class 1.
This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed
in a 12-pin plastic TSQFN package. And this package is able to high-density surface mounting.
FEATURES
: fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.)
• Supply voltage
: VCC1, 2 = Vbias = 2.7 to 3.6 V (3.3 V TYP.)
• Control voltage
: Vcont = 0 to 3.6 V (2.5 V TYP.)
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• Operation frequency
: Venable = 0 to 3.1 V (2.9 V TYP.)
• Circuit current
: ICC = 120 mA TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
• Maximum power
V,
: Pout (MAX.) = +23 dBm TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 2.5 V, Venable = 2.9
Pin = +4 dBm
• Gain Control Range
: GCR = 23 dB TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 0 to 2.5 V, Venable = 2.9 V,
• Power gain
: GP = 23 dB TYP. (Reference value)
Pin = +4 dBm
• High efficiency
: PAE = 50% TYP. (Reference value)
• Shut down function
• High-density surface mounting : 12-pin plastic TSQFN package (2.0  2.0  0.37 mm)
APPLICATIONS
• Power Amplifier for Bluetooth Class 1 etc.
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ORDERING INFORMATION
Part Number
Order Number
Package
Marking
PG2301T5L-E2
PG2301T5L-E2-A
12-pin plastic TSQFN
2301
(Pb-Free)
Note
Supplying Form
 Embossed tape 8 mm wide
 Pin 10, 11, 12 face the perforation side of the tape
 Qty 3 kpcs/reel
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
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your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: PG2301T5L-A
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PG10559EJ01V0DS (1st edition)
Date Published April 2005 CP(K)
 NEC Compound Semiconductor Devices, Ltd. 2005
PG2301T5L
PIN CONNECTIONS
Pin Name
1
GND (NC)
2
GND
3
OUT/VCC2
4
GND (NC)
5
Venable
6
Vbias
7
VCC1
8
GND
9
IN
10
GND (NC)
11
Vcont
12
GND (NC)
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Pin No.
ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified)
Parameter
Supply Voltage
Symbol
Ratings
Unit
VCC1, 2
5.5
V
3.6
V
ICC
400
mA
Icont
0.5
mA
Vbias
Control Voltage
Vcont
Venable
Circuit Current
Control Current
Ienable
Power Dissipation
PD
700
Note
mW
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Pin
+10
dBm
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Operating Ambient Temperature
Input Power
Note Mounted on double-sided copper-clad 50  50  1.6 mm epoxy glass PWB, TA = +85C
RECOMMENDED OPERATING RANGE (T A = +25C)
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Parameter
Operating Frequency
Supply Voltage
Control Voltage
Symbol
MIN.
TYP.
MAX.
Unit
fopt
2 400
2 450
2 500
MHz
VCC1, 2
2.7
3.3
3.6
V
Vcont
0
2.5
3.6
V
Venable
0
2.9
3.1
Vbias
ELECTRICAL CHARACTERISTICS
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Data Sheet PG10559EJ01V0DS
PG2301T5L
(T A = +25C, VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz, External input and output matching, unless
otherwise specified)
Parameter
Circuit Current
Symbol
ICC
Test Conditions
MIN.
TYP.
MAX.
Unit
Vcont = 2.5 V, Venable = 2.9 V,
110
120
130
mA
Pin = +4 dBm
Ishut down
Vcont = 2.5 V, Venable = 0 V,

Pin = +4 dBm
Output Power 1
Pout1
Vcont = 2.5 V, Venable = 2.9 V,
+21
Output Power 2
Pout2
Vcont = 0 V, Venable = 2.9 V,
Pin = +4 dBm
Gain Control Range
GCR
Vcont = 0 to 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
1.0
A
+23
+24.5
dBm
UE
Pin = +4 dBm
0.1
D
Shut Down Current

0
+1
dBm
20
23

dB
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STANDARD CHARACTERISTICS FOR REFERENCE
(T A = +25C, VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz, External input and output matching, unless
otherwise specified)
Parameter
Efficiency
Symbol
PAE
Test Conditions
Vcont = 2.5 V, Venable = 2.9 V,
MIN.
TYP.
MAX.
Unit

50

%

23

dB

19

dB
Pin = +4 dBm
Power Gain1
GP1
Vcont = 2.5 V, Venable = 2.9 V,
Pin = 5 dBm
Power Gain2
GP2
Vcont = 2.5 V, Venable = 2.9 V,
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Pin = +4 dBm
Data Sheet PG10559EJ01V0DS
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PG2301T5L
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EVALUATION CIRCUIT (VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz)
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The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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Data Sheet PG10559EJ01V0DS
PG2301T5L
PACKAGE DIMENSIONS
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12-PIN PLASTIC TSQFN (UNIT: mm)
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Remark ( ) : Reference value
Data Sheet PG10559EJ01V0DS
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PG2301T5L
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Wave Soldering
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260C or below
: 120C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350C or below
: 3 seconds or less
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Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
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Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet PG10559EJ01V0DS
WS260
: 10 seconds or less
Preheating temperature (package surface temperature)
Soldering time (per side of device)
IR260
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Peak temperature (package surface temperature)
Time at peak temperature
Partial Heating
Condition Symbol
UE
Infrared Reflow
Soldering Conditions
HS350
PG2301T5L
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the
following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
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1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
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• Do not lick the product or in any way allow it to enter the mouth.
Data Sheet PG10559EJ01V0DS
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