BIPOLAR ANALOG INTEGRATED CIRCUIT PC2745TB,PC2746TB 3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The PC2745TB and PC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile communications. These low current amplifiers operate on 3.0 V (1.8 V MIN.). These ICs are manufactured using our 20 GHz fT NESATIII silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability. FEATURES • Supply voltage : Recommended VCC = 2.7 to 3.3 V Circuit operation VCC = 1.8 to 3.3 V • Upper limit operating frequency : PC2745TB; fu = 2.7 GHz TYP.@3 dB bandwidth PC2746TB; fu = 1.5 GHz TYP.@3 dB bandwidth : PC2745TB; ISL = 38 dB TYP.@f = 500 MHz PC2746TB; ISL = 45 dB TYP.@f = 500 MHz : PC2745TB; GP = 12 dB TYP.@f = 500 MHz PC2746TB; GP = 19 dB TYP.@f = 500 MHz : PC2745TB; PO(sat) = 1 dBm TYP.@f = 500 MHz PC2746TB; PO(sat) = 0 dBm TYP.@f = 500 MHz • High isolation • Power gain • Saturated output power • High-density surface mounting : 6-pin super minimold package (2.0 1.25 0.9 mm) APPLICATIONS • 1.5 GHz to 2.5 GHz communication system : PC2745TB • 800 MHz to 900 MHz communication system : PC2746TB ORDERING INFORMATION Part Number PC2745TB-E3-A Package Marking 6-pin super minimold C1Q Supplying Form • Embossed tape 8 mm wide • 1, 2, 3 pins face the perforation side of the tape PC2746TB-E3-A C1R • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC2745TB-A, PC2746TB-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PU10443EJ01V0DS (1st edition) (Previous No. P11511EJ3V0DS00) Date Published November 2003 CP(K) The mark shows major revised points. PC2745TB,PC2746TB PIN CONNECTION Pin No. Marking is an example of PC2745TB Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC PRODUCT LINE-UP (T A = +25C, VCC = 3.0 V, ZS = ZL = 50 ) Part No. PC2745T fu PO(sat) GP NF ICC (GHz) (dBm) (dB) (dB) (mA) 2.7 1.0 12 6.0 7.5 PC2745TB PC2746T 1.5 0 19 4.0 7.5 1.8 7.0 12 3.3 5.0 6-pin minimold C1R 6-pin minimold C1S 6-pin super minimold 0.2 to 1.5 3.5 19 2.8 6.0 PC2748TB PC2749T C1Q 6-pin super minimold PC2747TB PC2748T 6-pin minimold Making 6-pin super minimold PC2746TB PC2747T Package 6-pin minimold C1T 6-pin super minimold 2.9 6.0 16 4.0 PC2749TB 6.0 6-pin minimold C1U 6-pin super minimold Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Caution The package size distinguish between minimold and super minimold. SYSTEM APPLICATION EXAMPLE DIGITAL CELLULAR SYSTEM BLOCK DIAGRAM Data Sheet PU10443EJ1V0DS 2 PC2745TB,PC2746TB PIN EXPLANATION Pin No. 1 Pin Name Applied Pin Voltage (V) Voltage Note (V) 0.87 INPUT Function and Applications Internal Equivalent Circuit Signal input pin. A internal matching circuit, configured with resistors, enables 0.82 50 connection over a wide band. this pin must be coupled to signal source with capacitor for DC cut. 2 GND 0 Ground pin. This pin should be connected 3 to system ground with minimum 5 inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 4 OUTPUT 1.95 Signal output pin. A internal matching circuit, configured with resistors, enables 2.54 50 connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. 6 VCC 2.7 to 3.3 Power supply pin. This pin should be externally equipped with bypass capacity to minimize ground impedance. Note Pin voltage is measured at VCC = 3.0 V. Above: PC2745TB, Below: PC2746TB 3 Data Sheet PU10443EJ1V0DS PC2745TB,PC2746TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C 4.0 V Circuit Current ICC TA = +25C 16 mA Power Dissipation PD TA = +85C 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin 0 dBm Note TA = +25C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Supply Voltage Symbol VCC MIN. TYP. MAX. Unit 2.7 3.0 3.3 V ELECTRICAL CHARACTERISTICS (T A = +25C, VCC = 3.0 V, ZS = ZL = 50 , unless otherwise specified) PC2745TB Parameter Symbol PC2746TB Test Conditions Unit MIN. TYP. MAX. MIN. TYP. MAX. 5.0 7.5 10.0 5.0 7.5 10.0 mA Circuit Current ICC No signal Power Gain GP f = 500 MHz 9 12 14 16 19 21 dB Noise Figure NF f = 500 MHz 6.0 7.5 4.0 5.5 dB 3 dB down below 2.3 2.7 1.1 1.5 GHz Upper Limit Operating Frequency fu from gain at f = 0.1 GHz Isolation ISL f = 500 MHz 33 38 40 45 dB Input Return Loss RLin f = 500 MHz 8 11 10 13 dB Output Return Loss RLout f = 500 MHz 2.5 5.5 5.5 8.5 dB Saturated Output Power PO(sat) f = 500 MHz, 4.0 1.0 3.0 0 dBm Pin = 6 dBm Data Sheet PU10443EJ1V0DS 4 PC2745TB,PC2746TB STANDARD CHARACTERISTICS FOR REFERENCE (T A = +25C, VCC = 3.0 V, ZS = ZL = 50 ) Parameter Symbol Test Conditions Reference Value Unit PC2745TB PC2746TB Circuit Current ICC VCC = 1.8 V, No signal 4.5 4.5 mA Power Gain GP VCC = 3.0 V, f = 1.0 GHz 12.0 18.5 dB VCC = 3.0 V, f = 2.0 GHz 11.0 VCC = 1.8 V, f = 0.5 GHz 7.0 14.0 VCC = 3.0 V, f = 1.0 GHz 5.5 4.2 VCC = 3.0 V, f = 2.0 GHz 5.7 VCC = 1.8 V, f = 0.5 GHz 8.0 5.0 VCC = 1.8 V, 3 dB down below from gain at f = 0.1 GHz 1.8 1.1 GHz VCC = 3.0 V, f = 1.0 GHz 33 38 dB VCC = 3.0 V, f = 2.0 GHz 30 VCC = 1.8 V, f = 0.5 GHz 35 37 VCC = 3.0 V, f = 1.0 GHz 13.0 10.0 VCC = 3.0 V, f = 2.0 GHz 14.0 VCC = 1.8 V, f = 0.5 GHz 6.5 10.0 VCC = 3.0 V, f = 1.0 GHz 6.5 8.5 VCC = 3.0 V, f = 2.0 GHz 8.5 VCC = 1.8 V, f = 0.5 GHz 6.0 9.5 VCC = 3.0 V, f = 1.0 GHz, Pin = 6 dBm 2.5 1.0 VCC = 3.0 V, f = 2.0 GHz, Pin = 6 dBm 3.5 VCC = 1.8 V, f = 0.5 GHz, Pin = 10 dBm 11.0 8.0 Noise Figure Upper Limit NF fu dB Operating Frequency Isolation Input Return ISL RLin Loss Output Return RLout Loss Saturated PO(sat) Output Power VCC = 3.0 V, Pout = 10 dBm, f1 = 500 MHz, f2 = 502 MHz 30.0 26.0 Intermodulation VCC = 1.8 V, Pout = 20 dBm, f1 = 500 MHz, f2 = 502 MHz 31.0 37.0 Distortion VCC = 3.0 V, Pout = 10 dBm, f1 = 1 000 MHz, f2 = 1 002 MHz 26.0 3rd Order 5 IM3 Data Sheet PU10443EJ1V0DS dB dB dBm dBc PC2745TB,PC2746TB TEST CIRCUIT EXAMPLE OF APPLICATION CIRCUIT The application circuits and their parameters are for references only and are not intended for use in actual design-ins. CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, fc = 1/(2RC). Data Sheet PU10443EJ1V0DS 6 PC2745TB,PC2746TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD COMPONENT LIST Value C 1 000 pF For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC (P11976E). 7 Data Sheet PU10443EJ1V0DS PC2745TB,PC2746TB TYPICAL CHARACTERISTICS (T A = +25C, unless otherwise specified) PC2745TB Remark The graphs indicate nominal characteristics. Data Sheet PU10443EJ1V0DS 8 PC2745TB,PC2746TB PC2745TB Remark 9 The graphs indicate nominal characteristics. Data Sheet PU10443EJ1V0DS PC2745TB,PC2746TB SMITH CHART (T A = +25C, VCC = 3.0 V) PC2745TB S11-FREQUENCY S22-FREQUENCY Data Sheet PU10443EJ1V0DS 10 PC2745TB,PC2746TB S-PARAMETERS 11 Data Sheet PU10443EJ1V0DS PC2745TB,PC2746TB TYPICAL CHARACTERISTICS (T A = +25C, unless otherwise specified) PC2746TB Remark The graphs indicate nominal characteristics. Data Sheet PU10443EJ1V0DS 12 PC2745TB,PC2746TB PC2746TB Remark 13 The graphs indicate nominal characteristics. Data Sheet PU10443EJ1V0DS PC2745TB,PC2746TB SMITH CHART (T A = +25C, VCC = 3.0 V) PC2746TB S11-FREQUENCY S22-FREQUENCY Data Sheet PU10443EJ1V0DS 14 PC2745TB,PC2746TB S-PARAMETERS 15 Data Sheet PU10443EJ1V0DS PC2745TB,PC2746TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) Data Sheet PU10443EJ1V0DS 16 PC2745TB,PC2746TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC pin. (4) The DC cut capacitor must be attached to input pin and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow VPS Wave Soldering Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (package surface temperature) : 215C or below Time at temperature of 200C or higher : 25 to 40 seconds Preheating time at 120 to 150C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (pin temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 17 Data Sheet PU10443EJ1V0DS IR260 VP215 WS260 HS350 NOTICE 1. 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