DMP6023LSS A D V A N C E IN F O R M A T IO N Product Summary

DMP6023LSS
60V P-CHANNEL ENHANCEMENT MODE MOSFET
ADVANCE INFORMATION
Product Summary
V(BR)DSS
Features and Benefits
ID max
TA = +25°C
RDS(ON) max
25mΩ @ VGS = -10V
-6.6A
33mΩ @ VGS = -4.5V
-5.8A
-60V

Low On-Resistance

Fast Switching Speed

Low Threshold

Low Gate Drive

Low Input Capacitance



Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description and Applications
Mechanical Data
This MOSFET is designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it

Case: SO-8

Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
ideal for high efficiency power management applications.

Moisture Sensitivity: Level 1 per J-STD-020

Backlighting

Terminal Connections Indicator: See Diagram Below

Power Management Functions


DC-DC Converters
Terminals: Finish  Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208

Weight: 0.074 grams (Approximate)
D
SO-8
Top View
S
D
S
D
S
D
G
D
G
S
TOP VIEW
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMP6023LSS-13
Notes:
Case
SO-8
Packaging
2,500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
8
5
= Manufacturer’s Marking
P6023LS = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Last Digit of Year (ex: 14 = 2014)
WW = Week Code (01 - 53)
P6023LS
YY WW
1
DMP6023LSS
Document number: DS37198 Rev. 2 - 2
4
1 of 6
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January 2015
© Diodes Incorporated
DMP6023LSS
Maximum Ratings (@TA = +25°C unless otherwise specified.)
ADVANCE INFORMATION
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TA = +25°C
TA = +70°C
Continuous Drain Current (Note 6) VGS = -10V
Value
-60
±20
-6.6
-5.3
-50
-1.8
-35.5
62.9
ID
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 6)
Avalanche Current, L = 0.1mH
Avalanche Energy, L = 0.1mH
IDM
IS
IAS
EAS
Units
V
V
A
A
A
A
mJ
Thermal Characteristics (@TA = +25°C unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Symbol
PD
RJA
PD
RJA
RJC
TJ, TSTG
Value
1.2
100
1.6
75
12
-55 to +150
Units
W
°C/W
W
°C/W
°C
Electrical Characteristics (TA = +25°C unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-60
—
—
—
—
—
—
-1
±100
V
µA
nA
VGS = 0V, ID = -250μA
VDS = -60V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
RDS (ON)
-3
25
33
-1.2
mΩ
VSD
—
—
—
-0.7
V
Static Drain-Source On-Resistance
-1
—
—
—
VDS = VGS, ID = -250μA
VGS = -10V, ID = -5A
VGS = -4.5V, ID = -4A
VGS = 0V, IS = -1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
—
—
—
—
—
—
—
—
—
—
—
—
—
2569
179
143
8
26.5
53.1
7.1
12.6
6
7.1
110
62
20
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
nS
Qrr
—
14
—
nC
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -4.5V,)
Total Gate Charge (VGS = -10V),
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
V
Test Condition
VDS = -30V, VGS = 0V,
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = -30V, ID = -5A
VGS = -10V, VDS = -30V,
RG = 3Ω, ID = -5A
IF = -5A, di/dt = 100A/μs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMP6023LSS
Document number: DS37198 Rev. 2 - 2
2 of 6
www.diodes.com
January 2015
© Diodes Incorporated
DMP6023LSS
30
30
Vds=-5.0V
VGS = -3.5V
VGS = -4.0V
20
ID, DRAIN CURRENT (A)
Id , DRAIN CURRENT (A)
25
VGS = -4.5V
VGS = -5.0V
15
VGS = -10V
10
VGS = -3.0V
TA = 150°C
20
TA = 125°C
15
10
T A = 85°C
TA = 25°C
5
5
VGS = -2.8V
0
0
5
0.03
VGS = -4.5V
0.025
0.02
VGS = -10V
0.015
0.01
0.005
0
0
5
10
15
20
25
I D, DRAIN-SOURCE CURRENT
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0.5
1 1.5
2 2.5 3 3.5 4 4.5
V gs, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
0.05
5
0.2
0.18
0.16
0.14
0.12
0.1
I D = -5.0A
0.08
0.06
I D = -4.0A
0.04
0.02
0
0
30
2
4
6
8 10 12 14 16 18
V GS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristics
20
2
VGS = -4.5V
TA = 150°C
0.04
T A = 125°C
TA = 85°C
0.03
T A = 25°C
0.02
TA = -55°C
0.01
1.8
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RD(SON), Drain-Source On-Resistance ( Ω)
0.035
T A = -55°C
0
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( Ω)
1
2
3
4
V DS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
0.04
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( Ω)
ADVANCE INFORMATION
25
0
0
5
10
15
20
25
ID, DRAIN SOURCE CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DMP6023LSS
Document number: DS37198 Rev. 2 - 2
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VGS = -10V
I D = -10A
1.6
1.4
VGS = -4.5V
1.2
ID = -5.0A
1
0.8
0.6
0.4
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE ( C)
Figure 6 On-Resistance Variation with Temperature
January 2015
© Diodes Incorporated
V GS(TH), GATE THRESHOLD VOLTAGE (V)
R DS(o n), DRAI N-SO URCE O N-RESISTANCE ( )
0.05
0.045
0.04
VGS = -4.5V
I D = -5A
0.035
0.03
VGS = -10V
0.025
I D = -10A
0.02
0.015
0.01
0.005
0
-50
3
2.8
2.6
2.4
2.2
2
1.8
I D = -1mA
I D = -250µA
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-50
50
-25
0
25
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE ( C)
Figure 7 On-Resistance Variation with Temperature
-25
30
10000
f = 1MHz
C T, JUNCTION CAPACI TANCE (pF)
I S, SOURCE CURRENT (A)
25
T A = 150°C
20
TA = 125°C
15
T A = 85°C
10
T A = 25°C
5
C iss
1000
Coss
Crss
T A = -55°C
0
0
100
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
0
1.5
10
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
40
100
9
R DS(on)
Limited
8
ID, DRAIN CURRENT (A)
-VGS, GATE-SOURCE VOLTAGE (V)
ADVANCE INFORMATION
DMP6023LSS
7
6
VDS = -30V
5
I D = -5A
4
3
2
DC
PW = 10s
1
PW = 1s
PW = 100ms
PW = 10ms
0.1 TJ(m ax) = 150°C
TA = 25°C
1
0
0
10
5
10 15 20 25 30 35 40 45 50
Q g, TOTAL GATE CHARGE (nC)
Figure 11 Gate-Charge Characteristics
DMP6023LSS
Document number: DS37198 Rev. 2 - 2
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VGS =10V
Single Pulse
0.01 DUT on 1 * MRP Board
0.1
PW = 1ms
PW = 100µs
1
10
V DS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
100
January 2015
© Diodes Incorporated
DMP6023LSS
r(t), TRANSIENT THERMAL RESISTANCE
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
Rthja(t) = r(t) * Rthja
D = 0.005
Rthja = 100°C/W
Duty Cycle, D = t1/ t2
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
0.254
ADVANCE INFORMATION
1
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0°
8°

All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
C1
C2
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
DMP6023LSS
Document number: DS37198 Rev. 2 - 2
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January 2015
© Diodes Incorporated
DMP6023LSS
ADVANCE INFORMATION
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
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failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2015, Diodes Incorporated
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DMP6023LSS
Document number: DS37198 Rev. 2 - 2
6 of 6
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January 2015
© Diodes Incorporated