BCP020B HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP (.25µm x 200µm) The BeRex BCP020B is a GaAs Power pHEMT with a nominal 0.25 micron gate length and 200 micron gate width making the product ideally suited for applications where high-gain and medium power in the 1000 MHz to 26.5 GHz frequency range are required. The product may be used in either wideband (6-18 GHz) or narrow-band applications. The BCP020B is produced using state of the art metallization with SI3N4 passivation and is screened to assure reliability. PRODUCT FEATURES • • • 22.5 dBm Typical Output Power 14 dB Typical Gain @ 12 GHz 0.25 X 200 Micron Recessed Gate APPLICATIONS • • • Commercial Military / Hi-Rel. Test & Measurement ELECTRICAL CHARACTERISTIC (TUNED FOR POWER) Ta = 25° C PARAMETER/TEST CONDITIONS P1dB Output Power @ P1dB (Vds = 8V, Ids = 30mA) G1dB Gain @ P1dB (Vds = 8V, Ids = 30mA) PAE PAE @ P1dB (Vds = 8V, Ids = 30mA) NF Noise figure (Vds = 2V, Ids = 10 mA) Idss Saturated Drain Current (Vgs = 0V, Vds = 2.0V) Gm Transconductance (Vds = 2V, Vgs = 30mA) Vp Pinch-off Voltage (Ids = 0.2mA, Vds = 2V) TEST FREQ. 12 GHZ 18 GHz 12 GHZ 18 GHz 12 GHZ 18 GHz MIN. TYPICAL 21.5 21.5 13 10.5 22.5 23.0 14 11.5 60 53 12 GHz MAX. dBm dB % 0.95 40 60 dB 80 mA 80 -2.5 UNIT mS -1.2 -0.5 V -16 V BVgd Drain Breakdown Voltage (Ig = 0.2mA, source open) -20 BVgs Source Breakdown Voltage (Ig = 0.2mA, drain open) -16 V Rth Thermal Resistance (Au-Sn Eutectic Attach) 160 °C/W www.berex.com BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595 Specifications are subject to change without notice. ©BeRex 2015 Rev. 1.0 JUNE 2015 PRELIMINARY BCP020B MAXIMUM RATING (Ta = 25° C) PARAMETERS Drain-Source Voltage Gate-Source Voltage Drain Current Forward Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation Vds Vgs Ids Igsf Pin Tch Tstg Pt ABSOLUTE 12 V -6 V Idss 11 mA 17 dBm 175° C -60 °C ~ 150 °C 1.0 W CONTINUOUS 8V -3 V Idss 2 mA @ 3dB Compression 150° C -60 °C ~ 150 °C 0.8 W Exceeding any of the above Maximum Ratings will result in reduced MTTF and may cause permanent damage to the device. PIN_POUT/Gain, PAE (12 GHz) Frequency = 12 GHz Vds = 8 V, Ids = 30mA (Tuned for Power) www.berex.com PIN_POUT/Gain, PAE (18 GHz) Frequency = 18 GHz Vds = 8 V, Ids = 30mA (Tuned for Power) BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595 Specifications are subject to change without notice. ©BeRex 2015 Rev. 1.0 JUNE 2015 PRELIMINARY BCP020B S-PARAMETERS (Vds = 8V, Ids = 30mA) FREQ. [GHZ] 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 S11 [MAG] 0.98 0.96 0.93 0.89 0.85 0.81 0.78 0.75 0.71 0.69 0.68 0.69 0.71 0.73 0.76 0.78 0.81 0.84 0.85 0.86 0.86 0.84 0.81 0.89 0.85 0.89 S11 [ANG.] -15.33 -29.62 -43.39 -57.85 -72.29 -86.83 -101.69 -117.22 -134.53 -151.22 -166.86 178.60 166.07 154.72 145.32 137.40 131.09 125.87 121.95 117.92 113.37 109.40 106.28 101.64 101.76 96.43 S21 [MAG] 5.59 5.40 5.27 5.09 4.93 4.77 4.57 4.42 4.21 3.99 3.74 3.52 3.30 3.12 2.90 2.72 2.53 2.37 2.20 2.03 1.86 1.70 1.57 1.43 1.30 1.16 S21 [ANG.] 167.26 156.17 145.59 135.33 125.32 115.11 105.46 95.53 85.27 75.58 66.45 57.14 48.68 40.03 31.79 23.43 15.85 8.14 0.22 -7.06 -14.70 -21.88 -28.89 -34.52 -40.33 -46.90 S12 [MAG] 0.009 0.018 0.024 0.033 0.038 0.042 0.046 0.048 0.050 0.051 0.052 0.052 0.052 0.052 0.052 0.052 0.052 0.055 0.056 0.057 0.059 0.060 0.060 0.063 0.061 0.057 S12 [ANG.] 75.00 75.88 68.06 62.01 55.68 50.82 45.26 40.41 35.08 29.36 27.10 21.77 17.85 15.96 11.38 12.18 8.41 6.66 2.97 0.91 -1.28 -3.56 -5.39 -7.25 -7.26 -7.12 S22 [MAG] 0.83 0.82 0.81 0.80 0.78 0.75 0.74 0.70 0.67 0.64 0.60 0.57 0.53 0.49 0.46 0.41 0.39 0.35 0.34 0.34 0.34 0.36 0.39 0.40 0.48 0.52 S22 [ANG.] -3.74 -7.84 -12.17 -14.97 -17.39 -20.40 -23.11 -26.22 -28.35 -31.10 -33.54 -37.43 -41.42 -46.90 -52.79 -61.81 -72.42 -85.05 -102.44 -119.89 -135.98 -148.53 -161.96 -169.82 178.83 165.12 Note: S-parameters include bond wires. Reference planes are at edge of substrates shown on “Wire Bonding Information” figure below. www.berex.com BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595 Specifications are subject to change without notice. ©BeRex 2015 Rev. 1.0 JUNE 2015 PRELIMINARY BCP020B WIRE BONDING INFORMATION Using 1 mil. diameter, Au bonding wires. 1. Gate to input transmission line - Length and Height : 600 µm x 250 µm - Number of wire(s): 1 2. Drain to output transmission line - Length and Height : 400 µm x 250 µm - Number of wire(s) : 1 3. Source to ground plate - Length and Height : 250 µm x 300 µm - Number of wire(s) : 4 DISCLAIMER BEREX RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. BEREX DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY BEREX PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES WITHOUT THE EXPRESS WRITTEN APPROVAL OF BEREX. 1. Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.berex.com BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595 Specifications are subject to change without notice. ©BeRex 2015 Rev. 1.0 JUNE 2015 PRELIMINARY